"INTEL 3D FOVEROS" content on TweakTown - Page 1
We found 2 items for the tag: INTEL 3D FOVEROS
NEWS
Intel CEO: we want 1 trillion transitors in a single package by 2030
Intel CEO Pat Gelsinger says at Hot Chips 34 that the company wants to hit 1 trillion transistors on a single package by 2030, Foveros will help them.
NEWS
Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs
Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.