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OCWorkbench have managed to get their mits on a yet to be released processor from AMD as a member of their Athlon X2 family, with the most notable aspect of it being its energy efficiency. It appears to be based on a refined 65nm process with a TDP of just 45W (compared to the 65W of current variants).
This chip looks to be a member of their upcoming BE-2xxx series, with the exact model number reported by CPU-Z as the BE-2350, operating at 2.1GHz (10.5x multi). It is also said that the usual "Athlon 64 X2" branding will be dropped for this family, in replacement for "Athlon X2 Dual Core". Why they'd chosen to drop '64' out of the branding in favour of 'dual core' is anyone's guess. Having 'X2' in the name already refers to the chip as being a dual-core variant.
This processor also gets away with running at a mere 1.15V to get the job done, very low indeed. For further information head over to OCWorkbench.
AMD BE-2350 CPU-Z shown @ OCWORKBENCH. Still based on 65nm design, this CPU has a lower TDP of only 45W. From the CPU-Z screen using v1.39 and v1.40. This CPU is recognised as Athlon 64 X2 Dual Core Processor BE-2350. It runs at a multiplier of 10.5x and bus speed is at 200MHz. HT is at 1GHz. The amt. of cache is also shown on the screen shot. voltage is 1.152v
From what we gathered, AMD is also changing its branding of this new processors, the BE-2XXX series. They won't be called Athlon 64 X2. Instead it will be known as Athlon X2 Dual Core. The "64" is dropped. No reasons were given for dropping the "64"
Intel's much anticipated P35 mainstream desktop chipset (formerly codenamed "Bearlake") officially makes it into Intel's lineup today.
One of the biggest highlights about the introduction of this new chipset is that it will be the first to open the doors to DDR3 memory; Though some P35 boards will be designed to take DDR2 as well, making the upgrade step a little less-costly at first.
Aside from the much higher ceiling DDR3 memory is destined to bring us, the chipset itself carries support for a 1333MHz system bus, an obvious memory controller revamp which also introduces a new feature dubbed "Fast Memory Access", this basically optimizes the latency characteristics of the memory controller hub.
Last but not least, Intel have added a new southbridge to this family in the ICH9R. This southbridge brings support for 6 SATA ports (with Intel's Matrix Storage RAID technology and "Turbo Memory" support for Microsoft's Vista ReadyBoost feature), and an increase of USB ports to a total of 12.
An IGP based (G33) variant will also surface, essentially the same only with the inclusion of Intel's integrated Graphics Media Accelerator 3100 which sports "Clear Video" technology, this supposedly assisting with enhanced high-definition video processing tasks.
Co-inciding with the launch there is a bit of coverage surfacing around the web. You can check it all out below :-
Motherboard chipset technology isn't refreshed at the same fevered pitch that processors, memory or IO products are. A CPU or GPU speed-bump is like low-lying fruit relatively speaking, but chipset enhancements can usher in a whole host of stability, interoperability and verification challenges. Let's face it, when the product is the basis for a platform foundation, forward migrations can be painful if not carefully planned, so the upside benefits need to be worth-while for both the end customer as well as the manufacturer.
If you asked us a year ago, what Intel's path to a higher bandwidth system bus and memory access was, we might have told you serial links from the CPU to the Northbridge and serial FBDIMM technology on the system memory. Of course, that would have been almost completely misguided, since obviously Intel is still pushing hard on their now aging legacy front side bus architecture, with only a hint of a serially connected CPU architecture on the horizon. In addition, though serial FBDIMMs have taken hold in the server market, where high density memory configurations benefit from the technology's intrinsic signal integrity advantages under multi-drop loads; it won't be showing up in consumer desktop volumes any time soon.
Scythe have just released a second version of their Katana CPU cooler, this of course carrying several improvements over the first-gen model such as unique sloping shaped heatsink fins to provide better performance, a superior heatpipe arrangement and an easier installation process.
Scythe Co., Ltd (Tokyo, Japan) announces Katana 2 CPU Cooler, the 2nd generation of the former value-for-money CPU Cooler, Katana CPU Cooler, to the market. This version "2" comes with total 3 heatpipes, unique sloping shaped heatsink fins to provide a better performance than the previous model. Installation is much easier than the previous model, and the default fan is the Scythe original "Kaze Jyu 100mm Fan" to maximize the cooling performance yet maintain the high level of silence. Try this improved version of Katana CPU Cooler to fight against your CPU heat!
AMD have kicked off a new mobile chipset today dubbed the M690. Designed for Turion 64 X2 dual-core processors, this platform incorporates an integrated Radeon X1200 GPU with DVI and HDMI, as well as enhanced power saving features.
To learn more about it have a read of the official PR on AMD's website.
Sunnyvale, Calif. -- 28th March 2007 --AMD (NYSE: AMD) today announced the availability of the AMD M690 chipset. Together with AMD Turion 64 X2 dual-core mobile technology, the new AMD M690 motherboard GPU technology further advances the mobile computing experience. The new platform enables leading global OEMs to design notebook PCs that provide users with better graphics and connectivity performance, increased energy efficiency for extended battery life and extraordinary overall value.
"With AMD's graphics engine expertise and our mobile processor leadership, AMD delivers a cohesive mobile platform for commercial and consumer customers that demand the Windows Vista Premium experience on the go," said Phil Eisler, corporate vice president and general manager, AMD Chipset Division. "AMD CPU and GPU technologies work in tandem to deliver increased battery life for mobile workers and consumers who demand a superior graphics and multimedia experience wherever the road takes them."
A new CPU cooler has surfaced from Thermaltake recently, and what a perculiar looking one it is.
Dubbed the V1, Thermaltake designed it with three main things in mind; Performance, silence and appearance. You can get the full rundown on it here folks.
Thermaltake, the world's leading manufacturer of high-end PC chassis, high-efficiency power supply and CPU cooling solution, today announced the next generation of ultra-high performance CPU cooler, V1. Designed for outmost thermal efficiency while minimizing the overall noise output to provide unprecedented computing environment and comfort. V1 will support all mainstream and high performance processors (Intel LGA775 and AMD Socket AM2/940/939/754).
"It's easy to design a nice looking cooler, a silent cooler, or a high performance cooler," said Eric Chuang, senior manager of Thermaltake thermal division. "It's very difficult to integrate all 3 elements in one cooler, that's why it took us 8 month to develop V1 which is a fusion of performance, silence and appearance".
As mentioned here a short while ago, AMD have kicked off a new breed of IGP based motherboards, these being the 690 series available in two variants.
Slowly but surely coverage is starting to hit the web with benchmarks and comparison tests, as per the links below (i'll make sure to update it as more related coverage surfaces).
With no major processor architecture updates in the immediate future and their DX10-capable graphics solutions still a few months away, the new AMD seems to be slowly picking up slack as we roll through the first two thirds of Q1 '07. Today, AMD is officially introducing their first new chipset since the ATI acquisition, the AMD 690G/V Series. Comprised of an RS690 Northbridge and SB600 Southbridge, the 690 series chipset's goal is to provide a full-featured motherboard backed by a solid integrated graphics solution, thanks to an integrated ATI Radeon x1250 with AVIVO support. What makes the 690G unique, at this point, is its support for VGA and DVI or HDMI, depending on the model, which enables the chipset to be attractive to both business and multimedia users looking for a quality video experience. With its integrated Radeon x1250 clocked at 400MHz and the ability to share up to 1GB of system memory, AMD looks to provide a versatile board that can fill a multitude of needs at a competitive price point.
Word from OCZ today lets us know of a new beefy heatsink on offer dubbed the "Vindicator Premium". The design of this puppy resembles that of the tower-style Ninja from Scythe with its side mounted 120mm fan and six copper heat pipes.
For all the details on it head over to OCZ's website where the press material resides.
Sunnyvale, CA-February 20, 2007-OCZ Technology Group, Inc. a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the OCZ Vindicator CPU cooler, an enthusiast-grade thermal solution for the latest high performance processors. The Vindicator can be used as a passive or active cooler depending on the needs of the enthusiast.
The OCZ Vindicator can effectively cool some CPUs passively thanks to a pure copper base plate and six copper heat pipe design that rapidly transfers heat away from the processor up to the dense, high-stacked fin array where the thermal load is quickly dissipated. In fanless mode, the Vindicator efficiently, yet silently offloads heat. For extreme overclocking, enthusiasts can simply attach the included 120mm fan on any of the four sides of the Vindicator to aggressively cool the CPU.
VIA make headlines today with a new "Vista certified" mobile IGP chipset dubbed the "VN896" which includes their DX9 based Chrome9 HC integrated graphics processor and supports C7-M and Intel Pentium M processors with an FSB of up to 800Mhz, DDR2-667 or DDR-400 memory, as well as PCI Express x1 and x16 expansion ports.
For further information on it, have a read of VIA's announcement here.
Taipei, Taiwan, 24 January 2007 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the launch of the VIA VN896 digital media mobile IGP chipset, certified Vista Basic-ready by Microsoft and designed to provide users with unsurpassed visual clarity for notebooks and the new breed of ultra mobile devices.
The VIA VN896 chipset features the VIA Chrome9 HC integrated graphics processor (IGP) featuring a DirectX® 9.0 3D accelerator for high performance and a 2D accelerator for productivity applications. The 3D graphics engine of the VN896 chipset offers the industry's only simultaneous usage of single-pass multitexturing and single-cycle trilinear filtering, providing stunning image quality without performance loss.
Also integrated is the latest generation Chromotion video display engine, featuring advanced video processing, including acceleration for MPEG-2 decoding, and picture enhancement through adaptive de-interlacing technology and video deblocking, all executed in hardware to offset the processor workload. The VIA VN896 also features versatile LCD panel, CRT and TV-out support, to as high as 1080i high definition, while separate display engines enable two outputs to display at the same time, with different information at different resolutions, pixel depths and refresh rates.
The Inquirer have obtained details of some upcoming chipsets from Intel to use next-gen "DDR3" memory, these to apparently surface sometime during Q3 of next year. The first two chipsets to show up will support either DDR3 1066 or DDR2 800 memory to allow for a more flexible upgrade path.
INTEL plans to introduce four new chipsets in 2007. It will debut with two that will support DDR 3 1066 or DDR 2 800. I think that customers will have to choose between the two and you will see boards with the same chipset supporting DDR 2 or DDR 3 memory. The first is called P35 and it comes with FSB 1333 support. This chipset is set to replace the G/P965 one.
The second one, set to debut in Q2 2007, is an integrated one called G33. This also supports FSB 1333 or slower, DDR 2 800 and DDR 3 1066. it has support for Intel Clear Video marchitecture but there's no whisper of DX 10. This chipset is set to replace the 945G/P 946GZ.
SiS have made headlines today as they announce a couple of new motherboard chipset families all tricked up for Windows Vista, these being the SiS671 and SiS771 series chipsets designed for both desktop and mobile Intel / AMD platforms respectively.
For the full rundown on them, head over to SiS's website.
Taipei, Dec. 4th, 2006-SiS today unveiled its latest chipsets of the SiS671 series and the SiS771 chipsets ready for Windows Vista. The SiS671 series and the SiS771 chipsets are designed for Intel and AMD platforms respectively. To catch the trend of Microsoft's oncoming Windows Vista operating system, SiS has been actively involving in the development of new technology. The SiS671 series and the SiS771 chipsets are considered the most valuable products for customers.
SiS provides a full line of chipsets supporting Windows Vista. To process a large volume of data, Windows Vista basically requires hardware support 800MHz CPU, 512MB memory, and DirectX9-support graphics processor. If you'd like to have a more efficient and advanced operating performance, Windows Vista needs hardware equipments of a 1GHz CPU, 1GB memory, 128MB graphics memory, and Aero graphics interface.