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Qualcomm's CES unveilings include Snapdragon 800 and 600, provides up to 2.3GHz quad-core, 4K video - due mid-2013
CES 2013 - Alright, Qualcomm - settle down, you're blowing me away here, ok? Most people expected Qualcomm to release the Snapdragon S5 at CES, but it looks like that won't be happening.
Don't be upset, though, because we still have some new chips to get all hot and bothered over - with the new SoCs arriving as the Snapdragon 600 and 800. These new SoCs will be baked into future high-end smart devices, such as Smart TVs, smartphones and tablets. We should expect the new Snapdragon 600 and 800 SoCs in the next three-to-six months, with both of the new chips sporting some pretty incredible specifications.
The Snapdragon 800 is claiming that it is 75% faster than the Snapdragon S4 Pro, which is quite the claim. If we do see these types of performance gains, it'll be thanks to a shift to 28nm HPm (High Performance for mobile) fabrication process, an upgraded Hexagon V5 digital signal processor, a shift over to 800MHz LPDDR3 memory which should compete against the PC-like bandwidth that Samsung will enjoy with Exynos 5, an all-new Krait 400 architecture which will offer clock speeds ramping up to 2.3GHz and an all-new Adreno 330 GPU that will sport double the computer power.
CES 2013 - Intel is currently using the Atom processor in the performance market of smartphones, and is deciding to push into the value market for emerging markets with the new Atom Z2420 processor and platform. It was codenamed "Lexington" and Intel joked about how you might have seen some info in leaks.
Acer, Lava, and Safaricom have announced designs based upon the new processor and platform. "The addition of the low-power Atom platform enables Intel to address new market segments and further rounds out our expanding portfolio of smartphone offerings," said Bell.
It has the normal features: HyperThreading, support for two cameras, and dual SIMs. It will deliver two times the performance of the current Z2460 platform.
CES 2013 - This is a huge rumor right now, and I'm just the messenger so holster your weapons, please. According to FanlessTech's sources, NVIDIA could unveil their first desktop SoC (system on a chip) at CES.
NVIDIA's "Project Denver" could be announced, with multiple reference designs to be shown off tomorrow night, reports FanlessTech. I would not be surprised, and I've said it before that NVIDIA should enter the desktop CPU game in some form - it's one of the biggest markets right now.
Does this news surprise you? Excite you? Personally, it excites me - I think years from now the CPU as we know it will be vastly different, as they're already doing so now - APUs and the such. A SoC that could be built into a motherboard would only cost $20-$50 (in that range) more and could give users a huge upgrade in terms of graphics performance out-of-the-box.
A leaked Intel image late last year seemed to detail plans to reduce the power consumption of the existing Ivy Bridge chips down to a 10W TDP. Intel has finally confirmed that these chips are coming and they say they will be talking more about these at CES 2013, where at we will get the full scoop.
"Limited SKUs" of Ivy Bridge will be rated at 10W, which means it will be able to use less than that during most use. This is an important metric as current Ivy Bridge CPUs are rated only as low as 17W, which is 70 percent higher. These new low-power chips will enable Ivy Bridge chips to be used in smaller and lighter devices, such as tablets and super-thin Ultrabooks.
The current 17W crop of chips are already used in the MacBook Air and many different Ultrabooks. A lower-powered chip will enable longer battery life in these same machines. Haswell will also be talked about at CES because it is coming later this year and will offer even greater power savings.
NVIDIA's next mobile processor the Tegra 4 (codenamed Wayne) has been leaked and it packs a punch powerful enough to possibly deliver a knock out punch to its Snapdragon rival.
Built on a 28nm process, the Tegra 4 will feature a 72 core graphics setup which will be able to support a resolution of 2,560 x 1600 with 1080p output at 120Hz.
Unfortunately the Tegra 4 will not see a gain in CPU cores, as it will be keeping the current 4+1 setup. A move to ARM's new Cortex-A15 is all but certain though. One major improvement is the move to USB 3.0 and will be NVIDIA's first mobile chip to do so. Rounding things out is dual channel DDR3L memory which will definitely speed things up. Expect release sometime in early 2013.
Thanks to a new leaked lineup that VR-Zone has gotten their hands on, we should expect no less than 14 different Haswell CPUs from Intel next year. Intel's next-generation of CPUs will be yet another socket, meaning that your existing motherboards will have to be departed if you wish to upgrade. This new socket will be Socket 1150.
The new motherboards will need to sport a Lynx Point chipset in order to support the new Haswell-based offerings. Intel are set to launch six new standard CPUs and eight low-power CPUs. The best of the best will be the Core i7-4770K which will sport four cores with hyper-threading, all churning away at 3.5GHz. Turbo Boost will be on offer to boost the cores up to 3.9GHz, with 8MB of cache backing it up. Intel HD 4600 graphics will be included, with a 1250MHz clock speed.
There will only be one other K series chip in the new Intel Haswell Socket 1150 lineup will be the Core i5 variant, the Core i5-4670K. This chip will be a quad-core chip, sans Hyper-Threading. It will be clocked at 3.4GHz with Turbo Boost up to 3.8GHz. The Core i5-4670K will also have Intel HD 4600 graphics, but have a very slight reduction in speed to 1200MHz.
Next year is going to be a huge year for smartphones, we should see a next-gen iPhone, Galaxy S IV, Nexus device and many others. Intel is hoping to be a much bigger player in the market and wants to shift from their 32nm technology to 22nm.
Intel are already powering some smartphones, such as Motorola's RAZR i, but they haven't taken much more of the market pie just yet. One of the problems right now is the power consumption numbers, which can't compete with ARM counterparts.
Intel's TriGate technology uses three-dimensional transistor structures that are built to save critical space on the chip, and increase efficiency. Intel have claimed that a 22% to 65% performance increase will be at play when their 22nm chips are compared to their current 32nm offerings.
Intel is getting a lot of press this morning. The latest in the line of news regarding the big blue chip maker is that Intel is completely denying rumors that they are heading to a BGA-only, socketless design for Broadwell and beyond. Intel says that they will support socketed CPUs for the "foreseeable future."
Of course, that's a bit vague, and it's vague on purpose. This way they can recant their statement later if they do decide to go to BGA only by saying it was beyond the foreseeable future. However, the good news here is that the rumor of Broadwell being BGA only should be completely dispelled.
"Intel remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the foreseeable future for our customers and the Enthusiast DIY market," Intel spokesman Daniel Snyder told Maximum PC. "However, Intel cannot comment on specific long-term product roadmap plans at this time, but will disclose more details later per our normal communication process."
VR-Zone China got their hands on what appears to be a legitimate leaked road map detailing Intel's rumored lower power Ivy Bridge CPUs. The new processors are expected to come in the first quarter of 2013, so we may even see a showing of the new processors at Intel's CES booth or press conference.
Let's start with the bottom chip, as seen above. It will come with the Pentium branding and will feature a max TDP of 10W. Sporting 2 cores and 2 threads, the model will not make use of Turbo Boost or HyperThreading and it only features 2MB of L3 cache. The included graphics are just "Intel HD Graphics."
Moving up the line, they have one Core i3 offering in the form of the i3-3229Y, which is a 13W TDP part. It will feature HyperThreading and will come in a dual-core model clocked at 1.4GHz. One of the two i5 offerings, the i5-3339Y, is a dual-core, HyperThreading part that comes clocked at 1.5GHz, with a max Turbo Boost of 2GHz.
The i5-3439Y is similar, with the only difference being a higher max Turbo Speed of 2.3GHz. Finally, the i7 model, i7-3669Y, will start at the same 1.5GHz, but will Turbo all the way to 2.6GHz, all while remaining within that 13W TDP envelope. It will also come with 4MB of L3 cache.
All of the parts feature a 7W Scenario Design Power, meaning that they will draw only 7W if kept at a cooler 80*C. The TDP is calculated with a processor temperature of 105*C, the highest the chip is allowed to achieve.
When we first reported on the story of Intel moving away from socketed CPUs in 2014, most people were worried - myself included. But I did sit back and think about it in the aftermath of posting the news, and wondered if AMD would use this chance to make a move on the CPU market. Well, they have, where The Tech Report has received a nice note from AMD's Chris Hook:
AMD has a long history of supporting the DIY and enthusiast desktop market with socketed CPUs & APUs that are compatible with a wide range of motherboard products from our partners. That will continue through 2013 and 2014 with the "Kaveri" APU and FX CPU lines. We have no plans at this time to move to BGA only packaging and look forward to continuing to support this critical segment of the market.