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Following leaked details on AMD's Radeon HD 7000 series graphics cards earlier in the week, some new slides (said to be straight from AMD) have since popped up which add some more meat to the equation.
We are assured that the HD 7000 family will use the first VLIW4 circuits at 28nm. In usual fashion the series will be rolled out in steps, with each sub-series based off different base architectures. Looking at the latest leaked roadmap, we can ascertain that AMD is initially planning the launch of four different GPUs making up three series, said to be scheduled for a Q4 2011 launch.
There will be the Radeon HD 7870 and HD 7850, HD 7670 and HD 7570. They will be equipped with GDDR5 memory across the board and sport 768 to 1536 Radeon cores (stream processors).
A little birdy has leaked out some specs on AMD's next generation Radeon HD 7000 series of graphics cards, though the information is most certainly still questionable at this stage with the lack of confirmation on any of it.
Codenamed Southern Islands, these next-gen chips will be 28nm (TSMC) based and as the chart above denotes, sitting at the top of the hill is the dual GPU wielding HD 7990. As per tid bits of info on the two Tahiti XT/Pro Cores the card will use, the max stream processor count is estimated to be around 4000 ALU, with the card featuring a TDP of >300W.
Head on over to the source link for a better idea of how the complete lineup is likely to shape up, with details on 8 known SKUs in the 7000 series shared. But remember, it's all potentially very loose information just at this point, so do remember to take it with a pinch of salt.
Here's an innovative, yet simply executed piece of tech MSI has come up with for future graphics cards. Word has come out that MSI has been testing a new feature it's looking to help make its already kickass lineup of non-reference graphics cards stand out even more.
MSI calls it "Dust Removal Technology", which is obviously to help rid your card of a negative scenario that affects every card sooner or later - dust buildup, translating to heat buildup. MSI say that enough dust buildup can eventuate to a rise in temperatures by as much as 15c, and from personal experience I can say that's not an exaggeration. Their new founded technology is quite simple in principle really.
External graphics solutions for the mobile platform has been a talked about subject for several years now, and while we've seen a few forms of these on display at various trade shows and in prototype form around the web, the big players are yet to really make a firm jump into this area.
However, it's still definitely on the cards according to NVIDIA. Fuad of Fudzilla was recently at NV headquarters where he got to have a chat with general manager of NVIDIA's notebook division, Rene Haas and while the finer details of what's planned were retained, he did say that external graphics is something they are working on and the word 'Thunderbolt' was also mentioned, possibly meaning it'll be the connection of choice to ensure enough bandwidth is provided.
No matter how much you try to convince people that "the more memory, the better" when it comes to graphics cards is a somewhat fuzzy statement, the idea of having your card crammed with as much memory as possible is just too hard to pass up for some folks, hence add-in partners sometimes going a little overboard in this respect.
On that note, it seems NVIDIA card partner Point of View is looking to break some kind of record with a new GeForce GTX 550 Ti offering, packing it with not 1.5GB, not 2GB, but a whopping 4GB (!) of memory - equating to 4 times the amount on the reference model.
Such a large increase in memory would be questionably logical on a high end model, but on a mid range card with only a 128-bit memory interface, it does very much seem overboard indeed. It also needs to be mentioned that the memory used isn't the usual GDDR5, PoV took a shortcut here and went for DDR3, clocked in at 1066MHz. Meanwhile, the core runs at 900MHz, with its 192 CUDA cores operating at 1900MHz.
The card is now available for pre-order in Europe at 113.
Some slightly fuzzy details on NVIDIA's upcoming 28mm mobile GPU parts have been leaked today; these being Fermi based shrinks, not based on next-gen Kepler.
It should first be noted, the chart provided by semiaccurate that you see above gives a list of the majority, but not all of the upcoming mobile GPU parts on the way, as there will likely be a few more 40nm parts entering the market in amongst this lot.
The other important attribute of what we can learn from this chart is the mass production periods noted. Sources are indicating that the much anticipated Kepler lineup of GPUs won't start being released until (at least) three months after these begin rolling out. So if we're not seeing 28nm parts hit the market until January or so, chances are Kepler will miss the boat for a Q1'12 release.
Q2 of 2011 saw a decent 16.1 million discrete GPUs shipped worldwide according to the latest figures from Jon Peddie Research. This is a 15.2% drop from the 19.03 million recorded in the previous quarter. The drops in market share didn't faze NVIDIA or AMD and their respective shares. AMD gained 0.1% from 40.5 to 40.6% in Q2 2011, seeing an 0.8% drop for year-on-year growth. The green team, NVIDIA, saw a 0.1% decrease from 59.1 to 59.1%, with a 1.1% increase year-on-year.
JPR expects a huge 33% drop in discrete graphics shipments for the entire year because of the increase in performance in integrated graphics thanks to AMD and Intel.
The final touches have been made on eVGA's upcoming super duper version of NVIDIA's flagship single GPU graphics card, the "GTX 580 Classified" and it shouldn't be too long now before it starts to hit retail channels and make its way into enthusiasts, gamers and overclockers hands.
Photos have surfaced online that depict a very bold design in all. Using an over-sized PCB, it sports a 14+3 phase PWM, three PCIe (two 8-pin + one 6-pin) power connectors, a couple NEC Proadlizer capacitors, status LEDs for voltage and headers for advanced power monitoring, a dual BIOS and native 3-way and 4-way SLI support.
GamesCom 2011 Our first stop for Day 1 of GamesCom 2011 in Germany was over at the Sapphire booth where they were showcasing their range of new video cards, motherboards and mini PC systems as well as a cool AMD Eyefinity demo showing off the flex, so to speak, of their latest Flex Edition Series video card.
Setup in an interesting dual system case, Sapphire has a three screen Eyefinity setup running Dirt 3. The video card powering the show was the Radeon HD 6950 Flex Edition. This video card supports up to five outputs whereas a standard video card only usually support three.
Just as a side note, Sapphire also had some other errm... "stuff" on display of the human kind, but you'll have to wait for that.
eVGA has just made available for purchase via their website a new back plate specifically suited to owners of reference GTX 560 Ti graphics cards.
Made of brushed metal, the back plate is designed to reinforce the PCB in order to reduce bending, while also speeding up heat dissipation. At the same time, it would indeed give an improved look of the card inside a windowed case, hiding all those solder points on the PCB.
While this accessory is a little late to the party, the GTX 560 Ti was quite the popular attraction in NVIDIA's lineup at launch thanks to the aggressive performance/price ratio and a bit of a physical facelift along with a method to try for slightly higher clock rates should be of interest to some folks, especially considering this will only set you back $20 US.