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Intel only launched its Skylake-based Core i7-6700K processor just recently, with a professional overclocker already pushing it up to just under 7GHz, sitting at 6998.88MHz.
The achievement was done using an ASRock Z170 OC Formula motherboard, where Hong Kong overclocker Chi-Kui Lam used an engineering sample of the Core i7-6700K, an overclock of 74.9% from its stock frequency of 4GHz. G.SKILL provided the RAM chops with Ripjaws 4 DDR4 RAM, alongside a 1300W PSU. The processor was keeping cool under LN2, which is normally required for these insane CPU overclocks.
The Core i7-6700K at 6.9GHz was only on a single core, with the other three physical cores and the four Hyper-Threaded cores being disabled. So we're looking at a single-core 6.9GHz, which had its voltage cranked up to 1.88V, compared to the 1.2V on the stock CPU.
Samsung has been catching up and beating the likes of Qualcomm in the mobile processor race for the last year or so, but its upcoming SoC codenamed Mongoose, is shaping up to be quite the winner.
Benchmark results of the new Mongoose have leaked, making the 8-core Exynos 7420 from Samsung look like nothing in comparison. Mongoose has each of its four cores clocked at 2.4GHz, down from the eight cores on the Exynos 7420 clocked at 2.1GHz. Mongoose was run in Geekbench, where it scored 2136 in the single-core test, and 7497 in the multi-core test.
If we compare this against the Exynos 7420 with its 1486 in the single-core test and the 4970 from its multi-core test, Mongoose has some serious power to throw around. Even in its 'power-saving mode', Mongoose still beats the Exynos 7420, with 1698 and 5363 in the single- and multi-core benchmarks, respectively. We should expect Mongoose to be unveiled in the coming months, while it should be found in Samsung's handsets sometime in 2016.
Qualcomm isn't doing too well at the moment, and Samsung hasn't had a good time with its new Galaxy S6 and Galaxy S6 edge sales, leaving the window open for LG to come through and dominate with its upcoming NUCLUN 2 processor.
LG's refreshed NUCLUN 2 processor is being baked onto the 16nm FinFET process and hitting mass production in 2016. But now we're got some very early performance numbers to share with you courtesy of Weibo, where it dominates the 8-core SoC from Samsung in the form of the Exynos 7420. The NUCLUN 2 scores 1796 in the single-core test versus the 1486 from the Exynos 7420. When it comes to the multi-core test, the NUCLUN 2 is capable of 5392 while Samsung's chip manages 4970.
LG's NUCLUN 2 chip has two quad-core CPUs inside of it, with one of them being a quad-core Cortex-A72 clocked at 2.1GHz while the other is a quad-core Cortex-A53 clocked at 1.5GHz.
Qualcomm has been down in the dumps lately, but it looks like the Snapdragon 820 could be something exciting for the company. The upcoming chip is promising a new GPU from Qualcomm, as well as a new image signal processing (ISP) unit.
The Snapdragon 820 should pack an Adreno 5xx GPU which will offer up to 40% more performance while using 40% less power compared to the previous Adreno 430 GPU. The new 500 series GPU will also have support for 4K video at 60FPS through HDMI 2.0, meaning you can stream 4K 60FPS video to your compatible TV or monitor.
The new Spectra ISP is capable of supporting up to three cameras simultaneously and mixed with its best-in-class image quality, we can expect big things for cameras. The new ISP will see images with more natural skin tones, and a wider range of colors at up to 25-megapixels at 30FPS with no shutter lag.
Today's laptops are pretty damn powerful, where personally I use the ASUS ROG G751 gaming laptop as my personal workstation (heck, I'm typing on it right now) with a 34-inch 3440x1440 UltraWide display and a Acer XB270HU 2560x1440 144Hz G-Sync display plugged into it. But the CPUs inside are about to get a heck of a lot faster.
Intel has just unveiled the very first Xeon processor family for laptops, the E3-1500M v5, which is based on the Skylake architecture. These Xeon-powered laptops will also introduce some enthusiast and professional technologies, such as the new Thunderbolt 3 connector which supports dual 4K displays, USB Type-C, and much more from a single port.
The chipmaker isn't talking about all of the capabilities of its E3-1500M, but we do know that laptops using the Xeon processors will arrive in the fall.
We knew it was coming, but the retail packaging for Intel's upcoming Skylake processors have leaked online. We now have a legitimate look at the Core i7-6700K, and Core i5-6600K processors.
The Core i7-6700K will feature 4 physical cores and 4 HT cores to make up an 8-threaded CPU, while boasting a 4GHz clock speed, support for dual-channel DDR4 and DDR3L memory, as well as Intel HD Graphics 530. The Core i5-6600K on the other hand, features just four physical cores at 3.5GHz, without Hyper-Threading the same dual-channel DDR4/DDR3L RAM support, and Intel HD Graphics 530.
When we heard about AMD's upcoming Zen architecture, we were excited, but with the latest news on this new APU, the excitement level has increased ten fold.
According to WCCFTech, AMD's upcoming APU is being dubbed an "Exascale Heterogeneous Processor", or EHP. AMD's new EHP will pack 32 x86 Zen cores, a massive Greenland-powered graphics die, and up to 32GB of HBM2 on its 2.5D interposer. That's not a mistake, we're looking at a 32-core processor, with enough graphics grunt to play games at 4K, and with up to 32GB of next-gen HBM2.
AMD's EHP can pack up to 32GB of HBM2, but it can be expanded through a DDR4 channel that is baked onto the package. As for the GPU side of this new APU, we don't know how many Greenland GPU cores will be used, but we're sure that AMD will use a smaller node for it, so we should expect it to pack quite the performance punch.
AMD is expected to roll out the EHP somewhere in the next couple of years, so expect it somewhere in 2016-2017. This is the type of APU that AMD needs to get into the next generation of consoles and VR headsets.
The release of Intel's new Skylake-based processors is right around the corner, alongside the release of the new Z170 range of motherboards. But news has broken that the upcoming flagship Core i7-6700K has been overclocked to a huge 5.2GHz... on air cooling.
The achievement happened with an early BIOS, with the CPU hitting 5198.75MHz - an overclock of 1200MHz above its 4GHz stock clock. Better yet, just 1.35V was required to reach this, which is a damn good achievement considering you need more voltage, and watercooling to get anywhere near that on a current Core i7-4790K.
While it was sitting at 1.35V and 5.2GHz, we don't know what temperatures the overclocked Core i7-6700K was sitting at under load. We should expect many more details to arrive on the Core i7-6700K as we get closer to its launch next month.
A few months ago AMD launched their 'Kaveri' refresh, the A10-7870K, and today they are launching another refresh, the A8-7670K. The A8-7670K will feature 10 compute cores which consists of 4 CPU cores and 6 GPU cores.
Compared to its predecessor, the 7670K will have boosts in both CPU (100MHz turbo/300MHz base) and integrated GPU (37MHz) clock speeds. The 7670K is aimed at users who want strong performing integrated graphics at an affordable price, such as a family PC where games consist of online titles such as League of Legends.
Compared to a similarly priced Intel i3, AMD promises increased CPU and integrated GPU performance, especially when the program utilizes combined CPU and integrated GPU workloads.
In a recent press release, Intel Corporation CEO Brian Krzanich announced some leadership changes within his company, ranging from Presidents to operational management.
First off is Intel President Renée James, said to be stepping down in order to "pursue an external CEO role" after January 2016. Intel's President of Capital, Arvind Sodhani, will retire in January after 35 years in the technology giant and Wendell Brooks, President of Mergers and Acquisitions, will also manage Intel Capital.
Further to this, Aicha Evans formerly from Intel Communication and Devices Group has been promoted into the Management Committee and Josh Walden will lead all product and research teams involved in creation and deployment of new technology categories. In addition, executives Hermann Eul and Mike Bell will leave after a transition period.