Thermal Imaging and Power Consumption
System power is measured at the wall with an AC power meter.
Note on Thermal Images: In the temperature section, we use our Seek thermal imaging camera to capture the surface temperatures of major components on the board. I look at the VRM and then all other things that light up the screen. If there is something to worry about, then I will state it. Otherwise, I will just show the hotter running parts of the board for fun. Unless some component is over 80-90C, then there isn't anything to worry about.
All systems will act differently, so I will look for commonalities, such as how far from the VRM the heat spreads through the PCB and the difference in temperature between the front side and backside of the PCB. Keep in mind, the majority of the heat from the VRM goes into the PCB as it is a giant soldered on copper heat sink. A larger difference in temperature between the back and front of the PCB points towards a more effective heat sink.
Thermal Testing at Stock Speeds:
The image on the left is always at idle, and the image on the right is at load. During ALL TESTS, There is no airflow direct at the VRM
Up-close of the front of the VRM.
Up-close of the back of the VRM.
The X399 Phantom Gaming 6 stock almost-worst-case thermal testing scenario reveals that the heat sink seems to be doing its job correctly. The secondary heat sink also gets warmed up, and I should mention it also cools down three phases for the SoC VRM. Maximum temperature is 43C at load on the front and back, so heat is being moved around and dissipated. Overall, excellent thermal performance.
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