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ASRock Z170 OC Formula (Intel Z170) Motherboard Review

By: Steven Bassiri | Socket LGA 1150/1151 in Motherboards | Posted: Sep 9, 2015 2:24 pm
TweakTown Rating: 92%Manufacturer: ASRock

Thermal Imaging and Power Consumption

 

System power usage is measured at the AC/DC PSU (the Corsair AX1200i) which I have connected to another system to measure the test system, and as a backup I have a wall meter to verify. The CPU power is measured through the 8-pin connector, which is hooked up to a hall effect IC, which measures current and puts out a voltage in proportion to the current. That voltage is logged by a National Instruments ADC, which logs the DC voltage level that I then convert into current.

 

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Note on Thermal Images: In the temperature section, we use our Seek thermal imaging camera to capture the surface temperatures of major components on the board. I look at the VRM and then all other things that light up the screen. If there is something to worry about, then I will state it, otherwise I will just show the hotter running parts of the board for fun. Unless some component is over 80-90C, then there really isn't anything to worry about.

 

 

All systems will act differently, so I will look for commonalities, such as how far from the VRM the heat spreads through the PCB and the difference in temperature between the front side and backside of the PCB. Keep in mind, the majority of the heat from the VRM goes into the PCB as it is a giant soldered on copper heat sink. A larger difference in temperature between the back and front of the PCB points towards a more effective heat sink.

 

Thermal Testing at Stock Speeds:

 

The image on the left is always at idle and the image on the right is at load. During ALL TESTS, fans above the VRM that cool the CPU cooler's (Corsair H110i GT) radiator are turned on to high (12v).

 

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Full frontal.

 

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Up-close of the front of the VRM.

 

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Up-close of the back of the VRM.

 

 

Thermal Testing at 4.5GHz Overclocked Speeds:

 

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Full frontal.

 

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Up-close of the front of the VRM.

 

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Up-close of the back of the VRM.

 

The VRM on the Z170 OC Formula is one of the better ones I have seen on a Z170 motherboard. The heat sinks work very well to dissipate heat; the back of the PCB doesn't even increase in temperature much from idle to load conditions at stock. Temperatures all around are pretty low compared to other Z170 motherboards I have tested and it does seem like power savings modes are enabled at idle. The temperatures when overclocked are basically what I have seen on many motherboards at stock. Overall, the Z170 OC Formula has an excellent VRM.

 

Anything under 60C is great, 60-80C is acceptable, and anything above 80C is a bit worrisome (if at stock).

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