The main supporting features of the X10DRL-CT are its compact size that enables it to fit into short depth server cases and the LSI 3108 SAS3 controller. Large arrays of up to 16 drives can be installed with special options available on request. AHCI & SCU SATA3 (6Gbps); RAID 0, 1, 5, 10 options are also available through the C612 Chipset that further expand storage capabilities.
We only received the X10DRX motherboard for our tests. The retail package should contain:
- Two (2) SATA Cable 61CM FLAT S-S PBF (CBL-0044L)
- Two (2) Internal Mini-SAS HD to Mini-SAS HD cables, 80cm, 30AWG, 12Gb/s (CBL-SAST-0531)
- One (1) I/O Shield (MCP-260-00062-1N)
- One (1) Quick Reference Guide (MNL-1620-QRG)
Optional accessories are:
- Heat Sinks
- TPM security module - TPM module with Infineon 9655, RoHS/REACH, PBF; Vertical or Horizontal depending on the server layout and expansion cards used
- SuperDOM - Supermicro SATA DOM Solutions
Here we get a look at the block diagram of the X10DRL-CT motherboard, which shows how all the input and output devices connect to the C612 chipset.
Here we get our first look at the X10RL-CT workstation motherboard. With a size of 12" x 10" (30.48cm x 25.4cm), this is a very compact motherboard for a dual CPU system. The X10DRL-CT is the smallest 2P board we have seen in the lab.
For a small board like this the number of RAM slots needed to be cut down, but that has positive effects on RAM speed and bandwidth. In addition, a limited number of PCI-E slots could be installed on this board, but its primary system is one like SYS-1028R-MCT which is a 1U short depth server. The X10DRL-CT also sports Dual 10GBase-T LAN with Intel X540 Ethernet controllers for fast network connections.
Here we see the PCIe slots, which are:
- 1x PCI-E 3.0 x16 slot
- 2x PCI-E 3.0 x8 slot
At the top of the board, we see the heat sink for the Intel X540 Ethernet controller, and down in the middle area is the heat sink for the Intel C612 chipset. There are also 4x SATA 3.0 ports along the left edge.
Now we are looking at the lower left side of the motherboard now. Here we see the large heat sink for the LSI 3108 SAS3 controller and its associated mini SAS ports along the bottom. The orange SATA ports also support SATA DOM (Device-on-Module) devices.
Here we are looking at the upper right section of the motherboard. There are only 2x fan headers located here, this area is not cluttered and should provide good clearance for heat sinks.
The lower right side of the motherboard has its main power connectors over on the right edge on the motherboard. The three main power connectors are grouped into one tight area here. They are orientated so the release pin on the power connector is within easy reach and not a problem to remove. Fan headers are located on the edge and provide easy access. Again, we see nice clean areas that help to keep the board running cool.
Now we are looking at the back I/O ports. At the left, we see a VGA port. Next, we find 2x USB 3.0 Ports and an IPMI dedicated LAN port just above. Following that, we have 2x 1GB LAN ports. Then we find 2x 10GB Ethernet ports.
This is a close up of the new Socket 2011 R3. As you can see, it looks very much like the normal Socket 2011 that we have seen on past boards. However, last gen processors will not fit this new socket because it has a different pin configuration and notches inside the socket will only work on the new Haswell-EP E5-2600 v3 processors. The mounting holes for heat sinks are the same compared to those used on Socket 2011 systems so you should have no problems using those heat sinks. The CPU socket area here is very tight, passive heat sinks that would normally be used have plenty of clearance, but if you decided to use non-Supermicro heat sinks, be sure to check if you will have fan clearance in the middle.
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