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OC Workbench have some news (a press release actually) posted on their website about Samsung's new DDR-II technologies.
Samsung's 512Mb DDR-II SDRAM fully satisfies the JEDEC DDR-II standard set in March 2002. The device has a low 1.8-volt Vdd and has data transfer rates of 533Mbps that can be extended to a maximum of 667Mbps for networks and special system environments. With the availability of Samsung's new 512Mb DDR-II SDRAM device, high-speed, performance-enhanced, next-generation memory designs are now a reality.More information at OC Workbench.
OCZ emailed me earlier today about the release of their new OCZ PC3300 DDR memory which effectively operates at 400MHz. This will become increasingly important as new chipsets are released.
Portage, IndianaIt just keeps getting faster and faster!
March 21, 2002 - OCZ Technology Group would like to announce the availability of OCZ Performance series DDR 400 better known as PC3300. OCZ PC3300 is built using state of the art ULN PCB to achieve speeds exceeding 400 MHz at CL2.5.
VIA Announces Wide Choice of Validated DDR333 Memory Modules Compatible with New VIA Apollo DDR333 Chipset platforms
Leading memory vendors set for volume production of ultra-fast, reliable and compatible PC2700 memory modules in support of VIA DDR333 chipset platform
Taipei, Taiwan, 12th March 2002 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the support of leading memory vendors for a broad migration to high performance DDR333 in 2002.
With the launch of the VIA Apollo KT333 for the AMD Athlon(tm) XP processor and the forthcoming VIA Apollo P4X333 for the Intel® Pentium® 4 processor, memory manufacturers and module suppliers including Samsung Semiconductor, Micron Technology, Hynix Semiconductor, Infineon Technologies, Nanya Technology and Elpida Memory have started to ship DDR333 (PC2700) modules and devices specifically tested for compatibility with VIA chipsets.
"VIA DDR333 chipset platforms will deliver unparalleled system performance to the marketplace" said Richard Brown, Director of Marketing, VIA Technologies, Inc. "With a choice of validated PC2700 modules now available, end users have the security they need to upgrade to DDR333 with confidence"
"Hynix's DDR333 memory modules, used in conjunction with VIA's Apollo KT333, delivers outstanding performance and features," said Farhad Tabrizi, Vice President of Worldwide Memory Marketing for Hynix Semiconductor Inc. "Hynix continues to pave the way for availability of low cost, high performance DDR features, utilizing validated PC2700 architecture and providing consumers with powerful technology that delivers exceptional system performance."
"Our customers tell us that speed counts," said Tom Quinn, Samsung Semiconductor, Inc.'s vice president of marketing. "Samsung's fully validated DDR333 memory modules will ensure that VIA DDR333 chipset platform customers will have all the high-performance memory they need at competitive
"Micron has been working with industry partners to enable DDR SDRAM and we are happy to report that DDR333 is well on its way to becoming the next DDR speed grade to be supported," said Brett Williams, Micron DRAM Strategic Marketing Manager. "Having validated our DDR333 modules with VIA's KT333 chipset, we will ramp production of DDR333 to coincide with industry demand."
VIA DDR Validation
For more information on the VIA DDR333 Validation Program please visit:
Cameron "Sov" Johnson has just finished up with an exclusive review of some Kingmax DDR-333 (PC2700) Memory. Can the newr and bigger numbers really aid in the performance of your system? Come on in and find out!
Over at Silicon Strategies they have a news story up on Kentron Technologies Inc. to accelerate QBM memory technology into the market by year's end which promises to double the speeds of DDR SDRAM memory for PC's.