Thermal Imaging and Power Consumption
System power is measured at the wall with an AC power meter.
Note on Thermal Images: In the temperature section, we use our Seek thermal imaging camera to capture the surface temperatures of major components on the board. I look at the VRM and then all other things that light up the screen. If there is something to worry about, then I will state it. Otherwise, I will just show the hotter running parts of the board for fun. Unless some component is over 80-90C, then there isn't anything to worry about.
All systems will act differently, so I will look for commonalities, such as how far from the VRM the heat spreads through the PCB and the difference in temperature between the front side and backside of the PCB. Keep in mind, the majority of the heat from the VRM goes into the PCB as it is a giant soldered on copper heat sink. A larger difference in temperature between the back and front of the PCB points towards a more effective heat sink.
Thermal Testing at Stock Speeds:
The image on the left is always at idle, and the image on the right is at load. During ALL TESTS, fans above the VRM that cool the CPU cooler's (Corsair H110i) radiator are turned on to high (12v).
Up-close of the front of the VRM.
Up-close of the back of the VRM.
The VRM here is very solid, and the back of the motherboard actually has a backplate, which should help cool down the VRMs from the backside. Overall temperatures are good, but light load efficiency, from phase shedding, it's in use. It is not a big deal, and we don't typically see that with IR's solutions. Full load performance is solid.
Low to moderate airflow 4.6GHz 1.75V VCCIN OCed VRM Thermal Imaging:
Temperature readings are taken after 40 loops of Intel Burn Test have been run (with AVX). Pictures of the setup are on the Test Setup Page. The two radiator fans (120mm Corsair) of the H110i blow in the general direction of the motherboard and VRM from the side (that is why the right side is slightly cooler in the first pic), so there is airflow (less than a case but more than a test bench with no airflow).
The VRM and topside heat sink on the Gaming 7 are identical to that on the Gaming 9, and the Gaming 7 also has a backplate with a heat pad to help cool the VRMs while the Gaming 9 doesn't. Oddly enough, we are a few degrees hotter than the Gaming 9. Perhaps it has to do with copper in the PCB, or the backplate drawing heat, or maybe it's just a difference in ambient temperature.
The VRM here is actually one of the better ones I have seen in regards to cooling and heat, perhaps just as good as the Gaming 9.
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- Page 1 [Introduction, Specifications, and Pricing]
- Page 2 [Packaging and X299-AORUS Gaming 7 Overview]
- Page 3 [GIGABYTE X299-AORUS Gaming 7 Circuit Analysis]
- Page 4 [GIGABYTE X299-AORUS Gaming 7 Circuit Analysis Continued]
- Page 5 [BIOS and Software]
- Page 6 [Test System Setup]
- Page 7 [Overclocking]
- Page 8 [CPU, Memory, and System Benchmarks]
- Page 9 [System IO Benchmarks]
- Page 10 [VRM and System Thermal Imaging and Power Consumption]
- Page 11 [What's Hot, What's Not & Final Thoughts]