Toshiba HK3R Internals
The Toshiba HK3R THNSNJ480PCS3 comes in a 2.5" form factor with a 7mm z-height in a feather-light alloy case.
The HK3R utilizes diminutive thermal pads, strategically placed to wick away heat from the drive to the case exterior. The pads even cool the bottom of the PCB where there are no surface mounted components; instead pulling heat from the rear of the packages. The PCB is secured into the case with an additional four fasteners.
The case features an indentation on the side of the PCB that features surface mount components. This pushes the thermal pads to the surface of the components to provide cooling.
The HK3R features eight Toshiba 19nm Toggle TH58TEG9EDJDA89 NAND packages, and two very large capacitors. These capacitors flush any data in transit down to the NAND in the event of power failure. The HK3R features both PFM (Power Fail Management) and PLP (Power Loss Protection) with these supercaps. The rear of the PCB is void of any components.
512MB of SK Hynix DDR3 SDRAM serves as the cache for the SSD. The robust power loss protection is tested for 30,000 cycles. The HK3R holds a copy of the LBA tables in DRAM on a physical NAND page at all times to ensure recovery in the event of power loss.
The Toshiba TC358790XBG controller powers the HK3R.
The HK3R features a 2,000,000-hour MTTF (Mean Time to Failure) rating.
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- Page 1 [Introduction]
- Page 2 [Toshiba HK3R Internals and Specifications]
- Page 3 [Test System and Methodology]
- Page 4 [Benchmarks - 4k Random Read/Write]
- Page 5 [Benchmarks - 8k Random Read/Write]
- Page 6 [Benchmarks - 128k Sequential Read/Write]
- Page 7 [Benchmarks - Database/OLTP and Web Server]
- Page 8 [Benchmarks - Email Server]
- Page 9 [Final Thoughts]