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Leaked documents have recently surfaced online which reveal AMD's 2009 desktop processor plans and also confirms the marketing branding name of the CPUs, Phenom II.
According to the leak, on January 8th 2009, AMD will release its two fastest quad-core 125 watt planned desktop processors, the Phenom II X4 940 Black Edition and 920. The 940 comes clocked at 3GHz and unlocked with 8MB of cache and the 920 comes clocked at 2.8GHz, also with 8MB of cache. Both of these processors will be AM2+ models.
A little later in February, AMD will release its range of quad-core 95 watt processors using the new AM3 socket with support for DDR3 memory. The top dog AM3 processor will be the Phenom II X4 925, which comes clocked at 2.8GHz and with 8MB of cache. There is also the Phenom II X4 910 clocked at 2.6GHz and with 8MB cache. Then we go down to the Phenom II X4 810 that is also clocked at 2.6GHz but only comes with 6MB cache.
Finally, also to be released in February, is the Phenom II X3 triple-core series, including the X3 720 which comes clocked at 2.8GHz and unlocked with 7.5MB of cache. Then there is the X3 710 which comes clocked at 2.6GHz with 7.5MB cache also.
You can get some more details over at this website.
According to this report from TechConnect Magazine, information suggests that AMD's 45nm desktop CPUs, will be known by the 'Phemom II' moniker.
The Sunnyvale, CA based company mentioned this branding information in a press release, heralding the launch of its 45nm Opteron CPU line-up.
Whilst it is unknown whether both AM2+ and AM3 platform CPUs shall share the same brand name, the launch will be another part of AMD's 'Dragon' platform which, is set to arrive in Q1 2009.
The guys over at DigiTimes have some new information on AMD's upcoming 45nm CPU line up. According to the DigiTimes article the new CPUs should hit the market this month with additions to Quad Core line up while Tri and Dual core line up for Socket AM2+ will follow in Q1 next year.
Read more at DigiTimes
AMD is planning to launch two 45nm quad-core desktop CPUs (Deneb) - the Phenom X4 20550 and 20350 for socket AM2+ systems with core frequencies of 3GHz and 2.8GHz, respectively in November this year, according to sources at motherboard makers.
The company will also launch six 45nm triple-core CPUs (Heka and Regor) including 14x00, 12x00 and 1xx00e series. These triple-core CPUs will enter design validation test (DVT) and start shipping in the first quarter next year.
AMD will also launch six high-end 45nm quad-core CPUs (Deneb) and four entry-level (Propus) including 20x00, 18x00, 16x00 and 1xx00e series.
ASUS is working on form and function, according to this report from TechConnect Magazine.
The company's latest LGA775, Socket 1207 (Socket F) and AM2/AM2+ cooling solution, the Axe Square, adopts a striking gold colour palette, enhancing its rather suave appearance.
Cooling capabilities aren't compromised either, apparently. Five copper heatpipes and a 120mm fan solution work together to keep thermals in check.
Thermaltake today took the covers off its latest CPU cooler, the "impeccable" V14Pro, as the marketing folk call it.
At first glance, it looks just like the old V1 cooler but Thermaltake has built on the dual-VTM architecture to create what they think is a faultless CPU cooler.
It doesn't get support at this stage for upcoming Socket 1366 Core i7 processors but it does get some pretty good features such as a silent operating monster 140mm fan, six copper heatpipes, copper base, 98 extended copper fins and it will work with Intel LGA775 and AMD Socket AM2/AM2+ based processors. It also gets fan speed control via the included VR Fan Speed controller which is able to adjust the fan speed from 1000 through to 1600 RPM based on your requirements.
Thermaltake has continued its trend of creating promo videos and upload them to YouTube. They've done the same again here for the V14Pro and you can watch it below.
You can get some more details on the cooler over at this press release.
Becoming green is the new trend for motherboard manufacturers. Along with the likes of GIGABYTE, ASUS and MSI, Foxconn are also focusing on making their boards much more energy efficient using their proprietory 3G technologies which can apparently reduce power consumption by around 68% during general Windows tasks. Thus, the mass manufacturer has put together a new lineup simply dubbed the "GREEN" series.
The first GREEN series motherboard from Foxconn was launched at the end of May, the Intel G31 chipset based G31MG-S. Today brings the arrival of the second GREEN board, based on Intel's new G45 chipset.
The new G45MG is an mATX motherboard with Intels integrated X4500HD graphics core, support for DDR3 and Core 2 Quad/Duo processors. Foxconn's arsenal of power saving technologies are of course incorporated into the boards design and it could be a very fitting choice for a HTPC build.
For further details on the new G45MG motherboard, you can find the official PR here.
Yantai, China, Oct 08 2008 - FOXCONN today launched the second motherboard in its expanding GREEN Series, with the G45MG based on the Intel® G45 chipset.
First demonstrated at CeBIT 2008, the new GREEN Series range affords system builders, resellers and end users the capability to configure highly energy efficient computing solutions for business and home use. Innovative power management technologies combine to reward users with a significantly lower TCO (total cost of ownership) without adversely affecting system performance.
Intel's forthcoming Core i7 lineup of codenamed Nehalem processors are not due to go on sale till the second part of next month.
However, that didn't stop us getting our hands on an engineering sample Core i7 920 processor clocked at 2.66GHz (133MHz x 20) from a secret bunker hidden well underground... :)
Check it out below - we compared it in size to an old dual-core Celeron Socket 775 processor.
That is about all we can say or Intel will really kill us more than they might already.
We first met up with a new Hong Kong based cooler company called GELID in at coffee shop during Computex this year and they only had a few products to show us including some case fans and thermal paste.
Several months later, GELID is finally out with its first CPU cooler and its under its range of silent coolers. The first cooler is called the Silent Spirit and it features what looks to be like a fairly solid quad heatpipe setup and the good news is that it will work with just about any CPU, besides upcoming Socket 1366 Core i7 processors, of course.
You can get the full run-down of the product over at this page.
It was mentioned in August that NVIDIA would most likely be leaving the chipset business, focusing soley on the success of their GPUs. This rumor, however, was quickly dismissed by NVIDIA, with the company denying any such truth to it whilst highlighting the fact that in Q2'08 they held 60% of the AMD chipset market as well as SLI still holding a big market share, thus the 790i being a favorite.
However, fast forward a couple of months and the rumor surfaces once again. The giant company is apparently about to report another quarterly loss and the signs are pointing to the plausibility of such a move. A Pacific Crest analyst says "our checks confirm" NVIDIA has intent to pull out of the chipset market next year.
Dailytech have the full scoop.
Where OCZ were once seen soley as a memory maker, they have been making a solid effort of branching out into other segments of the market for quite a while now with market presence all over the shop; including power supplies, CPU coolers, solid state storage and even do it yourself notebooks.
Advancing on their cooling solutions, they have just moved into the realm of accessories for liquid-cooling systems, introducing today their HydroFlow HF-MK1 CPU waterblock.
"The HydroFlow HF-MK1 targets the highest possible thermal exchange rate between a solid body and the surrounding fluid, while maintaining enough cross sectional area for superior thermal conductance within the fin structure," commented Dr. Michael Schuette, V.P. of Technology Development at OCZ Technology.
"Additionally, the relieved contact area concentrates the pressure on the actual die area of any processor, thereby minimizing the thermal interface material-induced loss in heat dissipation. In short, the HydroFlow epitomizes the recent advances in fluid cooling at an affordable price."
Sunnyvale, CA-September 25, 2008-OCZ Technology Group, Inc. a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today unveiled the "HydroFlow" HF-MK1 Waterblock for superior CPU watercooling. Designed with the highest possible exchange rate between the block and coolant, the HydroFlow can be easily integrated into any enthusiast system and help efficiently lower the processor temperature.