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Intel Haswell-EP Xeon E5-2600 v3 Server Family Processor Overview

By: William Harmon | Editorials in IT/Datacenter | Posted: Sep 8, 2014 12:30 pm

E5-2600 v3 Architectural Overview




What are the key differences between E5-2600 v2 and E5-2600 v3 processors? Intel has upped the core count from a max of 12 cores on the v2 processors to a max of 18 cores on the v3 processors.


Frequency adjustments have changed from TDP and Turbo, only on the E5 v2 processors, to TDP, Turbo Frequency, and added AVX and AVX Turbo frequencies on the E5 v3's. AVX support and been updated from AVX 1 which was 8 DP (double point) Flops/Clock/Core to AVX2 and 16 DP (double point precision) Flops/Clock/Core.


Memory types have switched from 4x DDR3 Channels RDIMM, UDIMM, and LRDIMM, to 4x DDR4 Channels RDIMM and LRDIMM. Memory Frequency (MHz) has improved from DDR3 1866 (1DPC), 1600, 1333, 1066, to DDR4 operating frequency:


RDIMM: 2133 (1DPC), 1866 (2DPC), 1600

LRDIMM: 2133 (1&2DPC), 1600


In addition, the updated memory controller now supports DDR4, and now has two home agents in more SKU's and directory cache. This increases memory bandwidth and power efficiency, provides greater socket BW with more outstanding requests, and lower average memory latency.


LLC now has Cluster on Die (COD) mode with improved LLC allocation policy, and cache allocation monitoring (Intel Cache Allocation Technology (CAT)). These new additions help to increase performance, reduce latency, and improve performance by better application placement in a VM environment.


Intel Cache Allocation Technology (CAT) enables control over the placement of data in the last-level cache, allowing you to isolate and contain misbehaving threads/apps/VMs, or prioritize more important ones. This feature is available on five specialized communications SKUs in the Xeon E5 v3 generation in a generation-specific way.


QPI Speed has gone up from 8.0 GT/s to 9.6 GT/s. QPI is the on-die interconnects, on which Haswell-EP now has two fully buffered rings that enable higher core counts, and provide higher bandwidth per core. TDP has also changed from up to 130W Server, 150W Workstation to 145W Server, and 160W Workstation, which is increased due to integrated VR.


Power Management has changed from same P-states for all cores, same core and uncore frequency to: Per-core P-States with independent uncore frequency scaling, and energy efficient turbo boost. This will give better performance per watt, and lower socket idle (package C6) power use.


With Integrated IO-Hub (IIO) the LLC cache will track IIO cache line ownership, and increased PCIe buffers and credits. Overall, this will improve PCIe bandwidth under conflicts (concurrent accesses to the same cache line), and increase PCIe bandwidth, and latency tolerance.


Additions to PCIe 3.0 include DualCast, which allows a single write transaction to multiple targets with relaxed ordering. This will minimize memory channel bandwidth, and enable data sent directly to memory, and on the NTB port to help storage applications that are typically memory bandwidth limited.

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