The future of smart device cameras could lay with Toshiba, as the company announced this week the industry's thinnest CMOS image sensor camera module for next-generation smartphones and tablets.
Toshiba's new sensor is just 4.7mm high, and will allow companies to bake in high-end 13-megapixel cameras in an ultra-thin frame. Andrew Burt, vice president of the Analog and Imaging Business Unit, System LSI Group at TAEC has said:
Toshiba once again proves its technical expertise in the development of this ultra-low height module enabling customers to create the thin, attractive mobile products that consumers have come to expect. Our strategy of continuous innovation and enhancement to the TAEC systems offering, especially for the camera/imaging markets, provides the technology solutions that will drive thinner mobile devices without compromising picture quality or performance.
Toshiba's new CMOS image sensor camera module will be available to manufacturers starting next month.
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