Samsung 845DC EVO Internals
The Samsung 845DC PRO comes in a 2.5" form factor with a 7mm z-height in the typical Samsung motif.
Going back to a larger 30nm lithography on V-NAND brings the benefit of lower programing voltages. 3D V-NAND features lower power draw, which we will be testing in the following pages. Lower power requirements also provide the additional benefit of lowering heat output. The SSD case does not feature any of the thermal pads we are accustomed to seeing in class-leading SSDs, which is likely due to the lower power consumption. The 845DC PRO also features Dynamic Thermal Guard, which throttles the SSD if deployed in an environment above the temperature specifications of the drive.
Four 128GB packages of first-generation Samsung 3D V-NAND populate the top of the PCB. The top of the PCB also has extra pads for the four additional packages required for the 800GB model. Fifteen Tantalum power capacitors that ring the rear of the PCB protect the 512MB of LPDDR2 cache memory on the 400GB model, and 1GB of DRAM on the 800GB model. These capacitors flush data in transit to the NAND in the event of host power loss.
The eight-channel Samsung S4LN021X01-8030 controller, more commonly known as the MDX, is a 300MHz Cortex R4-based ARM controller. The tri-core controller is designed and manufactured by Samsung. The MDX is featured in several other Samsung SSDs, and has a long record of reliability.
Samsung 845DC PRO Specifications
Samsung releases in-depth latency, and QoS performance metrics. The pre-production model we are testing features DXV80X3Q firmware.
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- Page 1 [Introduction]
- Page 2 [Samsung 845DC EVO Internals and Specifications]
- Page 3 [Test System and Methodology]
- Page 4 [Benchmarks - 4k Random Read/Write]
- Page 5 [Benchmarks - 8k Random Read/Write]
- Page 6 [Benchmarks - 128k Sequential Read/Write]
- Page 7 [Benchmarks - Database/OLTP and Web Server]
- Page 8 [Benchmarks - Email Server]
- Page 9 [Final Thoughts]
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