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There was a patch that was released by Microsoft last week (KB2592546) for Windows, where it was claimed it would improve performance of systems powered by AMD's latest processor architecture, Bulldozer.
What the patch did, was make the OS aware of the way AMD's Bulldozer cores are structured, so it could effectively make use of the parallelism at its disposal. Microsoft a few days later, pulled the patch. But, this is the Internet.
SweOverclockers' had enough time to do a "before and after" performance test of the new AMD FX-8150 processor, with the now pulled patch. The results of SweOverclockers' tests are in the picture above. "tidigare" is before, "nytt" is after, and "skillnad" is change. The chip has been put through a fair amount of tests, some synthetic CPU-intensive tasks, and real-world gaming performance tests.
The results are actually, not that good, and this is most likely the reason the patch was pulled.
Intel, in it's plot to take over the CPU world, is set to release another unlocked Core i5 processor. It will arrive in the form of the Core i5-2550K and has a retail channel part number of BX80623I52550K and OEM part number CM806230121300, the Core i5-2550K was added to the MDDS database.
The Core i5-2550K will carry the S-spec code SR0QH. Clock speeds are unknown at this time, but CPU World expect it to be 3.40GHz. The chip will be on the LGA1155 package, feature four cores, 256KB L2 cache per core, 6MB shared L3 cache, integrated dual-channel DDR3 IMC, integrated PCI-Express 2.0 root complex and a TDP of 95W.
The USB Implementers Forum announced this week that Intel's upcoming "Ivy Bridge" 7-Series Chipset, and other Intel chipsets, have achieved, finally, USB 3.0 certification. Intel's Ivy Bridge silicon, which is due to ship in Q2 2012, will have USB 3.0 as a standard feature, for the first time ever. At the moment, it has only been made available on select notebooks and desktops, and requires chips from AMD, or additional chips from NEC, and others.
General Manager of Intel's Chipset and SoC IP Group, Ahmad Zaidi, said in a statement:
SuperSpeed USB certification...helps ensure interoperability and backward compatibility within the broad USB ecosystem.
Analysts believe that once USB 3.0 has been baked into Intel's chipset, it will made the standard universal as it can be offered on virtually any PC. Brian O'Rourke, research director for In-Stat, has said:
Intel's integration of SuperSpeed USB into its upcoming core logic chipset is critical because it allows cost-conscious PC (makers) to offer the technology at a very competitive price point. Additionally, SuperSpeed USB adoption in PCs is leading to broad adoption in PC peripherals, consumer electronics, and mobile devices.
Intel did show off a Medfield-powered tablet at IDF which had NFC tech built in, as well as being partnered with MasterCard, it promises to bring PayPass checkouts to Ultrabooks.
Intel is now entering a licensing deal with Inside Secure. Inside Secure specializes in contactless payment systems and will be lending its Microread, Secured and Open NFC products to Intel for future chips.
NFC should feature in Ultrabooks, and we should see it in any future x86-powered smartphones, too. NFC is looking to become the next pure standard, and with companies like Intel behind it, it gives more confidence to the technology, and its customers.
GlobalFoundaries will be a name that will be commonly mentioned in 2012, which is something they'll be easily doing if they continue at this pace. They've announced a dual-core Cortex A9 test chip that is built on a 28nm HPP (High Performance Plus) process.
This test chip clocks in at 2.5GHz and is said to be capable of higher frequencies. It operating voltage is just 0.85V. Both the frequency and voltage targets are good for a Cortex A9 implementation, but remember, this is just a test chip.
Most companies are expecting to pass the 2GHz mark next year on high-performance 28nm processes, so we should see this by the end of 2012, if not early 2013. We should see these designs in tablets and netbook replacements, with ARM being Windows 8-compatible now.
AMD launched their AMD FX processor family with just a few units, two eight-core parts (FX-8150, FX-8120), a six-core product (FX-6100), and the quad-core one (FX-4100). But there's now a new processor set to hit the shelves of retailers worldwide, a six-core FX-6200 chip.
The FX-6200 receives quite the speed boost compared to the FX-6100. The FX-6100 has a stock clock speed of 3.3GHz and 3.90GHz under TurboCore, but the FX-6200 puts its hard hat on and gets onto its Bulldozer with stock clocks at 3.8GHz and a TurboCore speed of 4.10GHz. AMD have a chart which shows that we should expect a 10-percent increase in performance when using MainConcept Convert HD to Flash. I look forward to seeing some real-world, gaming results.
Now, if AMD could just find those 800 million transistors that have gone missing...
To look, or not to look. Ah, come on. You know you're going to take a peek. What does it include? Well, the gist of it, there's not much exciting happening for CPUs (in my opinion) for 2012. The roadmap shows that Intel's superhero, the Core i7-3960K, won't be replaced any time throughout 2012. So, if you have one, you'll feel safe knowing you have the knees that are on those bees throughout the year.
But, there will be shifts in all other segments: premium (Core i7), mainstream (Core i5), transactional (Core i3), legacy (Pentium) and value (Celeron and Atom). The biggest change we'll see from Intel in 2012 is the launch of the 22nm-based Socket 1155. There will be a bunch of CPUs released under this new fabrication.
These chips include the Core i7-3770K which will sit at the top of the hill, clocked at 3.50GHz, sporting 8MB of cache, 8 threads, and a Turbo Boost speed of 3.90GHz. TDP sits at 77W and does so throughout the entire 22nm-based range. This is down from the 32nm-based chips with TDP's at a max of 95.
Every time I read the word "atom," I say to myself "up and Atom" from the character "Radioactive Man" from the Simpsons. Anyway, researchers from McGill University and Sandia National Laboratories have built a circuit that has two wires that are separated by just 150 atoms, built on a 15nm process.
Circuits of this size include the usual benefits of lower power consumption and heat, as well as bringing extra functionality due to the larger transistor density. The challenges at this level, as you can imagine, are great. Dan Olds, an analyst at The Gabriel Consulting Group said of this research:
This kind of research also uncovers other potential problems arising from ever smaller shrinks. Getting to 15nm or 16nm will mean smaller and more powerful devices that are more energy efficient. But when we're talking about such a small scale, designing chips that can be mass-produced with decent yields is quite a challenge. There will also be challenges for the design of devices that will use these processors. Devices based on 15nm processes will pack more performance and functionality into much smaller form factors. Functions that used to take two or more chips will be accomplished by one transistor-jammed processor.
In an exclusive interview with NordicHardware, Managing Director of Intel Northern Europe, Pay Bliemer, revealed that Intel is currently playing with 14nm circuits and have them actually "up and running" in a lab.
Bliemer also states that whilst manufacturing technology is becoming much more complicated, Intel is still full steam ahead with their current roadmaps. Intel were the first to tap into the 32nm technology for mass production of microprocessors and by the end of Q1 2012, they will roll out their Ivy Bridge architecture sporting a 22nm process with "3D Transistors", also known as Tri-gate transistors.
Bliemer also says that by the time Ivy Bridge launches, Intel will be one and a half nodes ahead of the competition. He adds:
I wouldn't say that we have problem but there's no denying that it's getting more complicated the smaller you make something, so you're running into limitations - but our R&D as well from an architectural point of view are the guys making the manufacturing and that's within the same company - which makes Intel unique still. So we can really work extremely close with these teams. We are the same team, the guys who are going to manufacture the parts and the ones who will be designing the parts.
Our latest poll had over 3,100 people who answered, You now know everything about Sandy Bridge-E - what do you do?
This was one of the most even polls we have ran in sometime. Out in front by a small margin the option of staying on my current system took first place with 25% of the votes.
In a close second place the option of staying on an existing Sandy Bridge system took 19% of the votes, while third place went to checking out what AMD is doing.