"INTEL 3D FOVEROS" content on TweakTown - Page 1

We found 2 items for the tag: INTEL 3D FOVEROS

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NEWS

Intel CEO: we want 1 trillion transitors in a single package by 2030

Intel CEO Pat Gelsinger says at Hot Chips 34 that the company wants to hit 1 trillion transistors on a single package by 2030, Foveros will help them.

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NEWS

Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs

Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.