AMD Launches New Complete Platforms for Embedded Systems
At Embedded Systems Conference today, AMD announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations. AMD's new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.
"The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon," said Buddy Broeker, director, Embedded Solutions Division, AMD. "AMD's embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion technology products into the embedded space."
Embedded industry leaders support the benefits of AMD's approach to x86 and complete platform solutions in the market. Read what customers iBASE and Quixant have to say about AMD Embedded Solutions.
New Platform Features
Faster memory with support for 2 channels DDR3
Improved I/O for high-throughput and real-time applications with available HyperTransport 3.0 technology
ECC for high-reliability applications like SMB/SOHO storage systems
Multiple CPU options that offer wide choice of performance and power
- Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP
- Single-, dual- and quad-core
- Up to 2.8 GHz
AMD 785E chipset with support for PCI Express 2.0
New ATI Radeon HD 4200 graphics with DirectX 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs
Latest News Posts
- Swedish CS:GO pro Fifflaren is keeping busy - joins American team
- ESL announce $100,000 EVOLVE Xbox One competition
- UberX gets unbanned from Portland, now with a new $1 Safe Rides Fee
- Call of Duty: Black Ops III should be due on November 6, 2015
- The latest screenshots of The Witcher 3 tease impressive visuals
- XMP Memory
- Syllable G700 Noise Reduction Hi-Fi Bluetooth Headphones Review
- G1.Sniper M3 - No "Windows Boot Manager".
- X99 UD5 motherboard SLI disabled everytime after updating bios to F9
- OAXIS Bento Close-Contact Induction Wireless Speaker Review
- Seven World Top Casemodders Go Head to Head at the "2015 Thermaltake CaseMOD Invitational"
- GIGABYTE Hosts X99 CHAMPION CHALLENGE on HWBOT.org. Tweak your GIGABYTE X99 Systems for Big Cash Prizes
- Acer Reveals New Back-To-School Product Range at the Inaugural "next@acer" Event in New York
- Acer Launches World's First Curved Monitor with NVIDIA G-SYNC Technology
- Endless possibilities...Introducing the Fractal Define S!