We've heard about Intel's incredible new Core i7-6950X processor, which features 10 x CPU cores joined by 10 x Hyper-Threaded cores for a total of 20 threads, but it looks like we'll get a better look at Intel's new CPUs at Computex in June 2016.
Intel's new 14nm Broadwell-E offerings will arrive next year with a slew of different SKUs, ranging from the 12-threaded CPUs to 20-threaded CPU beasts. The Core i7-6950X will lead the pack with 20 threads of 14nm CPU goodness, with a Base frequency of 2GHz, 25MB of cache and support for DDR4. It'll feature a 140W TDP, and up to 3.5GHz on Turbo Boost.
The Core i7-6900K will feature 16 threads at 3.2GHz (3.7GHz Turbo Boost) and 20MB of cache, with the Core i7-6850K featuring 12 threads of CPU power at 3.6GHz (3.8GHz Turbo Boost) with 15MB of cache. The last CPU to be unveiled should be the Core i7-6800K with 12 threads at 3.4GHz (3.6GHz Turbo Boost) with 15MB of cache.
As for pricing, the speculated pricing on the Core i7-6950X is $999, Core i7-6900K for $600, Core i7-6850K for $550, while the Core i7-6800K is set for $450 or so. Expect them to be unveiled at Computex 2016 in June, in Taipei, Taiwan.
Last month we reported on a leak confirming Intel would be releasing Broadwell-E CPUs in 2016 in three flavours of 6-core/12-threads, 8-core/16-threads, and 10-core/20-threads. Now further details have surfaced.
The flagship CPU, as previously mentioned, is the 10-core/20-thread i7 6950X. Now rumors from OC3D (who neglect to cite a source) tell us it features a 14nm process node, 25MB cache, 3.0GHz clock speed, 2400MHz memory clock, and 140W TDP. Furthermore, it comes unlocked, and supports the X99 chipset and DDR4 2400 RAM. As for the rest of the family, see for yourself below.
It seems as though Intel is in some trouble with its new Skylake processors, like the new Core i7-6700K, with reports that they're bending under pressure from third-party CPU coolers.
Some CPU coolers are putting too much pressure on the Skylake-based CPUs and the socket on the motherboard, causing damage. The problem begins when shipping or moving a PC, as well as other general shocks and movement - putting pressure on the mount point, bending the CPU. This can cause the pins on the motherboard to be damaged, which as you can imagine, is not good at all.
Intel talked with Tom's Hardware, confirming that their Skylake processors are thinner than previous designs, adding that they are looking into the issue as we speak. Cooler Master reached out to us today, saying: "Cooler Master has been at the forefront of Cooling Technology since its inception. With the Cooler Master designed heat-sink technology in your coolers, you are getting the best standards of thermal cooler in the world. Every cooler we ship meets Cooler Master's highest standards for providing incredible performance, regardless of the design or model".
Cooler Master added: "We would like to reaffirm our commitment to all our fans and supporters that you can rest assured, all air and liquid cooling products from Cooler Master are not affected by the mounting issue. For a complete list of Cooler Master compatible products for Intel socket LGA 1151 please click here".
There is quite a lot of excitement in the air over AMD's upcoming Zen architecture, but according to the latest rumors, AMD is preparing to launch it sooner than previous reported - as soon as March 2016.
The rumor is coming from Planet3DNow, which said AMD would launch the new flagship AM4 platform in March, much earlier than the previous release window of Q4 2016. The new Zen CPU would run on the AM4 platform, which will support both APUs and CPUs. Better yet, the new AM4 platform will reportedly last much longer than previous platforms, promising support for future AMD processors. The source of Planet3DNow said that "The internal timetable foresees a March 2016 launch".
Furthermore, the new AM4 platform will bring support for Bristol Ridge and Summit Ridge platforms, with the Summit Ridge range being the performance desktop processors under the FX branding on the Zen architecture. The Bristol Ridge range will be the mainstream/desktop mobility APU range, based on the Excavator architecture. Summit Ridge will be powered by the smaller, more power efficient 14nm process with up to 8 x CPU cores while the Bristol Ridge APUs will be made on the current 28nm process as quad-core processors. Both offerings will come in at 95W, while the APU will include GCN GPU cores, and the Summit Ridge offering featuring CPU cores only.
PCgameshardware.de has tested Intel's Skylake CPUs and found because of its thinner substrate versus its previous processors, coolers that apply a lot of pressure to the CPU and socket can damage both.
As of now, just Scythe -- who have confirmed damage to Skylake CPUs with their coolers is possible -- is the only company confirmed as affected by it as of yet. Arctic says it has verified no issues with its coolers, though it advises you don't travel with your cooler mounted; NZXT and EK Water Blocks both have stated their coolers do not experience the reported issues, with the exception of its older gen large tower coolers like the Havik 120/140 from NZXT and the older generation of compatible LGA-1151 water blocks with a "classic, undefined clamping force type mounting mechanism". These are compatible with Skylake CPUs, but both companies recommend erring on the side of caution and not using them with Skylake.
While Apple likes to downplay specifications and focus on real-world results, enthusiasts will be enthusiasts. Case in point: patent and technology partner company Chipworks has again broken down an Apple processor and spilled the juicy specifications. This time it's the A9X chip -- pictured below -- present on the iPad Pro.
The A9X features a 12-cluster GPU (likely a semi-custom Apple implementation of the Series 7XT) and two CPU cores. It doesn't feature the level-three cache memory found in the A9, which Fool attributes to the bigger and better chip technology, rendering the old memory unnecessary, or at least not worthwhile.
AMD has been teasing its Zen architecture for a little while now, but the new Zen-based APUs will be packing quite the performance punch when they drop in 2017.
It's said that we're looking at Xbox One and PS4 level performance, even when the Zen APU is found inside of notebooks - and personally, I think we might see it in VR headsets, too. Another exciting part of this news is that there's a rumor that AMD is working on a Zen APU that would feature High Bandwidth Memory, or HBM.
If AMD did this, it could really begin to make a dent in CPU sales for Intel, as people could choose a semi-powerful APU with HBM over a traditional CPU from Intel and DDR4 RAM.
We knew they were coming, but the 10-core/20-thread Broadwell-E CPUs have been confirmed through a leaked roadmap from Intel. We should expect the chipmaker to launch an entire family of Broadwell-E processors throughout 2016.
Intel is expected to launch 6-, 8-, and 10-core offerings - with the assistance of Hyper-Threading boosting those up to 12-, 16-, and 20-threaded processors. Not only that, but we should expect new Broadwell, Skylake-S, and Skylake-U processors throughout 2016, where in Q4 2016 it looks like we should see Skylake-S 4+4e and Kaby Lake-S offerings unveiled.
The Broadwell-E offerings from Intel will arrive as the Core i7-6950X, with this CPU being the flagship 20-threaded beast. Under that, we have the Core i7-6900K, Core i7-6850K, and Core i7-6800K.
Intel has provided more details on its second-generation Xeon Phi co-processor at the annual SC conference, with the new Knights Landing beast nearly ready to be shipped.
The company has said they've already sent out various pre-production systems to clients through its early ship program, with Cray enjoying the new Xeon Phi co-processor, with it handling multiple customer applications in preparation for supercomputer deployments at Los Alamos and NERSC. Intel has said that the new Knights Landing chip has various innovative features that provide unmatched performance.
For example, Xeon Phi co-processor powered systems will be capable of delivering single-precision performance that is over 8TFlops with double-precision performance sitting at around 3TFlops. Inside, the Xeon Phi co-processor features 16GB of stacked memory that Intel says has 5x the bandwidth of DDR5, and is also 5x more power efficient and 3x denser than GDDR5 that is used on today's video cards.
Samsung has just announced its latest mobile processor, the Exynos 8 Octa 8890. The name confusion aside, Samsung's latest mobile chip is built on the company's 14nm FinFET process technology.
The Exynos 8 Octa 8890 is also the first chip that Samsung has used its custom-designed CPU cores based on a 64-bit architecture, with the Exynos 8 Octa 8890 rocking 4 big custom cores, along with 4 small ARM Cortex-A53 cores. Samsung says the new Exynos 8 Octa 8890 offers a 30% improvement in performance compared to the previous Exynos 7 Octa, while it will also be 10% more power efficient.
Samsung's latest mobile processor also integrates a state-of-the-art LTE modem that is capable of an insane 600Mbps download, and 150Mbps upload on Cat 12, and Cat 13, respectively. The new Exynos 8 Octa 8890 also has support for 4K (the full 4096x2160) and WQUXGA (3840x2400), so expect some ridiculous smartphone, tablet and VR resolutions powered by Samsung's latest Exynos processor in the very near future.