Samsung Unveils First 16GB 'Very Low Profile' Module in IBM's Newest Blade Server
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it will demonstrate for the first time a 16-Gigabyte (GB), very low profile (VLP) memory module at the VM World 2010 in an IBM H22V blade server, running on Intel Xeon 5600-series processors.
Based on 4-gigabit (Gb), 40 nanometer (nm)-class DDR3, the new modules use 18 4Gb dual-die packaged (DDP) chips, and operate on 1.35 volts of electrical current. The 16GB 40nm-class DDR3 memory provides a powerful green solution, consuming 70 percent less power than four 4GB DDR3 modules and over 40 percent less than two 8GB modules, in setting a new "standard" for lower power consumption in servers. The module's very low profile (18.75 mm high) allows it to be used in extremely compact blade servers.
High-density, 40nm-class DDR3 will benefit data center mangers, IT directors and server farm managers who need to work with large data sets at significantly faster speeds than those offered by most servers on the market today.
"We are informing the market that not only are higher density, low-voltage memory modules going to be in greater demand very soon, but that they are already being readied for market in the latest blade servers from IBM," said Jim Elliott, vice president, memory marketing and product planning, Samsung Semiconductor, Inc.
"High density, low-profile memory can allow for increased performance on database applications and offer advantages when it comes to power usage and savings. Samsung's module is helping us deliver up to 50% more total memory capacity on our IBM BladeCenter Servers, enabling support for more virtual machines," said Brian Sanders, director of marketing, System x, IBM. IBM is offering the module in its HS22 and HS22V blade servers.
The module consumes up to 20 percent less power than a 1.5V DDR3 and over 80 percent less than a 1.8V DDR2. Each IBM HS22V offers up to 288GBs with Samsung's DDR3 16GB DIMMs (dual in-line memory modules), while the HS22 provides up to 192 GB/s.
Latest News Posts
- Slightly Mad Studios says that Project Cars 'loves' DirectX 12
- Internet playboy celebrity called out - Dan Bilzerian shares morals
- ASUS set to unveil a new Android tablet line called ZenPad at Computex
- Naughty Dog rumored to soon unveil Uncharted Remastered for the PS4
- Colorful is aiming to become second largest GPU vendor
- DVD drive seen in Windows 8.1 but not in BIOS
- ID-Cooling SE 214X CPU Cooler Review
- Upgrade M8
- Team Group Vulcan DDR4-3000 16GB Quad-Channel Memory Kit Review
- YUMI USB Stick doesnt´t boot correctly on H81M-HDS
- CoolIT Systems Successfully Deploys Liquid-Cooled Solution to Poznan Supercomputing & Networking Center in Partnership with Huawei and Itprojekt
- Technology Business Research joins executive roundtable addressing the business impact of data analysis
- Silicon Power Is Holding the 2015 Annual Exhibition in June
- Transcend to Showcase Car Video Recorders, Body Camera and Industrial Solutions at COMPUTEX TAIPEI 2015
- AccelStor Debuting All-Flash Arrays with 1M+ IOPS at Computex 2015