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Our first look at Intel's sixth generation Core processor: Skylake

Intel's upcoming Skylake platform gets detailed, will feature DX12 support, DMI 3.0, and three new chipsets: Z170, H170, and H110

By: Anthony Garreffa from Apr 16, 2015 @ 0:38 CDT

The first few details of Intel's upcoming sixth generation Core processor have arrived, with Skylake shaping up nicely so far. Skylake is coming this year, but we haven't known many details on the new architecture until now.


WCCFTech has found some slides, with PC Perspective going over them and showing us that Intel's codename Skylake will arrive as the LGA 1151 socket. We will be greeted with three new chipsets, the Z170, H170 and H110, too. Intel has built Skylake on its 14nm process, which is the same node that Broadwell was made on, but it will feature a new microarchitecture for both the IA cores, and the graphics system.


Skylake will have support for both DDR3L and DDR4 RAM, with enthusiast systems pushing toward the latter. We should see an enthusiast focused 95W quad-core SKUs that will be capable of overclocking, as well as "enhanced" BCLK overclocking with Intel using the term "full range" which means we might not see a wall of 125MHz.


PC Perspective notes that DMI 3.0 is featured, with DMI 3.0 being "the connection between the processor and the chipset, sees the first increase in bandwidth in many generations". DMI 3.0 has twice the bandwidth of DMI 2.0, with up to 8 GT/s available to it, which will see enthusiasts not bottlenecked by super-fast PCIe-based storage devices.

Intel's new 100-series chipsets will include the Z170 which is a consumer-focused chipset with all the bells and whistles, the H170 which is shaping up to be a blend of consumer/corporate, and then the mid-range H110 chipset for consumers once again. Skylake continues to provide just 16 PCIe 3.0 lanes, in either one x16, two x8, or one x8 and two x4 connections. The DDR3L and DDR4 will work in dual-channel, too.


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