XBit Labs have just found out that AMD have received PCI SIG validation for their next-gen "RD790" chipset. This means that the company are now able to start shipping this core-logic to mainboard makers for production.
The RD790 chipset will support the new HyperTransport 3.0 bus with up to 2.6GHz clock-speed along with 42 PCI-E 2.0 lanes (two x16 lanes for graphics cards, one x4 lane to connect to I/O controller, one x4 lane for add-in boards and two x1 lanes for add-in cards).
For further information have a read of the article here.
Advanced Micro Devices has quietly validated its next-generation core-logic code-named RD790 with PCI special interest group (PCI SIG) which supervises implementations of PCI and PCI Express busses. The validation means that the company may start shipping its first high-end core-logic in years commercially to mainboard makers.
Earlier media reports claimed that AMD's RD790 north bridge supports HyperTransport 3.0 bus with up to 2.6GHz clock-speed as well as 42 PCI Express 2.0 lanes (two x16 lanes for graphics cards, one x4 lane to connect to I/O controller, one x4 lane for add-in boards and two x1 lanes for add-in cards). AMD RD790 is projected to be compatible with future microprocessors in AM2+ form-factor. The chip itself is rumoured to be made using 65nm process technology at a contract semiconductor manufacturer.
Last updated: Dec 4, 2019 at 01:47 pm CST
- How publishers will approach current-gen on PS5, Xbox Series X
- PCI Express 6.0 spec reaches rev 0.3, final due in 2021, up to 256GB/s
- Xbox Series X may be more powerful, but will third-party devs use it?
- Xbox Series X's Smart Delivery may let you custom install games
- Next-gen console exclusives will be few and far between through 2021