Temperature and Power Consumption
System power usage is measured at the AC/DC PSU (the Corsair AX1200i) which I have connected to another system to measure the test system and as a backup I have a wall meter to verify. The CPU power is measured through the 8-pin connect which is hooked up to a hall effect IC which measures current and puts out a voltage in proportion to the current. That voltage is logged by a National Instruments ADC which logs the DC voltage level, which I then convert into current.
Note on Thermal Images: In the temperature section, we use our Seek thermal imaging camera to capture the surface temperatures of major components on the board; I look at the VRM and then all other things that light up the screen. If there is something to worry about then I will state "you should worry about this:" , otherwise I will just show the hotter running parts of the board for fun. Unless some component is over 80-90C then there really isn't anything to worry about. Also, orange is the brightest temperature imaged, it doesn't always mean orange is 80C or 30C. If everything is 0c on the screen and one thing is 5C, the thing that is 5C will be orange.
All systems will act differently, so I will look for commonalities, such as how far from the VRM the heat spreads through the PCB and the difference in temperature between the PCB and the chokes. Keep in mind that the majority of the heat from the VRM goes into the PCB as it is a giant soldered on copper heat sink.
Here the board is at stock and idle on the left and full CPU/Memory load on the right (Intel Burn Test).
The VRM doesn't heat up too much during this strenuous load (at stock settings), which is a good sign. It seems the heat sink is taking care of much of the heat, the back is more telling.
The back heats up a bit more than the front, still in safe ranges.
I cranked the system to 4.5GHz and ran the same tests. Here the whole system is at idle (no power saving states enabled) and then load. There is a considerable increase in temperatures.
Here is the VRM from idle to load at 4.5GHz, there is a 12C increase.
The back of the board shows a 14C increase. As long as the temperature at the back of the PCB is the same or lower than the temperature on the front side, the heat sink is doing its job and not saturated by heat. In this case, the heat sink is doing its job.
Temperatures are within totally acceptable ranges.
PRICING: You can find products similar to this one for sale below.
United States: Find other tech and computer products like this over at Amazon's website.
United Kingdom: Find other tech and computer products like this over at Amazon UK's website.
Canada: Find other tech and computer products like this over at Amazon Canada's website.
- Page 1 [Introduction, Specifications, and Pricing]
- Page 2 [Packaging and the X99-UD4]
- Page 3 [X99-UD4 Circuit Analysis]
- Page 4 [BIOS and Software]
- Page 5 [Test Setup and Overclocking]
- Page 6 [CPU, Memory, and System Benchmarks]
- Page 7 [System IO Benchmarks]
- Page 8 [Temperature and Power Consumption]
- Page 9 [Final Thoughts]
Recommended for You
- We at TweakTown openly invite the companies who provide us with review samples / who are mentioned or discussed to express their opinion of our content. If any company representative wishes to respond, we will publish the response here.
Latest News Posts
- Steam Summer Sale 2018, two weeks of CRAZY low prices
- Brand new F1 2018 trailer reveals the French Grand Prix
- Samsung teases 8TB NF1 NVMe SSD: PCIe 4.0 with 3GB/sec reads
- Gears of War 5 aiming for 4K 60FPS on Xbox One X
- Microsoft teams with Nintendo for Minecraft crossplay fun
- Vampyr Review: Bloody Rare
- ASROCK X370 and MB STICKS
- Aten Thunderbolt 3 Multiport Dock
- Samsung 970 EVO 2TB M.2 NVMe PCIe SSD Review
- Asus X401A Laptop will not boot despite several replaced components -- Second attempt
- Micron Launches Industry's First Enterprise SATA Solid State Drives Built on Leading 64-layer 3D NAND Technology
- Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
- Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
- ASUS Announces GeForce GTX 1070 Ti Series Gaming Graphics Cards
- ASUS Announces ASUS Hangouts Meet Hardware Kit