Packaging and G.Skill TridentZ NEO
The box that our TridentZ NEO arrived in shows us quite a bit. At the top, we see G.Skill makes it, and that is DDR4, but we also get to peek inside of the box and see the NEO RAM behind plastic. The bulk of the panel is used to show the memory in full RGB display mode, and we can also see the bare metal edges of the fins. Along with the TridentZ NEO name at the bottom, we also see the Ryzen/AMD notation, which means it is designed to work better with AMD than many of the kits out there.
The back of the box says it much better than we could about how the NEO line is engineered for premium AMD performance. In the text at the top, they also cover the aluminum spreaders, the use of high-screened ICs, and a 10-layer PCB. Across the lower half, we see the G.Skill info on the left for many ways of communication with them. We mentioned the motherboard RGB system compatibility, but this is the first time we have seen the part number, speed, density, timings, and voltage of the F4-3600C16D-GTZN version of the TridentZ NEOs.
We omitted the G.Skill sticker, but you will find a red one inside of the box, along with these sticks, inside of plastic inner packaging. One look and you instantly think TridentZ memory, as that is the intention, but G.Skill sets the NEO apart in subtle ways. The name NEO painted on the black brushed aluminum section is a dead giveaway, but let's imagine that it isn't there. The tip of the fins at the top of the heat spreader is exposed for the NEO line, and we also picked up on the textured gray area on the left, which on the standard TridentZ sticks would be brushed aluminum, not textured and painted.
The other side of both sticks looks identical to what we just saw in the last image, down to all but one detail. The side that is typically not exposed, unless on Intel's HEDT systems offers the product sticker. On the left, we see when the kit was produced, while the rest of it covers anything you would want to know about the kit, even down to the serial numbers.
From the top, again, most would assume TridentZ, and while not wrong, aside from the exposed outer edges, viewed from the top, nothing else is there to differentiate them. The white plastic RGB LED diffuser is the same we see on TridentZ RGB kits, where the G.Skill name is painted on both sides as well as the center of the top.
Rather than risk damage to sticks, we opted to open Taiphoon Burner to have a look at what is under the hood. Doing so shows us that we are indeed dealing with Samsung ICs, the K4A8G085WB-BCPB, to be exact. It is hard to go wrong with B-die ICs with good timings, 10-layer A1 PCB, and for those worried about such things, there is even a thermal probe that will show up in software like AIDA64, or whatever software it is you prefer.
On our X570 ASUS motherboard, we let it control the RGB LEDs, and the effect is as pleasing as other components in sync with each other. As the motherboard LEDs and the head unit of the AIO change colors, their corresponding color is met at the bottom of the TridentZ NEO. Sleek looking, and easy to control, what more can one ask?
On the OCF for Intel testing, our X299 has BIOS-level options for colors, and the AsRock software is a bit more than dysfunctional for us. That being said, even allowing the G.Skill to do their thing, with our block going through a spectrum of colors on its controller, we found that the TridentZ NEO does still play well with others. As our block and fans moved to the green they are now; you can see the top left stick is also turning the same color. It may be luck, but the timing of this cooler and the TridentZ NEO kept in sync, even though there was no control over the memory applied.
Last updated: Dec 20, 2019 at 06:11 am CST
- Page 1 [Introduction, Specifications, and Pricing]
- Page 2 [Packaging and G.Skill TridentZ NEO]
- Page 3 [Test System Details]
- Page 4 [AMD Performance]
- Page 5 [Intel Performance]
- Page 6 [Final Thoughts]