Mushkin has gone with a simple package design; the ever popular plastic see-through blister encases two memory modules. And thanks to its see-through nature there is no need for it to have any pictures on the back of the package. This blister pack separates very easy and is held together with simple staples, so you're not going to have your hands destroyed trying to open it.
Removing the modules from the package, we get our first real look at them. One thing for certain, these modules are heavy. This is in part due to the new heatsink design that Mushkin is using on the XP3 series of modules. The new heatsink design is what Mushkin calls its Copper Enhanced Vapour Chamber Interface (what a mouthful that is).
The modules are encased in a multi-layer heatsink comprised of copper, alloy and a special vapour channel zone that works in concert to keep the modules as cool as possible. All of this is encased onto the modules and is no thicker than a standard copper heatsink that comes standard on modules today. This means you can still have four modules of the same design into a board with close proximity memory slots.
On one side of each module (two in this pack) Mushkin has a sticker that gives the buyer information on the modules specs. The kit we were supplied with contained two pieces, 1GB in density. The modules are designed to run at PC3-16000 or 2000MHz using 9-9-9-24 timings at 1.9v. These are the specs for use on 790i SLI chipsets and not guaranteed to run on the Intel chipsets. However, we aren't content to just follow the rules here.
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- Page 1 [Introduction]
- Page 2 [The Package and Modules]
- Page 3 [Overclocking]
- Page 4 [Test System Setup and Everest]
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