Next-Generation Intel PC Chips to Carry Intel Core Name
SANTA CLARA, Calif., Aug. 11, 2008 - Intel Corporation announced today that desktop processors based on the company's upcoming new microarchitecture (codenamed "Nehalem") will be formally branded "Intel® Core processor." The first products in this new family of processors, including an "Extreme Edition" version, will carry an "i7" identifier and will be formally branded as "Intel® Core i7 processor." This is the first of several new identifiers to come as different products launch over the next year.
Products based on the new microarchitecture will deliver high performance and energy efficiency. This "best of both worlds" approach is expected to extend Intel's processor leadership in future mobile, desktop and server market segments.
"The Core name is and will be our flagship PC processor brand going forward," said Sean Maloney, Intel Corporation executive vice president and general manager, Sales and Marketing Group. "Expect Intel to focus even more marketing resources around that name and the Core i7 products starting now."
The Intel Core processor brand name has gained broad awareness, preference, and market momentum over the past several years. The Intel Core name remains the logical choice for Intel's latest family of processors. The Intel Core i7 processor brand logo will be available for high-performance desktop PCs with a separate black logo for Intel's highest-end "Extreme Edition." Intel will include processor model numbers to differentiate each chip.
Initial products based on this microarchitecture are expected to be in production in the fourth quarter of this year. These processors will feature Intel® Hyper-Threading Technology, also known as simultaneous multi-threading, and are capable of handling eight software "threads" on four processor cores.
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at http://www.intel.com/pressroom and blogs.intel.com.
Latest News Posts
- Western Digital reveals two 64-layer 3D NAND SSDs
- Win 'Gold' in our Blu-ray giveway!
- LG V30 could have sliding dual displays
- Qualcomm and LG working on Snapdragon 845 for the LG G7
- Samsung's first dual camera phone leaks in a video
- Lian Li PC-Q25B - distance between stand and edge of case
- LaCie Bolt3 2TB Thunderbolt 3 Review
- Asrock X99 Extreme11 reports only 48GB instead of 64 GB
- H270m Pro4 Can't boot with my SSD, stuck on splash
- Gigabyte z170 UD5: Question about Voltage Spikes/Offset
- HyperX expand DDR4 memory with higher density kits up to 4,000MHz
- Western Digital to deliver world's first client solid state drives with 64-layer 3D NAND technology
- Qualcomm fuels IoT growth by currently delivering more than 1 million chips a day into a wide range of connected applications
- Team Group announces theme for COMPUTEX 2017 showcase: go beyond the limit and reach for the top
- SAPPHIRE announces PULSE Radeon RX 560 graphics card