CPU, APU & Chipsets News - Page 4
AMD's new 600-series chipsets will launch later this year, ready to handle the world of Zen 4 processors -- but just as excitingly -- DDR5 and PCIe 5.0 technology.
But with all these new features and technologies, normally it costs more... but it seems we might not be paying too much for B650 and X670 motherboards. In a new tweet, Tom @ Moore's Law is Dead teased: "I can now confirm two Prom21 chipsets cost less than one X570 chipset. AM5 platforms were designed to be cost-effective".
"Now, there are components that CAN make X670E more costly than X570, but there's little reason for B650 boards w/ PCIe 4.0 to cost more than B550". It looks like a new B650-based motherboard is going to be a monster value for money board, especially if you mixed it with a new Zen 4-based Ryzen 5 or Ryzen 7 series CPU.
Russia has now been locked out of buying any electronic components from Taiwanese companies that are over 25MHz, which is pretty much all modern electronics.
The United States, United Kingtom, and the European Union slapped Russia over the last few months with restrictions that saw the largest companies in Taiwan being the first to cut ties with Russia. Now... well now we have Taiwan's Ministry of Economic Affairs (MOEA) formally publishing a list of products banned from being exported to Russia and Belarus. Here are the restrictions from Taiwan:
- Has performance of 5 GFLOPS. To put it into context, Sony's PlayStation 2 released in 2000 had peak performance of around 6.2 FP32 GFLOPS.
- Operates at 25 MHz or higher.
- Has an ALU that is wider than 32 bits.
- Has an external interconnection with a data transfer rate of 2.5 MB/s or over.
- Has more than 144 pins.
- Has basic gate propagation delay time of less than 0.4 nanosecond.
The new list includes virtually all Taiwan-produced high-tech devices -- think anything fabbed by TSMC or any Taiwan-based company and inside of any Apple, AMD, NVIDIA, or Qualcomm device -- as well as the tools used to make the chips themselves, from being exported to Russia or Belarus.
Intel's new scalable chip design that uses x86 CPU cores and Xe GPU cores for supercomputing workloads, the new Falcon Shores XPU, has been detailed a little more at the International Supercomputing Conference (ISC 2022) in Germany.
The new Intel Falcon Shores XPU is described as a "New Tile-Based Flexible & Scalable Architecture" by the company, with three different configurations shown off: a completely x86 Tiled solution, an Xe GPU Tiled solution, and another that glues both x86 CPU cores and Xe GPU cores together on a single socket.
Intel is going with at least four Tiles on all of its Falcon Shores XPUs which matches the Tile layout of the Intel Sapphire Rapids Xeon CPU family, but then Intel is making some huge performance claims here. Falcon Shores XPUs will be delivering 5x the performance/watt, 5x the Compute density in x86 socket, and 5x memory capacity and bandwidth.
Apple's next-gen iPhone 14 will be released later this year, and inside we're looking at the new A16 SoC that will be made on TSMC's new 5nm process node according to industry analyst Ming-Chi Kuo.
In a flurry of new tweets, Kuo says that Apple's new A16 SoC will continue using TSMC's N5P process node -- which is the same as the current-gen A15 SoC. The reason? TSMC can't make enough chips on its next-gen N3 node this year in order to meet Apple's insatiable demand, while N4P is an improved variant of N5, going into mass production later this year.
Kuo states that the "significantly better N3 & N4P won't start mass production until 2023" and that "N5P & N4 are the latest technologies Apple can use" for their products in the second half of 2022, finishing off the first tweet with "N4 has no advantages vs. N5P".
AMD's new Mendocino APU specs have been leaked out, which will be the basis of future entry-level Athlon + Ryzen 5-powered laptops later this year.
The upcoming AMD Mendocino APU will reportedly pack a 4-core, 8-thread Zen 2-based CPU with RDNA 2 GPU cores, with the APU made on TSMC's fresh 6nm process node. AMD's new Mendocino APU is already powering AYANEO's new Air Plus handheld console, which launches later this year.
AMD is updating its Zen 2 CPU and RDNA 2 GPU cores in the Mendocino APU, optimized on the TSMC 6nm node, and adding 4MB of L3 cache. We're expecting up to 10 hours of battery life, with active cooling inside of future laptops expected as passive designs on Mendocino requires more engineering... and would increase the cost of the laptop to the consumer.
AMD has been out in a not-so-panicked damage control post-Computex 2022, where expectations of Zen 4 processors are kind of all over the place... until now. AMD is clearing things up, and now one of the biggest leakers of Zen 4 content is out with a monster new 40-minute video.
We've been hearing all sorts of crazy rumors about IPC performance on Zen 4, where all the way back in February 2021 we were fielding "around 40% faster" IPC performance over Zen 3 for the new Zen 4 architecture. AMD has said it'll be over 15%, but we know it'll be higher than that.
In his latest video, Tom @ Moore's Law is Dead says (beautifully): "other leakers have apparently been saying that it's (IPC) gonna be above 25%, 30%, 40% IPC and it's just fucking NOT gonna be that high, and so if AMD looks around and sees some of these fake leakers still get a lot of time on websites. They do not want people to be disappointed by say a 20-30% higher single-threading increase on high-end SKUs, a 15% or higher or higher single-threading increase on lower-end SKUs... they want you to be excited by that because that is a big gen-over-gen increase".
AMD had a mixed showing at Computex 2022 last week, but quickly -- and very efficiently -- controlled the situation with Director of Technical Marketing, Robert Hallock, putting out fires all over the internet with his Zen 4-powered fire extinguisher.
AMD CEO Dr. Lisa Su stood in front of a marketing slide that said Zen 4 would have ">15%" higher IPC (instructions per clock) while seeing max boost CPU clocks of "5GHz+". But then, proceeded to show a 16-core engineering sample of Zen 4 cranking at over 5.5GHz (5520MHz to be exact) in Ghostwire: Tokyo.
But now we have Tom @ Moore's Law is Dead chiming in with an awesome new, very lengthy (40 minutes) video that covers it all. At around the 11-minute mark, he talks about AMD and the job they've been doing to get ahead of the crazy leaks and expectations, he says: "other leakers have apparently been saying that it's (IPC) gonna be above 25%, 30%, 40% IPC and it's just fucking NOT gonna be that high".
AMD's next-gen Ryzen 7000 series CPUs will debut later this year, with the star of the show being the new Zen 4 architecture... but all of the new CPUs will have integrated RDNA2 GPUs by default.
The news was confirmed by AMD's Director of Technical Marketing Robert Hallock, who confirmed the news in some posts on Reddit. Hallock said: "IGP is standard. It's included on all 6 nanometer IO dies, which has a small number of compute units built in, specifically to enable video encode & decode and multiple display outputs".
"For enthusiasts, it will help diagnose a bad graphics card to get the system up and running when you're still waiting on the GPU to show up. The iGPU configuration [specifications] are consistent, and all of the CPUs will have it".
AMD's new Ryzen 7000 series CPUs will debut later this year, with previous rumors teasing a 170W TDP but that has now been cleared up by AMD's Robert Hallock.
The next-gen Zen 4-based architecture was teased in a 16-core prototype CPU at Computex 2022, but then Hallock cleared some things up on Reddit. Hallock explained: "The Computex processor was a 16-core prototype sample not yet fused to specific power/TDP values, but it was operating in a range below the new 170W TDP group we've developed. It's a conservative figure."
Hallock added: "The confusion stems from me misspeaking. I had misread some tech docs and got my wires crossed. Sorry to the community for that. Ryzen sockets are CPU_TDP*1.35 = PPT (maximum socket power). So 65W TDP = 88W PPT (no change from AM4), 105W TDP = 142W PPT (no change), and 170W TDP = 230W PPT (new option).
Amazon's new AWS Graviton3 CPU instances have reached Georgia, packing support for triple-sockets per motherboard: that's something you don't see every day.
The new Amazon AWS Graviton3 CPU offer up to 64 cores, dual DDR5 memory chips, 55 billion transistors, and over 25% higher performance/core vs. the previous-gen Graviton2 CPU. Amazon is using 7 chiplets on the AWS Graviton3 CPU: 4 memory channels that have 2 x DDR5 channels each, and then 2 x PCIe Gen5 chiplets.
ServeTheHome reports that AWS says the monolithic die + chiplet DDR5 controllers have more consistent latency than chiplet-based CPUs like Intel's Sapphire Rapids (4 main compute dies) and AMD EPYC.