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Hybrid memory cube 2.0 capable of 480GB/sec of bandwidth for GPUs

HMCC's hybrid memory cube 2.0 technology is capable of delivering 480GB/sec bandwidth

| Connectivity & Communications News | Posted: Feb 27, 2014 12:36 pm

The hybrid memory cube consortium (HMCC) is an organization comprising of memory providers such as Micron Technology, Samsung Electronics, and SK Hynix, is dedicated to developing and establishing an industry-standard interface specification for the hybrid memory cube (HMC) technology.

 

TweakTown image news/3/5/35804_02_hybrid_memory_cube_2_0_capable_of_480gb_sec_of_bandwidth_for_gpus.jpg

 

This week, the consortium unveiled HMC 2.0, which is capable of some truly crazy speeds. HMC 2.0 is capable of supporting bandwidth of 480GB/sec per one memory device. HMC can do this by using advanced through-silicon vias (TSVs) - which are vertical conduits that electrically connect a stack of individual chips - in order to combine high-performance logic with dynamic random access memory (DRAM) die.

 

HMC 1.0 was capable of 160GB/sec of bandwidth, in 2GB density while running 10Gb/s per late data-rate, using up to 70% less energy per bit than existing technologies. The new HMC 2.0 specification supports increased data rate speeds advancing short-reach (SR) performance from 10Gb/s, 12.5Gb/s, 15Gb/s and up to 30Gb/s, allowing the peak bandwidth of a single memory cube to bounce all the way up to 480GB/sec.

 

The updated specification also migrates the associated channel model from SR to VSR to align with existing industry nomenclature. These HMC's can be used on next-gen GPUs, which would see internal bandwidth climb up to some truly incredible levels.

NEWS SOURCESKitguru.net, Micron.com

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