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Micron Technology may hike its prices of DRAM chips by May as their inventory levels are running low and the supply of DRAM from other manufacturers Samsung Electronics and SK Hynix is also insufficient.
Few memory device makers have also reported that Micron has already raised its quotes to reflect the short supplies of DRAM chips. What also makes it worse that other DRAM manufacturing leaders are having issues of their own.
Samsung is affected by low production output of DRAM chips because of its migration towards 25nm process. Because of this, the South Korean based company is having tough times to meet with PC OEM contract orders. Samsung said that it is expecting a more balanced DRAM supply and demand by 2014, along with strong consumer and enterprise SSD demand to accelerate the process.
G.SKILL has been dominating the SO-DIMM market lately, continuing that lead today with the announcement of its new DDR3L SO-SIMM memory that is clocked at 2133MHz. Not only is that impressive, but it comes in a gigantic 32GB kit.
The 32GB kit comes in 4 x 8GB sticks, with a low voltage of just 1.35V and a timing of 11-11-11-31. It joins the ever-expanding RIPJAWS line from G.SKILL, and has been tested out in the high-end MSI GT70 2OC gaming laptop, where the new RAM was perfect under extreme load.
Computer enthusiasts will recognize the name Kingston as one of the most popular markers of RAM on the market. For years, HyperX was one of the RAM lines that Kingston made and HyperX is now its own division of Kingston.
A new entry-level RAM product has been announced by HyperX called the Fury line. The RAM is being aimed right at entry-level overclockers and enthusiasts. Fury RAM supports high-performance overclocking automatically with an asymmetric heat spreader design.
Fury replaces the HyperX blu RAM. Fury RAM is fully plug and play allowing for automatic overclocking within the system speed allowance without having to mess with BIOS settings. The RAM is available with blue, black, red, or white heatspreaders and all feature black PCBs.
DDR4 RAM is still in its infancy and at the moment it's use is relegated to the high-end enterprise server world, but that has not stopped silicon manufacturer, SK Hynix, from pushing the new standard to the next level. Today the company unveiled its latest DDR4 module that boast an impressive 128GB of RAM on a single DIMM sized stick.
"The development of the world's first 128GB DDR4 module has its significance in opening ultrahigh density server market" said Sung Joo Hong, the head of DRAM development at SK Hynix in s statement.. "The company will further strengthen its competitiveness in premium DRAM sphere with the development of high density, ultrahigh speed and low power consuming products."
Just moments ago Samsung announced the company has increased DDR4 production. This comes on the just before of Intel's E5-2600 V3 series announcement that we expect soon.
Upon launch, DDR4 will increase DRAM performance while at the same time lower power consumption.
Here we see the evolution of DRAM over time with both throughput and power.
Today Micron Storage announced that it is beginning to ramp up production of DDR4 memory modules in preparation of Intel's pending launch of the new Xeon E5-2600 V3 line of processors. Micron says that these DDR4 modules will offer a performance increase of up to 35-percent over previously utilized DDR3 RAM.
"Our JEDEC-compliant portfolio showcases the performance and power benefits that DDR4 products can provide for our customers," said Robert Feurle, Micron's vice president of marketing and program management. "As a result of Micron's close engagement with our key enabling partners, we are well positioned to bring this exciting new technology to market."
If you spend a lot of time on your computer with a lot of tabs or programs open that consume memory, you know you can never have enough RAM. If you use a new round Mac Pro that debuted last year and are in need of a RAM update, a new product has launched you will want to check out.
A company called Transcend has rolled out some new RAM upgrades for the 2013 Mac Pro that can bring the total amount of memory in the machine to 128GB. RAM modules are available in 16GB and 32GB capacity. Apple puts four upgradable RAM slots inside the machine.
Transcend says that while the Mac Pro is advertised to support only 64GB of RAM, it has tested the machine to work with up to 128GB. The 16GB modules are DDR3-1866 units with the 32GB modules being DDR3-1333. Both RAM configurations are RDIMMS and are guaranteed 100% to work with the Mac Pro. Pricing is unannounced at this time.
Samsung Electronics made an announcement today that it has started the mass production of 20 nanometer based DDR3 memory modules. The company is using the immersion ArF lithography to roll out 20nm based 4Gb for its most advance DDR3 memory.
Young-Hyun Jun, the executive VP of memory sales and marketing for Samsung Electronics said,"Samsung's new energy-efficient 20-nanometer DDR3 DRAM will rapidly expand its market base throughout the IT industry including the PC and mobile markets, quickly moving to mainstream status. Samsung will continue to deliver next-generation DRAM and green memory solutions ahead of the competition, while contributing to the growth of the global IT market in close cooperation with our major customers."
G.SKILL has just unveiled some ridiculously fast DDR3L SO-DIMM memory, clocking in at a DIMM-busting 2133MHz. The new super-fast set of Ripjaws RAM comes in a 16GB kit, requiring just 1.35V of power, rocking along with timings of 11-11-11-31.
G.SKILL validated its latest memory on GIGABYTE's BRIX Pro machine, which is a perfect match for this high-performance RAM. G.SKILL have called it the F3-2133C11D-16GRSL, which is quite the mouthful, but it is compatible and best used on the latest Haswell-based Core i5 and i7 processors.
A federal court in California has concluded a case against 12 DRAM manufacturers as they accused of price fixing between 1998 and 2002. The court calculated that the manufacturers will have to do a settlement that totals up to $310 million.
The case was filed by a group of US attorney generals against DRAM manufacturers including Samsung, NEC, Infineon, Hynix, Micron and Toshiba in 2007. The DRAM makers have any wrongdoing of any price fixing during those years, but have agreed to make a settlement. The attorney generals have agreed to $310 million settlement package where the money will be distributed to the public.
Earlier, Samsung had to cough out $300 million in 2005 as a settlement with US department of Justice.