The VIA C3 CPU is designed for the value PC. It supports all major x86 decode instructions which we see in current Intel and AMD processors. This new CPU is aimed for Internet, office and very light gaming. Featuring a highly efficient Dynamic Power Caching Architecture, the VIA C3 processor provides the optimum balance of performance and low power consumption for Information PCs, notebooks and Information Appliances while retaining the flexibility and upgradability afforded by full plug-in compatibility with the Socket 370 interface. Running at speeds of 500MHz to 1.0GHz, the VIA C3 processor is primed to optimize your Internet computing experience with enhanced features such as a 128KB full-speed Level 1 cache, 64KB full speed Level 2 cache and a 100/133MHz Front Side Bus. Multimedia performance is further boosted by the processor's support for 3DNow! and MMX technology.
The VIA C3 processor was designed by VIA's Centaur Technology Team located in Austin, Texas and is built using a state-of-the-art 0.15 micron fabrication process which maximizes processor core speeds while minimizing power consumption. The VIA C3 processor uses a core voltage of 1.5v which allows the VIA C3 CPU to run virtually cold. Now with the Ezra T core we see VIA reduce the CPU core to 0.13 micron and a low power profile of 1.35v making this CPU run even cooler at higher clock speeds than its previous C3 brothers. The VIA C3 CPUs can be run in a system without the need for a fan on the processor which means you can have your computer running in virtual silence. Because of this, the VIA C3 has become a viable mobile solution due to its low power consumption and excellent heat dissipation.
Ezra T core processors have started at 1.0GHz and will continue to grow until further developments in fabrication become available. Below is a table with the current VIA C3 lineups compared to the AMD Duron CPU so you can get a perspective of their designs.
Now we take a look at the Ezra and Ezra T CPU side by side.
You can see by this that VIA has made some changes to the Ezra T. Resistors have been placed on the outer surface of the CPU. Most likely this is what controls the VIA C3 multipliers.
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