The Intel Developer Forum is a popular event for those who want to learn about the newest Intel technologies as well as those who want to interact with Intel's ecosystem of partners.
Many new technologies are highlighted throughout the venue, and IDF (Intel Developer Forum) is usually where certain products are launched and recently released products are showcased. I was at this year's IDF in San Francisco and I saw some ground breaking products and had some hands-on experience with recently launched platforms.
I saw everything from the new Core M (Broadwell) to Haswell-E under liquid nitrogen. Brand new Thunderbolt technologies, DDR4, storage, and even robotics were to be found on the showroom floor. Let's continue on now as I show you what I saw during the event.
Intel invited us to their private suite to showcase and benchmark their newest processor lineup, the Core M, which uses Intel's Broadwell micro-architecture. We also saw a pretty cool Dell tablet with RealSense, as well as Intel's new high-end desktop platform, Haswell-E.
This actually is an Intel Atom Z3500 powered Android based tablet from the Dell. The Dell Venue 8 7000 carries two really cool features, an 8.4" 2K (2560x1600) OLED display and a RealSense camera, which is capable of capturing 3D images. This tablet features four cameras, the one on the front is good enough for selfies, yet on the back there are three cameras which feature RealSense technology.
The rear facing cameras take the same image, and with three slightly different viewpoints, they are able to give depth to images. This makes it possible to print 3D images you take with this device.
This is a Broadwell based Core M powered tablet; it doesn't have a codename, however, it is based on a modified Llama Mountain platform. It carries a Core M 5Y70, which was benchmarked right in front of us, to display how much faster it was than Atom. What is really amazing about this processor is the amount of processing power it packs into a CPU with a TDP of only 4.5W. This device is actually cooled through its back plate.
The backplate is high grade aluminum and acts as a giant heat sink. A 4.5W TDP isn't high at all; it's close to the TDP of certain Intel chipsets on the desktop platform. They also had black plates plated in gold and one made of copper on display as well.
Here you can see how thin it is.
Futuremark 3DMark Ice Storm was run and the Core M scored 50985.
CINEBENCH R11.5 scored a 16.96, and in SunSpider, it scored 142.8 - all these scores are quite impressive for a 4.5W part. This type of performance jump in the mobile sector parallels that of the jump to Core2 from Pentium D, when Conroe was launched. Core M is supposed to be the big step up from Atom.
A Core M based system is on the right and Atom is on the left. Intel demoed a comparison of Atom to Core M putting 75 images into a virtual tour in Google Earth. This took a lot of processing power using Adobe Lightroom and Google earth. I could easily see that rendering the images was much faster on the Core M (almost twice as fast), and that the end result in Google Earth was a seamless virtual tour. The Atom's virtual tour couldn't compare, it was even choppy at certain times compared to the Core M.
Intel showcased a customized MakerBot 3D printer and they were showcasing how much faster Core M was compared to the Atom. They actually used a 3D image of one of their performance engineers who was present in the room, taken with a RealSense camera, and printed it for us. Slicing refers to the process in which the computer code is translated into 3D printer code, this process takes a long time with a slow machine and it's multi-threaded if you use the latest slicing programs.
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