Motherboards - Page 4

AMD's new Ryzen 9000 Series CPU launch might have been delayed by a few weeks, but it's still around the corner. And with the new Zen 5 processors fully supported by existing AM5 boards, GIGABYTE has announced that it's now rolling out BIOS updates for its X670, B650, and A620 Motherboards for the new CPUs.

GIGABYTE notes that AGESA 1.1.7.0 Patch A (Release) and AGESA 1.2.0.0a Patch A (Beta) are critical updates for "compatibility and optimized performance" when paired with one of the new AMD Ryzen 9000 series processors.

Although listed as Beta, AGESA 1.2.0.0a Patch A is definitely for those looking to pick up the flagship AMD Ryzen 9 9950X or the Ryzen 9 9900X. It allows users to "harness the full potential of these next-generation processors." This means full support for AMD's new memory overclocking features and the new Curve Shaper tool.

Intel's next-generation Core Ultra 200 series "Arrow Lake" CPUs will arrive with a brand new LGA-1851 socket, which will receive an optional RL-ILM configuration with improved thermal performance without requiring a contact frame.

We're hearing the news on LGA-1851's new socket changes through hardware leaker "Jaykihn," which reports Intel's new LGA-1851 socket will have two different loading mechanisms. The first, is the traditional ILM solution that's compatible with existing coolers, while the other is "RL-ILM" (Reduced Load ILM) that's designed specifically for improved thermal performance, but with different compatibility requirements.

The loading mechanism itself is a metal structure that surrounds the socket -- in this case, LGA-1851 -- providing the mechanism to secure the CPU, seating it (safely) into the motherboard. Until now, Intel CPUs have used a single mechanism called the ILM (Independent Loading Mechanism) but the ILMs weren't great for overclockers, given that the mechanism reduced the contact area of the processor with the cooling solution, which isn't great for heat dissipation. That all changes with LGA-1851, it seems.

AMD's Zen 5-powered Ryzen 9000 Series CPUs are on track for release later this month. The latest rumors and leaked retail listings point to a July 31 launch date for the Ryzen 9 9950X, the Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X CPUs. AMD's next-gen desktop processors are compatible with the AM5 motherboard standard, so they'll work just fine with current AM5 boards for the Zen 4-powered Ryzen 7000 Series.

AMD announced Zen 5 and the Ryzen 9000 Series at Computex 2024, where it also announced new X870 and X870E motherboard chipsets. The new motherboards will include USB 4 and PCIe Gen 5 for storage and graphics as standard, as well as improve DDR5 memory support and faster AMD EXPO memory overclocking.

Several board makers showcased their new X870 and X870E motherboards at Computex (ASRock's X870E Taichi is pictured below); however, a new report (via Wccftech) indicates that these next-gen AM5 boards won't hit retail until September 30. The reason could be to align with the highly anticipated Ryzen 9000 X3D launch, which should be happening around that time.

Intel is currently hosting a bunch of events for distributors and board partners to show off their new LGA-1851 socket, and new 800-series chipset that will power its upcoming Core Ultra 200 series "Arrow Lake" desktop CPUs.

In some new leaks, we're getting some details on the new 800-series chipset that shows us the full PCIe configuration, with Arrow Lake-S processors featuring 16 dedicated PCIe Gen5 lanes for graphics, with an additional 4 Gen5 lanes for SSD storage.

On top of that, there's an additional Gen4x4 interface that's attached directly to the CPU, which will allow users to connect another Gen4 SSD directly to the CPU. This means that users and gamers that adopt the new Core Ultra 200 series "Arrow Lake" CPU platform with the new 800-series chipset, won't have to sacrifice Gen5 lanes for GPUs and storage.

MSI has made a new BIOS update available that prepares the ground for the release of Ryzen 9000 processors next month, and it comes with a major bonus for those who run NVIDIA RTX 4000 graphics cards to boot.

The new AMD AGESA Combo PI-1.2.0.0 BIOS update is for MSI's existing X670E, X670, B650, and A620 motherboards, and it remedies some problems with NVIDIA Lovelace GPUs.

MSI says its new BIOS incorporates a few improvements in terms of compatibility with RTX 4000 products, without giving any details, although it does note that whatever work is applied, it especially pertains to the RTX 4060 and 4070 - bringing in cures for some instability issues.

ASUS is preparing to launch its new As-You-Wish motherboard range, starting with the Z790-AYW OC WIFI motherboard that has some stellar overclocking potential.

We're hearing about the new As-You-Wish motherboard range by ASUS by French outlet, Overclocking.com, with the new ASUS Z790-AYW WIFI motherboard shown off at Computex 2024 earlier this month. At the time, the board had two DIMM slots, which was a cut-down version of the full board.

The new ASUS Z790-AYW OC WIFI "PRIME" motherboard has an Intel LGA1700 socket, with the OC model of the motherboard featuring two DIMM slots that support DDR5-8400+ (OC) memory. ASUS has managed to deal with the dual-channel memory more efficiently, which provides some insane 11550MT/s memory speeds (by reducing the DIMM slots, and using exotic LN2 cooling, of course).

ASRock held a press event at Computex 2024 in Taipei, Taiwan, to announce new motherboards designed to support next-generation CPUs from Intel and AMD.

The company announced a large line-up of new motherboards designed for both overclockers and gaming and while the unveiling didn't specifically mention Intel's next-generation CPUs by name (Arrow Lake), it stated "next-gen Intel." The AMD motherboards were much more straightforward, stating they have support for AMD's Zen 5-based Ryzen 9000 series processors. While many motherboards were announced for both sides of the fence, we are only going to concentrate on a couple. For the full list, check out this link here.

First off, we have the X870E Taichi and the X870E Taichi Lite, which uses AMD's X870E (Promontory 21) chipset for AM5. This new flagship motherboard comes with 27-phase power delivery, 4x DDR5 DIMMs, 1x Blazing M.2 (PCIe Gen5 x4), 3x PCIe Gen4 x4 (Hyper) M.2 slots, 2x USB4 Type-C slots, Realtek ALC4082 codec and ESS SABRE9218 DAC, Realtek 5Gbps Eternet controller, and more.

At Computex 2024, we saw one of MSI's latest Z790 PROJECT ZERO PLUS motherboards, designed for extreme overclocking with Intel CPUs. It adopts CAMM2, an alternative to SO-DIMM for laptops, and sits flat on the motherboard. MSI co-developed this memory solution with Intel. Its placeholder name is Mini_CUDIMM, and the Z790 PROJECT ZERO PLUS board supports 12th Gen and higher Intel Core processors.

Like the magnetically attached heatsinks for storage on the new Z790 PROJECT ZERO PLUS, this has one that comes standard with the motherboard. CAMM stands for Compression Attached Memory Module. It was initially designed to replace SO-DIMM in laptops, incorporating a dual-channel configuration into a single solution. It's being used primarily for high-speed memory for PC gaming, starting at DDR5-8400 speeds.

MSI believes overclockers will be able to push speeds higher than what we've seen with standard DDR5 modules, which is exciting. Each module supports up to 128GB, so you've got enough capacity, too. "These optimizations allow for extreme overclocking, delivering unmatched performance for enthusiasts seeking the ultimate," MSI writes in the press release.

With the new Ryzen 9000 Series, led by the flagship Ryzen 9 9950X, AMD is introducing the new X870 and X870E motherboard chipsets. These are expected to launch alongside the new Zen 5 CPUs in July, with several board partners on board (heh) to deliver the latest in AM5 platform technology. So, what's new?

With X870 and X870E, USB 4 and PCIe Gen 5 storage and graphics are now standard. More importantly, for PC gamers and enthusiasts, X870 introduces and expands AMD EXPO memory overclocking to support faster DDR5 speeds.

"We learned some lessons with the 600 Series [of motherboards]; memory technology has come a lot further, so we should be able to clock a little higher." Unfortunately, no specifics, supported overclocked speeds, or timings were given - this will come later.

MSI has a bunch of next-gen Z890 and B860 motherboards that have just been spotted on Device Report, ready for Intel's next-gen Core Ultra 200 series "Arrow Lake-S" processors.

The new LGA 1851 socket will house the new flagship Z890 chipset, with MSI working on no less than 9 new Z890 motherboards. These include the MEG Z890 GODLIKE, MEG Z890 ACE, MEG Z890 UNIFY-X, MPG Z890 CARBON WIFI, MPG Z890 EDGE TI WIFI, MPG Z890I EDGE TI WIFI, MAG Z890 TOMAHAWK WIFI, and PRO Z890-P WIFI motherboards.

As for MSI's upcoming B860 motherboard lineup, the Device Report lists the MPG B860M EDGE TI WIFI, MPG B860I EDGE WIFI, MAG B860 TOMAHAWK WIFI, and MAG B860M MORTAR WIFI motherboards.