Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the DRAM industry's first-ever use of high-k metal gate (HKMG) technology to develop a 2-gigabit DDR2 Mobile RAM (LPDDR2) at the 40nm-class DRAM node.
HKMG is technology that uses insulator film with a high dielectric constant (abbreviated to "high-k," a semiconductor industry measure of how much charge a material can hold) in the transistor gate to reduce current leakage and improve transistor performance. Metal gate electrodes that are required for the high-k dielectrics process are also used. Some makers of logic semiconductors have started to use HKMG, but higher heat treatment temperatures after HKMG formation and complicated DRAM structural characteristics have prevented consistent application in the DRAM fabrication process. Elpida, however, has managed to lower the heat treatment load and overcome certain memory device structural complications.
In producing the new DDR2 Mobile RAM, HKMG technology is able to reduce the electrical thickness of the gate dielectric in the transistor by around 30% compared with a conventional silicon oxide dielectric. The technology also raises DRAM performance by increasing transistor-on current by as much as 1.7 times compared with a silicon oxide film. Transistor-off current can be lowered to less than 1/100th of existing levels, thereby drastically reducing energy consumed in standby mode of DDR2 Mobile RAM.
Elpida plans to apply HKMG technology to produce faster and more energy efficient Mobile RAM devices, the company's mainstay product area.
In addition, Elpida will continue to evaluate and improve HKMG in order to apply the technology at the 30nm and 25nm nodes. Sample shipments of products are planned for FY 2011, with volume production to follow.
Latest News Posts
- Naughty Dog announces March 18, 2016 release for Uncharted 4 on PS4
- Google is trying to make 4K video less demanding on your connection
- FBI says companies lost $1.2B due to email scams since October 2013
- Qualcomm's next chip will use machine learning to detect malware
- Intel teases 100TB or larger SSDs for 2020
- Kingston DataTraveler microDuo 3C USB 3.1 Type-C Flash Drive Review
- PC-Q01/PC-Q03 Sizing Questions
- USB 3.0 header availability for PC-C37?
- Clean install windows 10 after being an insider
- Corsair Hydro H110i GTX High Performance Liquid CPU Cooler Review
- CYBERTRONPC ANNOUNCES SMALL FORM FACTOR SYSTEM WITH AMD R9 NANO GRAPHICS CARD
- SilverStone Storage Devices - Mobile Series - MS08
- ASRock Z170 OC Formula Sets More Records at IDF 2015 San Francisco!
- ATTO Technology to Display Network and Storage Connectivity Portfolio at VMworld 2015
- SilverStone Accessories - Expansion Cards - ECM20