HGST Ultrastar SSD800MM Internals
The HGST SSD800MM comes in a 2.5" form factor with a 15mm Z-height. The case is a very hefty metal build that has a simple sticker identifying the SSD800MM as Sunset Cove Build 2.5. The bottom of the case is unremarkable with a single sticker identifying the part number. Upon removing the case, we observe the PCB secured with four additional fasteners. There are thick thermal pads on either side of the PCB to wick away heat from the NAND, DRAM and controller.
The SSD800MM features nine emplacements of 25nm Intel eMLC NAND on each side of the PCB. There are also two Micron DDR3-1600 DRAM chips totaling 1GB for internal drive functions. The HGST/Intel cooperation is apparent in the build of this SSD with the Intel logo emblazoned on the PCB, controller and NAND.
We typically observe arrays of Tantalum capacitors in many enterprise SSDs, but the HGST SSD uses a single capacitor connected to the PCB to provide for power hold-up in the event of power loss. This power-loss protection approach is similar to the method employed with the latest Intel SSDs.
The 25nm eMLC comes in 18 x 32GB packages, providing a total of 576GB of raw NAND. The unformatted capacity of the SSD totals 400GB of addressable space with 44% overprovisioning.
HGST and Intel jointly develop the surprisingly small 12-channel DB29AA11AB0 controller and firmware.
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