CPU, APU & Chipsets News - Page 2
I don't know why you'd try to bother doing this thinking no one would see the 308 processors physically strapped to your body, but a Chinese citizen has been caught trying to smuggle Intel CPUs out of the country.
In total, the man had 308 processor strapped to him -- Intel's own 10th Gen Core i7-10700 and Intel Core i9-10900K processors. Chinese customs officials caught the person smuggling Intel CPUs over the Hong Kong-Macau border, with a suspicious-looking driver busted.
Chinese custom officials have had one driver attempt to smuggle 256 processors strapped to their legs and chest, while two weeks ago a separate CPU smuggling attempt had 52 hidden processors between seats -- this person was arrested. The two-week operation has at least 308 smuggled CPUs recovered, worth over $123,000+ but it could be much bigger than this -- we just don't know yet.
AMD is now powering more of the world's fastest supercomputers than Intel processors, with EPYC overtaking Xeon in a huge way.
During the ISC High Performance 2021 event, it was revealed that 3 out of the top 10 fastest supercomputers in the world are powered by AMD EPYC processors. AMD EPYC chips are inside of the Perlmutter (NERSC Lawrence Berkeley National Laboratory), Selene (NVIDIA), and JUWELS Booster Module (Forschungzentrum Julich FZH).
AMD EPYC processors are used in custom designs in all 3 of these supercomputers, while Intel Xeon processors are in just 2 of the top 10 fastest supercomputers.
We thought AMD's interesting 4700S desktop kit was based on the Xbox Series X APU, but it's not -- it seems it's based on the PlayStation 5 SoC instead.
Thanks to new photos by Bodnara, the new AMD 4700S desktop it is based on the Sony PlayStation 5 SoC which packs a CPU based on the AMD Zen 2 architecture with 8 cores and 16 threads of CPU power. There's also Hynix GDDR6 memory that is physically soldered onto the back of the Mini-ITX motherboard.
The AMD 4700S APU itself is on the AMD A77E Fusion Controller Hub (FCH) which is also used on the AMD A9-9820 system which is based on the Xbox One APU codenamed "Durango". VideoCardz explains that this is the reason everyone thought the AMD 4700S was based on the Xbox Series X APU.
We've been hearing more and more about Intel's new Sapphire Rapids platform, which was destined for beyond the consumer markets -- but not anymore, according to the latest rumors.
VideoCardz is reporting that Intel's new Sapphire Rapids HEDT platform will be succeeding Cascade Lake on the Glacial Falls platform, with the new Sapphire Rapids HEDT platform dropping somewhere in late 2022. But the more interesting fact here is that Intel is dumping the "X" chipset codenames with the new "W" series chipset.
Intel could launch its next-gen Sapphire Rapids HEDT platform for consumers alongside the release of the Raptor Lake CPU family, which will be dropping in the second half of 2022. The new W790 chipset could be a monster, but we're going to have to wait and see how that goes in at least 12 months from now.
It looks like AMD could be working on an absolute stomping monster of a CPU with rumors that its next-gen codename Bergamo CPU rocking a huge 128 cores and 256 threads of Zen 4 processing power.
We did hear whispers of a 128-core, 256-thread EPYC CPU not too long ago now, up from the 96 cores and 192 threads expected on AMD's next-gen EPYC "Genoa" CPU. In that article, I explained: "new Zen 4-powered EPYC or Threadripper CPU with 128C/256T will also support up to 12-channel DDR5-5200 memory".
"The current mockups of the AMD Genoa CPU have it with 12 CCDs, so a tweaked chip (and real, not the mockup) with room for 16 CCDs would unleash the 128 cores and 256 threads, up from the 96 cores and 192 threads with the 12 CCDs mockup of Genoa".
What was once a rumor has now been confirmed: Intel will be adopting HBM (High Bandwidth Memory) and will be deploying it with its next-gen Sapphire Rapids CPU.
Intel's upcoming Sapphire Rapids CPUs will be deployed in two variants: one without HBM, and other variants with HBM. The new HBM-powered Sapphire Rapids CPUs are codenamed SPR-HBM, and will not be launching at the same time as the Sapphire Rapids CPUs without HBM.
Intel confirmed the news to AnandTech, where the company said: "Intel has stated to AnandTech that they are committed to making HBM-enabled Sapphire Rapids available to all enterprise customers and server vendors as well. These versions will come out after the main Sapphire Rapids launch, and entertain some interesting configurations. We understand that this means SPR-HBM will be available in a socketed configuration".
It seems like Intel has just kicked off the Xe-HPG graphics card marketing campaign, also confirming that it has begun shipping its next-gen DG2 family of GPUs.
The company has started inviting Odyssey Cardholders to register, where they might get their hands-on some Intel Xe-HPG related swag. Intel kicking off its journey and asking for gamers to join the company on its Odyssey, with the company saying they're "heading toward a milestone moment, the pending release of the Xe HPG microarchitecture from Intel".
Intel explains: "Thank you for joining Intel on this Odyssey. We are soon heading toward a milestone moment, the pending release of the Xe HPG microarchitecture from Intel. Some of you received an Odyssey card and were the first to engage with Intel on this journey".
Can you feel that? We're getting closer to Intel catching up to where AMD was a few years ago, with Intel's first-ever 7nm CPU not too far away now with Meteor Lake being teased again.
The latest on Intel's new Meteor Lake CPU is from the LGA18xx socket it will use, with @momomo_us sharing a new LGA17xx/18xx CPU socket. Intel's new 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" CPUs will be using the new LGA1700 socket, while Intel's next-gen 14th Gen Core "Meteor Lake" will move to the LGA18xx socket.
We heard about the new LGA1800 socket from Igor's Lab not too long ago, with Intel's new CPU socket introducing a new mounting system. We could see Intel not forcing consumers into that rabbit hole, and instead the new LGA1800 socket is for another series of CPU... we just don't know any of it for sure just yet.
If you want to stress test and benchmark your new CPU inside of 3DMark, you can now finally do just that with UL Benchmarks' latest update to 3DMark.
The new 3DMark CPU Profile will test your CPU performance, either in single or multi-threaded benchmarks where it will provide a score at the end and show you how your CPU performance will scale with the amount of cores and threads being used.
There's a full benchmark run included, but if you want to test individual CPU cores and threads then the other benchmark modes are there for you: the 16 threads test, 8 threads test, 4 threads and 2 threads test, and finally the single threads test. Each of these will test CPU performance to measure how good your CPU is for older games, normal performance, new games, and the computational intensive tasks (content creation, 3D editing, high-end gaming, etc).
AMD will have its RDNA 2 graphics architecture inside of Samsung's next-gen Exynos SoC, which is said to be revealed next month.
The new Samsung Exynos processor with RDNA 2 inside was meant to be unveiled this month but has been delayed according to leaker Ice Universe on Twitter. Samsung's next-gen Exynos processor will be offering ray tracing support as well as variable rate shading (VRS).
Samsung isn't so great on the CPU side of things, which is why the South Korean giant has reportedly been hiring architecture engineers from both Apple and AMD -- but with AMD providing its RDNA 2 GPU architecture to Samsung for the GPU side of its next-gen Exynos, this is going to be interesting.