Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced that it will demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology at the Intel Developer's Forum (IDF) in San Francisco September 13-15, 2011.
As a result of rapid growth in multi-core processing and computing virtualization, today's data center servers require increased DRAM capacity and performance. New applications for notebook computers, tablets and smart phones also demand additional device performance balanced with battery life and reduced form-factor. A market-ready packaging platform, the Invensas xFD technology is cost-effective and improves capacity and performance for DRAM devices and memory modules.
xFD is a novel multi-die, wirebond-based packaging technology that mounts integrated circuits (ICs) upside down and staggers them in a shingle-like configuration, incorporating short wirebonds in a structure similar to that of a window-BGA package. With this approach, xFD:
Improves capacity and decreases overall component size with a 25 to 35 percent savings in vertical height over conventional solutions
Enhances electrical performance with a 50 to 70 percent improvement in speed-bin yield due to symmetric top and bottom die performance
Provides a 20 to 30 percent heat transfer advantage over conventional dual-die packages (DDPs)
Invensas xFD technology costs less to manufacture than conventional multi-die DRAM packages because it employs a parallel process flow; significantly reduces gold and other material usage; and is manufactured on existing wirebond assembly lines.
"We developed the xFD technology platform in response to continued industry demand for denser, faster and cheaper DRAM solutions for servers and mobile devices," said Simon McElrea, president of Invensas Corporation. "xFD provides single-die package performance in a multi-die configuration as well as delivering significant thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the cost, time and risk of high-volume adoption."
Invensas will demonstrate its DFD technology in its booth at IDF.
Latest News Posts
- New Note8 leak shows awkwardly placed fingerprint sensor
- Samsung Galaxy S8 officially discounted by up to $300
- Qualcomm's Snapdragon 836 will debut with the Pixel 2
- Samsung to produce chips for the iPhone 9, LG batteries
- Facebook is working on a modular smartphone
- Bloody AL90 Blazing Laser Gaming Mouse Review
- Cryptocurrency mining deflates, used GPUs hit eBay
- G.SKILL TridentZ RGB DDR4-3600 32GB Memory Kit Review
- ASRock X299 Taichi Motherboard Review
- Transcend ESD220C 120GB Portable SSD Review
- Atari announces Blade Runner 2049 partnership with NECA and Audiowear, launching wearable technology that blurs the line between fashion and future
- BIOSTAR introduces the world's first 8-slot PCI-e mining motherboard with the TB250-BTC+
- HyperX unveils HyperX Alloy Elite and TKL HyperX Alloy FPS Pro mechanical gaming keyboards
- Toshiba Memory Corporation develops world's first 3D flash memory with TSV technology
- ADATA releases XPG GAMMIX line with S10 PCIe Gen3x4 NVMe 1.2 SSD and D10 DDR4