Cadence Design Systems, Inc., today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications. The deep collaboration, beginning earlier in the design process than usual, will effectively address the design challenges specific to FinFETs -- from design analysis through signoff -- and will deliver the infrastructure necessary to enable ultra low-power, high-performance chips.
FinFETs help deliver the power, performance, and area (PPA) advantages that are needed to develop highly differentiated SoC designs at 16 nanometers and smaller process technologies. Unlike a planar FET, the FinFET employs a vertical fin-like structure protruding from the substrate with the gate wrapping around the sides and top of the fin, thereby producing transistors with low leakage currents and fast switching performance. This extended Cadence-TSMC collaboration will produce the design infrastructure that chip designers need for accurate electrical characteristics and parasitic models required for advanced FinFET designs for mobile and enterprise applications.
"The FinFET device requires greater accuracy, from analysis through signoff, and that is why TSMC is teaming with Cadence on this project," said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. "This collaboration will enable designers to use the new process technology with confidence earlier than ever before, allowing our mutual customers to meet their power, performance and time-to-market goals."
"Producing the design infrastructure necessary for these types of complex, groundbreaking processes requires close collaboration between foundries and EDA technology innovators," said Chi-Ping Hsu, senior vice president, Silicon Realization Group at Cadence. "In joining with TSMC, a leader in FinFET technology, Cadence brings unique technology innovations and expertise that will provide designers with the FinFET design capabilities they need to bring high-performance, power-efficient products to market."
Recommended for You
Latest News Posts
- Facebook pays up to $3 million per ep for original shows
- Intel's next-gen 6C/12T: competes with AMD Ryzen 5 1600X
- Microsoft sees 32TB of unreleased Windows builds leaked
- SpaceX successfully lands second Falcon 9 in 48 hours
- Nintendo expected to double current fiscal year profits
- modded my x79-ud3 bios, processor support question
- The Mummy Movie Review
- Computer freeze and audio buzz issue
- AZZA Photios 250 Mid-Tower Chassis Review
- Team T-Force Dark ROG DDR4-3000 16GB Memory Kit Review
- Logitech Circle 2 will be compatible with Amazon Echo Show
- Synology introduces DiskStation DS1517 and DS1817
- Deep Silver and 4A Games are proud to announce Metro Exodus
- Microsoft premieres Xbox One X, world's most powerful console
- Phison gears up for mobile phone market with PS8226 3D NAND eMMC 5.1 controller