HGST SSD800MH Internals
The HGST Ultrastar SSD800MH comes in a robust 2.5-inch metal casing with a 15mm z-height.
The dual-PCB architecture is fastened internally to the molded casing with four additional screws. Thick thermal pads are placed on each component to facilitate heat transfer.
The daughterboard is slightly smaller than the main board, and it has a cutout for the inline electrolytic capacitor. HGST SSDs uses a single capacitor connected to the PCB to provide power hold-up in the event of power loss. This power-loss protection approach is similar to the method employed with the latest Intel SSDs. These capacitors handle high heat environments and have a longer average life than supercapacitors.
The HGST/Intel collaboration is apparent with the Intel logo emblazoned on the PCB, controller, and NAND. The two connectors on each PCB mate to provide communication between the main PCB and the daughterboard. The main PCB houses the controller, DRAM, and NAND. The daughterboard only hosts NAND packages. There is 1GB of SDRAM to the left of the controller.
There are twenty 16GB and twelve 32GB 25nm MLC NAND packages, for a total of 704GB, of which 372GB is user-addressable. This heavy amount of overprovisioning provides incredible endurance and improves performance consistency.
HGST and Intel jointly developed the surprisingly small 12-channel DB29AA11AB0 controller, and the associated firmware, that powers the drive.
HGST SSD800MH Specifications
The SSD800MH features a read error rate of less than 1 LBA per 10^17 bits transferred, an MTBF of two million power-on hours, and a 0.44 percent AFR. The drives support variable sector sizes of 512B, 520B, 528B, 4096B, and 4224B. TCQ support is standard, and the drive features adaptive read-ahead algorithms.
TCG encryption, crypto sanitize, and TCG + FIPS-certified models are also available, and they retain the same performance specifications.