Toshiba HG6 Internals
The Toshiba THNSNJ512GCSU HG6 comes in the 2.5" form factor with a 7.2mm and 9.5mm z-height, with Toshiba branding. We can spot the thermal pads peeking out through the holes in the bottom of the case.
An additional four internal fasteners hold the HG6's PCB in place.
The PCB is fastened to a riser, which provides the correct gap between the PCB and thermal pads. These thick pads transfer heat from the components into the case to keep the drive cool in demanding environments.
The bottom of the PCB is bare, with all eight Toshiba A19nm Toggle 2.0 MLC NAND packages on top. We also spot the bare mounting pad for a DRAM package, which is not included in this model of the drive.
The custom Toshiba T635879BXBG controller powers the HG6.
Toshiba HG6 Specifications
The THNSNJ512GCSU also comes in a SED model, signified by the THNSNJ512GBSU part number.
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- Page 1 [Introduction]
- Page 2 [Toshiba HG6 Internals and Specifications]
- Page 3 [Test System and Methodology]
- Page 4 [Benchmarks - 4k Random Read/Write]
- Page 5 [Benchmarks - 8k Random Read/Write]
- Page 6 [Benchmarks - 128k Sequential Read/Write]
- Page 7 [Benchmarks - Database/OLTP and Web Server]
- Page 8 [Benchmarks - Email Server]
- Page 9 [Final Thoughts]
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