AMD Launches New Complete Platforms for Embedded Systems
At Embedded Systems Conference today, AMD announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations. AMD's new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.
"The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon," said Buddy Broeker, director, Embedded Solutions Division, AMD. "AMD's embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion technology products into the embedded space."
Embedded industry leaders support the benefits of AMD's approach to x86 and complete platform solutions in the market. Read what customers iBASE and Quixant have to say about AMD Embedded Solutions.
New Platform Features
Faster memory with support for 2 channels DDR3
Improved I/O for high-throughput and real-time applications with available HyperTransport 3.0 technology
ECC for high-reliability applications like SMB/SOHO storage systems
Multiple CPU options that offer wide choice of performance and power
- Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP
- Single-, dual- and quad-core
- Up to 2.8 GHz
AMD 785E chipset with support for PCI Express 2.0
New ATI Radeon HD 4200 graphics with DirectX 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs
Latest News Posts
- The Last Guardian coming in 2016, new footage and screenshots released
- Become a certified Microsoft Office expert with this bundle
- See the cancelled Legacy of Kain game in action
- Ready At Dawn's new AAA action game to be revealed next week
- Here's everything we know about Ghost Recon Wildlands
- Asrock 3-Way 2S2S SLI Bridge Card
- Amped Wireless Athena AC2600 RTA2600 MU-MIMO Wireless Router Review
- ASRock 990FX Extreme9 IPMI Module?
- Tweak Launcher dont work with x99-sli mobo
- SanDisk X400 1TB SATA III SSD Review
- Colorful introduces first custom GTX1080: Colorful iGameGTX1080 X-TOP-8G
- CybertronPC offers new NVIDIA GeForce GTX 1080 graphics on all desktops
- Inno3D announces new GeForce GTX 1080 video cards
- Samsung Electronics expands 750 EVO SSD with worldwide availability and increases capacity to 500GB
- Free public gamer event E3 Live to debut in Los Angeles