USB-IF Advances SuperSpeed USB Ecosystem with Latest Product Certifications
Award-winning companies and devices demonstrate growing SuperSpeed USB adoption
LAS VEGAS - January 4, 2011 - The USB Implementers Forum (USB-IF) today announced the growth of the SuperSpeed USB (USB 3.0) ecosystem with the latest wave of certified devices. The number of certified products increased tenfold in the past year to 165, delivering advanced interface capabilities to consumers worldwide. Among the certified devices are new products from award-winning companies including DisplayLink and Fresco Logic.
"Demand for the next-generation of the USB interface has created a groundswell in certified devices, driving down cost and creating a highly competitive ecosystem," said Jeff Ravencraft, USB-IF President & COO. "Consumers look for speed and ease-of-use with device connectivity, and SuperSpeed USB meets these expectations today."
Several SuperSpeed USB products and developers have been recognized recently for their innovation and engineering excellence. Recipients include:
DisplayLink's SuperSpeed USB chip platform, Best of CES Innovations 2011 Design and Engineering Award Honoree
Fresco Logic, EE Times' "Silicon 60" List of Emerging Startups
Synopsys DesignWare SuperSpeed USB 3.0 IP, EDN Innovation Awards
Western Digital Technologies, Inc. My Book 3.0, Mir PC Technical Innovation Award
"With 165 certified devices currently available, SuperSpeed USB represents a competitive market with expanded options available to consumers," said Brian O'Rourke, In-Stat Principal Analyst. "SuperSpeed USB has witnessed remarkable industry advancement due to the performance enhancements it offers consumers and manufacturers alike. We look forward to seeing what the next 12 months will bring."
To learn more about SuperSpeed USB technology or how to become a USB-IF member, please visit http://www.usb.org.
About SuperSpeed USB
SuperSpeed USB brings significant performance enhancements to the ubiquitous USB standard, while remaining compatible with the billions of USB enabled devices currently deployed in the market. SuperSpeed USB will deliver up to 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. The USB 3.0 specification was developed by the USB 3.0 Promoter Group which consists of Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST-Ericsson and Texas Instruments.
Latest News Posts
- Facebook is investing considerably into AI and VR technologies
- AMD partners up with Hollywood on all things VR
- Unity CEO: VR to create 'staggering orgasm of the new'
- Fable Legends game director discusses DLCs with TweakTown
- Microsoft boss says Xbox 'needs to do better' in European markets
- Problem with Overclocking
- Thermaltake Commander FT Touchscreen Fan Controller Review
- How Do I Open The RAM Slot - X555LA Laptop
- LG G4 vs. Samsung Galaxy S6 edge - The Battle of Android
- BIOS Disk Boot Option settings don't hold (GA-Z97X-UD5H-BK)
- Marble Monster is intensively addicting and action packed!
- ROCCAT Announces Taito Control Gaming Mousepad
- Lite-On Introduces Low Latency M.2 PCIe SSDs for Cloud Vendors
- Ozone Gaming Announces ORIGEN Mousepad
- PNY Launches the Mini HP v160 USB 2.0 Flash Drive