Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced development of its first fully functional DDR4 DRAM module. The company has begun sampling and has received feedback from major customers to support quick implementation for applications in 2013.
It is expected that the enterprise and micro-server markets will take full advantage of the new features and specifications designed into DDR4, accelerating early adoption of the technology. In addition, the fast-growing ultrathin client and tablet markets will also benefit from new opportunities enabled by the power savings and performance features of Micron's DDR4.
Codeveloped by Nanya and based on Micron's 30-nanometer (nm) technology, the 4-gigabit (Gb) DDR4 x8 part is the first piece of what is expected to be the industry's most complete portfolio of DDR4-based modules, which will include RDIMMs, LRDIMMs, 3DS, SODIMMs and UDIMMs (standard and ECC). For the soldered down space, x8, x16, and x32 components will also be available, with initial speeds up to 2400 megatransfers per second (MT/s), increasing to the JEDEC-defined 3200 MT/s.
"With the JEDEC definition for DDR4 very near finalization, we've put significant effort into ensuring that our first DDR4 product is as JEDEC-compatible as it can be at this final stage of its development," said Brian Shirley, vice president for Micron's DRAM Solutions Group. "We've provided samples to key partners in the market place with confidence that the die we give them now is the same die we will take into mass production."
As JEDEC finalizes the DDR4 specifications, Micron is positioned to quickly become fully compliant with its 30 nm 4 Gb DDR4 part. Full sampling to key partners began earlier this year and volume production is planned for 4Q12.
Latest News Posts
- AMD financials continue to decline, even with the launch of Fury X
- Sony rumored to unveil its new Xperia Z5 smartphone in September
- LG uses Advanced In-Cell Touch technology for next-gen laptop screens
- GIGABYTE Z170 motherboards teased, with a super-hot new look
- Samsung pushes the SSD game with 2TB 850 Evo and 850 Pro additions
- ICY DOCK Black Vortex MB174U3S-4SB USB 3.0 Storage Enclosure Review
- C2750D4I: EFI firmware bug?
- ASRock X99 OC Formula/3.1 (Intel X99) Motherboard Review
- Custom Bios (ASRock X99 Extreme6 3.1 ?
- Samsung 850 EVO and 850 PRO 2TB SSDs Review
- GELID Announces Polar 1U Low-profile CPU Cooler for Intel LGA115x
- Transcend Announces StoreJet 35T3 8TB USB 3.0 External HDD
- Samsung Electronics Leads Consumers into the New Era of Multi-Terabyte SSDs with Launch of 2-TB 850 PRO and 850 EVO
- AMD and Dell Support Bioinformatics Studies at University of Warsaw in Poland
- IBM, NVIDIA and Mellanox Launch Design Center for Big Data and HPC