AMD Boosts Application Development for AMD Fusion APU-Powered PCs with Updated Software Development Kit
SUNNYVALE, Calif. -1/27/2011
AMD (NYSE: AMD) today announced availability of the updated AMD Accelerated Parallel Processing (APP) Software Development Kit (SDK) v2.3 with full support for the first AMD Fusion Accelerated Processing Units (APUs), OpenCL 1.1 and AMD Radeon HD 6900 Series graphics. AMD APP technology enables AMD GPUs and CPUs to work together to run many demanding computing tasks faster than possible with just the CPU alone.
AMD Accelerated Parallel Processing SDK v2.3, previously known as the ATI Stream SDK, empowers software developers to write new applications that can take full advantage of the parallel processing power of heterogeneous computing platforms, such as those based on new AMD E-Series and C-Series APUs that combine a multi-core CPU and DirectX®11-capable GPU on a single die.
"When developers harness the power of parallel processing within our APU designs, they can fundamentally change the PC experience to help not only make it faster, but also to create new possibilities in software," said John Taylor, director of Client Product and Software Marketing, AMD. "In 2008, AMD was the first processor design company to embrace OpenCL, and as such, we have made significant progress in parallel processing innovation. Our vision has been realized with the widespread availability of the first PCs powered by AMD Fusion APUs."
"Industry standards like OpenCL and OpenGL, common APIs, and tools like the AMD APP library and SDK give application developers a shared environment that allows them to harness maximum hardware performance for amazing application experiences across platforms," said George Tang, vice president and general manager of ArcSoft's Video and Home Entertainment Group. "By supporting these open standards, AMD is giving developers access to a programming environment that helps them more easily navigate the recent advances in computer hardware, including AMD's APU technology."
In addition to support for the first AMD Fusion APUs and OpenCL 1.1, AMD APP SDK v2.3 offers improved runtime performance and math libraries for OpenCL.
AMD Developer Summit
Improving OpenCL performance and programmability on AMD platforms is a key initiative for AMD, and this summer, AMD technical personnel, AMD executives, developers and partner companies will gather at the AMD Fusion Developer Summit to discuss industry standards including OpenCL, and to explore how to best optimize applications for heterogeneous computing.
The inaugural AMD Fusion Developer Summit (AFDS) will be held June 13-16, 2011 in Bellevue, Washington. Presentation proposals are due by February 4, 2011. AFDS will gather developers, academics and emerging innovators to learn more about heterogeneous computing, APU technology, parallel processing and developer programs like the AMD Fusion Fund.
AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its ground-breaking AMD Fusion Accelerated Processing Units (APUs). AMD's graphics and computing technologies power a variety of devices including PCs, game consoles and the powerful computers that drive the Internet and businesses. For more information, visit http://www.amd.com.
Latest News Posts
- Dragon Ball FighterZ first DLC unlocks Broly, Bardock
- Final Fantasy XV PC mods can be whimsical and absurd
- Atari gets into crypto, offers Atari Token and Pong Token
- AMD offers free Ryzen APU so owners can flash their firmware
- SanDisk now shipping 400GB microSD card, pumps 100MB/sec
- Noctua NH-L12S CPU Cooler Review
- MSI Z370 TOMAHAWK (Intel Z370) Motherboard Review
- Apricorn Aegis Fortress 128GB SSD Review
- Scythe Grand Kama Cross 3 CPU Cooler Review
- OWC ThunderBlade V4 4TB Review
- Micron Launches Industry's First Enterprise SATA Solid State Drives Built on Leading 64-layer 3D NAND Technology
- Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
- Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
- ASUS Announces GeForce GTX 1070 Ti Series Gaming Graphics Cards
- ASUS Announces ASUS Hangouts Meet Hardware Kit