Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced a next-generation 64 GB embedded multimedia card (eMMC) using 10 nanometer (nm)-class process technology. The new 64 Gb NAND memory went into production late last month.

Myungho Kim, vice president of Memory marketing, Device Solutions, Samsung Electronics noted, "The new high-speed, small form factor eMMC reinforces Samsung's technology leadership in storage memory solutions. We look forward to expanding our line-up of embedded memory solutions in conjunction with the new chip's design, in pursuing a system-level adoption of application processors and other key components that form the foundation for the most advanced mobile platforms. This will allow us to better attend to time-to-market demands enabling the design of more convenient features for next-generation mobile applications."

Embedded memory is the key memory component in popular mobile applications such as smartphones and tablets. Advanced high-performance, high-density eMMCs allow users to access high-density and high-resolution content such as full HD video on their latest mobile devices and provide a better user experience for web browsing, gaming and running rich applications.

Samsung is applying 64 Gb high-performance NAND memory using its 10 nm-class technology to the new 64 GB eMMC Pro Class 2000 memory solution. The new embedded memory solution exceeds the performance levels of the conventional 64 GB eMMC Pro Class 1500 based on an eMMC 4.5 interface.

The new high-speed eMMC will be submitted next year to the industry standards body JEDEC, (Joint Electron Engineering Council) for adoption as an industry standard.

Samsung's next-generation 64 GB eMMC Pro Class 2000 comes just five months after the company introduced its first embedded memory supporting the eMMC 4.5 interface and delivers a 30 percent advantage in performance over that solution.

The 10 nm-class technology based NAND also is process compatible to Samsung's advanced 20 nm-class 64 Gb MLC NAND, which was first available last May, improving manufacturing productivity by 30 percent.

The new memory solution has a random write speed of 2,000 IOPS (input/output per second) and a random read speed of 5,000 IOPS. In addition, sequential read and write speeds are 260 megabytes per second (MB/s) and 50 MB/s respectively, which is up to 10 times faster than a class 10 external memory card that reads at 24 MB/s and writes at 12 MB/s, greatly enhancing the smoothness of multitasking on mobile gadgets.

Current mobile applications show a distinctive trend to slimmer designs and larger display screens, while using advanced multi-core processors and high density (2 Gigabyte) LPDDR2 memory for higher performance, with larger batteries for longer usage on a single charge. This new chip accommodates the increasing size limitations of mobile form factors at the component level.

The 64 GB eMMC Pro Class 2000 measures 11.5 mm by 13 mm, which represents a 20 percent reduction in size over the conventional embedded memory form factor (12 mm by 16 mm).