SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced its new XR-DIMM small form factor DDR3 module, specifically designed for ruggedized single board computing (SBC) applications requiring high reliability, density and performance attributes.
SMART's XR-DIMM solves the traditional space-constraint issue for Advanced Memory Card (AMC) form factor SBC's, where the clips from the horizontally mounted SO-DIMM's socket violate the "keep-out" areas of the card and interfere with the system chassis when the AMC card is removed. The XR-DIMM solves this issue by using a low profile, snap-down mezzanine connector with no clips. In addition, SMART's XR-DIMM form factor provides a ruggedized attach method and features improved signal integrity ideal for AMC cards, as well as ATCA, PCIe, and COMe embedded computing applications.
The 240-pin module conforms to standards established by the Small Form Factor Special Interest Group (SFF-SIG) to provide a perfect-fit solution for telecom, networking and industrial computing applications. SMART's DDR3-1600 XR-DIMM is offered in 2 GB, 4 GB and 8 GB densities with ECC. Other options offered include low power and industrial temperature operation.
"The XR-DIMM's higher 240-pin connector offers more power and ground signals for higher reliability, and, improved signal integrity versus a standard 204-pin SO-DIMM," says Mike Rubino, Vice President of Engineering at SMART Modular. "In addition, the board-to-board connector offers improved ruggedization compared to standard gold plated SO-DIMMs."
The XR-DIMM is just part of a wide family of DDR3 small form factor module solutions that SMART supports. SMART will be showcasing its new XR-DIMM along with its entire line of memory solutions at the Embedded World Exhibition & Conference in Nuremburg, Germany starting on February 25, 2014 in Hall 4, Stand 4-360.
Latest News Posts
- XIGMATEK pushes its a bright red power supply to market, the S550
- Ubisoft learns from Watch Dogs, shows games on 'target machines' at E3
- AMD financials continue to decline, even with the launch of Fury X
- Sony rumored to unveil its new Xperia Z5 smartphone in September
- LG uses Advanced In-Cell Touch technology for next-gen laptop screens
- ICY DOCK Black Vortex MB174U3S-4SB USB 3.0 Storage Enclosure Review
- C2750D4I: EFI firmware bug?
- ASRock X99 OC Formula/3.1 (Intel X99) Motherboard Review
- Custom Bios (ASRock X99 Extreme6 3.1 ?
- Samsung 850 EVO and 850 PRO 2TB SSDs Review
- GELID Announces Polar 1U Low-profile CPU Cooler for Intel LGA115x
- Transcend Announces StoreJet 35T3 8TB USB 3.0 External HDD
- Samsung Electronics Leads Consumers into the New Era of Multi-Terabyte SSDs with Launch of 2-TB 850 PRO and 850 EVO
- AMD and Dell Support Bioinformatics Studies at University of Warsaw in Poland
- IBM, NVIDIA and Mellanox Launch Design Center for Big Data and HPC