CPU, APU & Chipsets News - Page 6
It looks like AMD could be working on an absolute stomping monster of a CPU with rumors that its next-gen codename Bergamo CPU rocking a huge 128 cores and 256 threads of Zen 4 processing power.
We did hear whispers of a 128-core, 256-thread EPYC CPU not too long ago now, up from the 96 cores and 192 threads expected on AMD's next-gen EPYC "Genoa" CPU. In that article, I explained: "new Zen 4-powered EPYC or Threadripper CPU with 128C/256T will also support up to 12-channel DDR5-5200 memory".
"The current mockups of the AMD Genoa CPU have it with 12 CCDs, so a tweaked chip (and real, not the mockup) with room for 16 CCDs would unleash the 128 cores and 256 threads, up from the 96 cores and 192 threads with the 12 CCDs mockup of Genoa".
What was once a rumor has now been confirmed: Intel will be adopting HBM (High Bandwidth Memory) and will be deploying it with its next-gen Sapphire Rapids CPU.
Intel's upcoming Sapphire Rapids CPUs will be deployed in two variants: one without HBM, and other variants with HBM. The new HBM-powered Sapphire Rapids CPUs are codenamed SPR-HBM, and will not be launching at the same time as the Sapphire Rapids CPUs without HBM.
Intel confirmed the news to AnandTech, where the company said: "Intel has stated to AnandTech that they are committed to making HBM-enabled Sapphire Rapids available to all enterprise customers and server vendors as well. These versions will come out after the main Sapphire Rapids launch, and entertain some interesting configurations. We understand that this means SPR-HBM will be available in a socketed configuration".
It seems like Intel has just kicked off the Xe-HPG graphics card marketing campaign, also confirming that it has begun shipping its next-gen DG2 family of GPUs.
The company has started inviting Odyssey Cardholders to register, where they might get their hands-on some Intel Xe-HPG related swag. Intel kicking off its journey and asking for gamers to join the company on its Odyssey, with the company saying they're "heading toward a milestone moment, the pending release of the Xe HPG microarchitecture from Intel".
Intel explains: "Thank you for joining Intel on this Odyssey. We are soon heading toward a milestone moment, the pending release of the Xe HPG microarchitecture from Intel. Some of you received an Odyssey card and were the first to engage with Intel on this journey".
Can you feel that? We're getting closer to Intel catching up to where AMD was a few years ago, with Intel's first-ever 7nm CPU not too far away now with Meteor Lake being teased again.
The latest on Intel's new Meteor Lake CPU is from the LGA18xx socket it will use, with @momomo_us sharing a new LGA17xx/18xx CPU socket. Intel's new 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" CPUs will be using the new LGA1700 socket, while Intel's next-gen 14th Gen Core "Meteor Lake" will move to the LGA18xx socket.
We heard about the new LGA1800 socket from Igor's Lab not too long ago, with Intel's new CPU socket introducing a new mounting system. We could see Intel not forcing consumers into that rabbit hole, and instead the new LGA1800 socket is for another series of CPU... we just don't know any of it for sure just yet.
If you want to stress test and benchmark your new CPU inside of 3DMark, you can now finally do just that with UL Benchmarks' latest update to 3DMark.
The new 3DMark CPU Profile will test your CPU performance, either in single or multi-threaded benchmarks where it will provide a score at the end and show you how your CPU performance will scale with the amount of cores and threads being used.
There's a full benchmark run included, but if you want to test individual CPU cores and threads then the other benchmark modes are there for you: the 16 threads test, 8 threads test, 4 threads and 2 threads test, and finally the single threads test. Each of these will test CPU performance to measure how good your CPU is for older games, normal performance, new games, and the computational intensive tasks (content creation, 3D editing, high-end gaming, etc).
AMD will have its RDNA 2 graphics architecture inside of Samsung's next-gen Exynos SoC, which is said to be revealed next month.
The new Samsung Exynos processor with RDNA 2 inside was meant to be unveiled this month but has been delayed according to leaker Ice Universe on Twitter. Samsung's next-gen Exynos processor will be offering ray tracing support as well as variable rate shading (VRS).
Samsung isn't so great on the CPU side of things, which is why the South Korean giant has reportedly been hiring architecture engineers from both Apple and AMD -- but with AMD providing its RDNA 2 GPU architecture to Samsung for the GPU side of its next-gen Exynos, this is going to be interesting.
The big silicon fight is only just beginning, with the likes of Apple, Samsung, Intel, Qualcomm, NVIDIA, AMD, and many others fighting for supremacy -- but Samsung is reportedly making some big, and very interesting (but expected) news.
The latest is that ARM's next-gen Cortex X series CPU cores are reportedly not meeting Samsung's high expectations, with Samsung and Qualcomm "turning their plans to a custom architecture development". As it stands, Samsung and Qualcomm license the CPU cores designed by ARM -- but both companies would be silly to not design their own CPU architectures.
Samsung did precious have an in-house team designing custom CPU cores, this was codenamed Mongoose which I wrote about back in August 2015. Samsung shut this division down not long after that, licensing CPU cores designed by ARM again for all of its phones including the flagship Galaxy S21 Ultra.
Intel won't be launching its next-gen Alder Lake-S platform and new flagship Z690 chipset until later this year in Q4 2021, and then after that, we have Raptor Lake-S with the even more next-gen Z790 chipset.
Both of Intel's new Z690 and Z790 chipsets will have the same LGA 1700 socket, with the new Z790 chipset launching alongside the Intel 13th Gen Raptor Lake-S CPUs dropping in Q3 2022. The new rumors are coming from PJ, an editor and reviewer with Uniko's Hardware.
The new Z790 chipset will support both the 12th Gen Core and 13th Gen Core CPUs, so if you buy a CPU later this year you'll be able to put it into a next-gen motherboard next year.
Up until now, we've been expecting AMD's next-gen Zen 4 architecture to have CPU cores topping out at the 96-core mark, but according to new rumors that's not the top -- 128 cores is the peak for Zen 4.
AMD's next-gen Zen 4 architecture will reportedly offer up to 128 cores and 256 threads, with the next-gen AMD EPYC "Genoa" CPUs offering up to 96 cores and 192 threads on the Zen 4 architecture. Genoa will still have 96 cores, but whatever this new CPU is, it won't be Genoa with its 128 cores and 256 threads.
A new Zen 4-powered EPYC or Threadripper CPU with 128C/256T will also support up to 12-channel DDR5-5200 memory. The current mockups of the AMD Genoa CPU have it with 12 CCDs, so a tweaked chip (and real, not the mockup) with room for 16 CCDs would unleash the 128 cores and 256 threads, up from the 96 cores and 192 threads with the 12 CCDs mockup of Genoa.
Intel's next-gen Alder Lake-S processors will reportedly be launching on October 25, 2021 according to the latest rumors.
The new "S1" processors will be launching first, with the Intel 12th Gen Core "Alder Lake-S" processors launching in full desktop form first -- with the new LGA 1700 socket, and 125W K-series CPUs. Most of these high-end Alder Lake-S processors will consume most of the volume "if not all" says Tom from Moore's Law is Dead, until 2022.
The flagship Core i9 processor will have 8 Golden Cove (GLC) and 8 Gracemont (GRT) cores for a total of 16 threads. The 8 Golden Cove cores are the high-performance CPU cores, while the 8 Gracemont cores are the high-efficiency cores.