ADATA has just announced its new Gold Edition XPG Z1 DDR4 overclocking RAM, which comes in four speeds; 3000/3200/3300/3333MHz. The new memory is perfect for your Haswell-E build, as it will provide some of the best DDR4 RAM for your system, period.
ADATA has decreased the operating voltage of its XPG Z1 RAM from 1.5V to 1.35V, with that 10% reduction in power providing lower temperatures for more stable operation at higher speeds. Even at 3333MHz, the CL16-16-16 timings and a transfer bandwidth of 26.6GB/sec, you can be assured, you're getting some seriously fast RAM with the ADATA kit.
The company has splashed its jet wing-inspired design with a race car carbon texture that ADATA says "embodies the pursuit of extreme performance." The XPG Z1 chips are cooled by its unique Thermal Conductive Technology and 10-layer PCBs with 2oz of pure copper, which has the chips on the XPG Z1 enjoying direct contact with the heat sinks. This means that the IC and PCB "operate at an evenly distributed temperature."
As according to their newly issued press release, Samsung announced today that mass production has begun for the industry's first 8 gigabit low power double data rate 4 (LPDDR4) mobile DRAM.
This technology is claimed to be based on their 20-nm process technology, stating that LPDDR memory is generally used as 'working memory' for mobile devices around the globe.
Samsung's Executive Vice President of Memory Sales and Marketing is excited given this news, comenting that "by initiating production of 20nm 8Gb LPDDR4, which is even faster than the DRAM for PCs and servers and consumes much less energy, we are contributing to the timely launch of UHD, large-screen flagship mobile devices," further adding "as this major advancement in mobile memory demonstrates, we will continue to closely collaborate with global mobile device manufacturers to optimize DRAM solutions, making them suitable for next-generation mobile OS environments."
As CES Las Vegas draws ever closer, we're receiving more and more news of companies making the trek over to the party capital to show off their fancy new technology to all.
Located in the South hall 4, Super Talent will be showcasing their new next generation of DDR4 DRAM, SSD's and USB 3.0 flash drives at this massive event. Their booth will be fitted out with technology experts aiming to provide the best information possible to all who attend.
Have you been caught up in the DDR4 hype-train yet? Offering higher data rates with lower power consumption, alonside the potential for increased mobile density they're certainly the tech of the future. Whether you check out Super Talent or not, we suggest you take a look at DDR4 either way.
Low profile DDR4 ECC RDIMM is headed to servers across the world, with someone spotting Micron-powered 2133MHz DDR4 RDIMMs from Japan Century Micro.
The RAM comes in a single 4GB DIMM at 2133MHz, with 15-15-15 timings, and its product number is CD4G-D4RE2133VL81. DDR4's ordinary height is 31.25mm, but this new RDIMM memory is 40% shorter at just 18.75mm. These 4GB DDR4 2133MHz low-profile RDIMMs are selling for around $429 each, but for servers that need some low-profile RAM, this could be the upgrade for you.
It wasn't long ago that we teased that AMD could be using SK Hynix's next-gen memory on its next-gen Radeon R9 390X GPU, but this new memory is now shipping from SK Hynix in the form of 8GHz GDDR5, in 4Gb single sticks.
As it stands, AMD's best GPU; the Radeon R9 290X, has its memory frequency hitting around 5-6GHz, while NVIDIA's enjoys things a little higher, at 7GHz. SK Hynix's new chips increase the frequency up to 8GHz, in 4Gb chips, which should see some deliriously fast GPUs on offer for the next-gen.
With AMD's Radeon R9 390X rumored to have a 4096-bit bus, this memory shipping could indicate we're closer to seeing a next-gen GPU not only from AMD, but NVIDIA. AMD's R9 290X has a 512-bit memory bus, but this new HBM RAM could really kick things up a notch, especially with AMD partnering up with SK Hynix before the rumors of the next-gen GPUs even began.
We're only just getting DDR4 on the desktop thanks to Intel's new X99 chipset, but what about the enterprise? Samsung is prepping up some delicious new RAM for enterprise users, announcing that they are mass producing the industry's first, and most-advanced 8Gb DDR4 memory, with a 32GB module.
Both of these will be manufactured based on Samsung's 20nm process, targeted at enterprise servers. Jeeho Baek, Vice President of Memory Marketing at Samsung Electronics explains "Our new 20nm 8Gb DDR4 DRAM more than meets the high performance, high density and energy efficiency needs that are driving the proliferation of next-generation enterprise servers. By expanding the production of our 20nm DRAM line-ups, we will provide premium, high-density DRAM products, while handling increasing demand from customers in the global premium enterprise market".
It gets better, because past the 32GB modules, these new 8Gb chips will allow production of server modules that will crank right up to 128GB, thanks to 3D through silicon via (TSV) technology, something that will "encourage further expansion for the high-density DRAM market".
RAM manufacturer G.SKILL announces it has released the fastest DDR4 3333MHz memory kit on the market, with the Ripjaws 4 series providing a total capacity of 16GB (4GB x 4), offering even faster bandwidth for PC enthusiasts and gamers alike.
The 288-pin SDRAM is rather pricey, currently available for pre-order on Newegg for $579.99, but will be popular among consumers building a new gaming rig. The RAM will be released on September 5 in black, and will be released worldwide shortly after.
The Ripjaws 4 3333MHz has been optimized for the Intel X99 platform and uses an aluminum heat spreader design to help keep the memory cool. XMP 2.0 support makes it easier for consumers to overclock the RAM, along with 1.35V ultra-low voltage to keep an energy-efficient footprint.
Memory manufacturer G.SKILL has announced it reached 4004MHz frequency using its Ripjaws 4 Series DDR4 RAM on an ASUS ROG X99 Rampage V Extreme motherboard powered with the Intel Core i7-5930K CPU. The speed was verified by CPU-Z freeware system and hardware benchmarking software.
G.SKILL officially announced Ripjaws 4 just a week ago, with 32GB RAM kits available running at 2133, 2400, 2800, 3000MHz - 64GB kits include 2133, 2400, 2666 and 2800MHz. A separate 3200MHz kit will be available in 16GB only.
The launch of Intel X99 paired with DDR4 memory has excited PC enthusiasts and hardware manufacturers - as several gaming companies announced new PCs pushing impressive benchmarks. Expect RAM manufacturers to continue pushing DDR4 speeds even higher moving forward, while hardware will remain rather pricey in the foreseeable future.
Hardware companies Corsair and ASUS have teamed up to create the fastest production DDR4 memory kit for use with the Intel Core i7 Extreme Edition CPUs. The new Corsair Dominator Platinum DDR4 memory kits are available in 3000MHz, 3200MHz and 3300MhZ speeds. The new RAM kits work especially well using the ASUS X99 Deluxe and Rampage V Extreme motherboards for Intel Core i7 CPU fans.
This is a significant collaboration, as DDR3 speeds increased from 800MHz up to 1600-1866MHz, but the DDR4 modules introduced by Corsair should immediately provide impressive benchmarks. The Corsair DDR4 memory kits are available now for the Vengeance LPX and Dominator Platinum lines - and the ASUS X99-Deluxe and Rampage and V Extreme motherboards are available now.
"Our rigorous validation with ASUS has enabled us to make Dominator Platinum 3300MHz the fastest desktop DDR4 memory available at launch," said Thi La, Corsair COO, in a press statement. "Our OC team and engineers are excited to see such performance headroom the new Intel platform and are looking forward to releasing even faster kits in the near future."
Samsung just announced today that they have begun mass production of the industry's first 3D TSV technology based DDR4 modules for enterprise related products. Samsung has said: "announcing that we have begun mass producing the industry's first 64GB DDR4 RDIMMs that use 3D 'through silicon via' (TSV) package technology. The new 64GB TSV module performs twice as fast as a 64GB module that uses wire bonding packaging, while consuming approximately half the power."
"Samsung's volume production of 3D TSV modules marks a new milestone in the history of memory technology, following the company's initial production of 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology embraces high-rise vertical structures of cell arrays inside a monolithic die, 3D TSV is an innovative packaging technology that vertically interconnects stacked dies. With its introduction of the new TSV modules, Samsung has further strengthened its technological leadership in the '3D memory' era. Samsung has worked on improving 3D TSV technology since it developed 40nm-class* 8GB DRAM RDIMMs in 2010 and 30nm-class* 32GB DRAM RDIMMs in 2011 using 3D TSV. This year, Samsung started operating a new manufacturing system dedicated to TSV packaging, for mass producing the new server modules."
In order for Samsung to build these 3D TSV modules, the dies are ground down to a few dozen micrometers, and then pierced to contain hundreds of fine holes. Electrodes passing through the holes allow them to be vertically connected and stacked. In the future Samsung believes they will be able to stack more than four dies using 3D TSV technology.