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Recently we reported that Intel Skylake processors were bending under the pressure of some after market coolers, urging a few select manufaturers to issue press releases addressing the issue as a whole.
In another advancement, MSI has announced what it calls 'CPU Guard 1151', designed as a tool that is placed around your socket and "strengthens the corners to withstand more vertical pressure," suitable for Intel 6th Generation processors, including Intel Xeon E3 v5, Core, Pentium and Celeron models.
While MSI claimed in its press release that this new technology "was used during an overclocking event, helping top overclockers push their Skylake CPU to the max, breaking world records," there isn't any substantial information provided about the product just yet. We'll let you know if there is further published information on how you can buy this product for yourself, or if it will come pre-attached to new MSI motherboards.
The Core i7-5960X is a beast of a CPU on its own, but when it's clocked up to 5GHz and beyond, it enters a world of its own. But what about 6GHz, you say? Well, that mountain has been conquered by legendary Australian overclocker 'dinos22'.
Dino 'dinos22' Strkljevic smashed the XTU World Record with his GIGABYTE X99-SOC Champion motherboard and 16GB of DDR4 with timings of 12-14-15-15, and the assistance of LN2 cooling. Dino now sits at the top of the XTU World Record leaderboards and is currently overclocking his heart away in the Country Cup competition as part of Team AU. Strkljevic is the AU Marketing Manager for GIGABYTE, so this is only going to work in both his personal, and professional favor.
Strkljevic has livestreamed his overclocking adventures before, with the most recent livestream tackling a tutorial on the entire overclocking process - from overclocking DDR4 memory, right up to the CPU overclocking itself.
AMD has launched its FX-6330 processor exclusively for customers in the Asia-Pacific region. Based on the 32nm Piledriver architecture, it's aimed at budget minded builders intent on sticking with AM3+, and bridges the gap between the last FX-6000 series CPU in 2012 and the upcoming Zen processors set to arrive late 2016.
The key technical differences between the 6330 and its brethren are the 3.6/4.2 GHz base/boost clock and the silent S3.0 cooler, said to offer 24% more surface area, 34% higher air volume, and steady 39dB noise output. Otherwise, they're identical or nearly so.
We've heard about Intel's incredible new Core i7-6950X processor, which features 10 x CPU cores joined by 10 x Hyper-Threaded cores for a total of 20 threads, but it looks like we'll get a better look at Intel's new CPUs at Computex in June 2016.
Intel's new 14nm Broadwell-E offerings will arrive next year with a slew of different SKUs, ranging from the 12-threaded CPUs to 20-threaded CPU beasts. The Core i7-6950X will lead the pack with 20 threads of 14nm CPU goodness, with a Base frequency of 2GHz, 25MB of cache and support for DDR4. It'll feature a 140W TDP, and up to 3.5GHz on Turbo Boost.
The Core i7-6900K will feature 16 threads at 3.2GHz (3.7GHz Turbo Boost) and 20MB of cache, with the Core i7-6850K featuring 12 threads of CPU power at 3.6GHz (3.8GHz Turbo Boost) with 15MB of cache. The last CPU to be unveiled should be the Core i7-6800K with 12 threads at 3.4GHz (3.6GHz Turbo Boost) with 15MB of cache.
As for pricing, the speculated pricing on the Core i7-6950X is $999, Core i7-6900K for $600, Core i7-6850K for $550, while the Core i7-6800K is set for $450 or so. Expect them to be unveiled at Computex 2016 in June, in Taipei, Taiwan.
Last month we reported on a leak confirming Intel would be releasing Broadwell-E CPUs in 2016 in three flavours of 6-core/12-threads, 8-core/16-threads, and 10-core/20-threads. Now further details have surfaced.
The flagship CPU, as previously mentioned, is the 10-core/20-thread i7 6950X. Now rumors from OC3D (who neglect to cite a source) tell us it features a 14nm process node, 25MB cache, 3.0GHz clock speed, 2400MHz memory clock, and 140W TDP. Furthermore, it comes unlocked, and supports the X99 chipset and DDR4 2400 RAM. As for the rest of the family, see for yourself below.
It seems as though Intel is in some trouble with its new Skylake processors, like the new Core i7-6700K, with reports that they're bending under pressure from third-party CPU coolers.
Some CPU coolers are putting too much pressure on the Skylake-based CPUs and the socket on the motherboard, causing damage. The problem begins when shipping or moving a PC, as well as other general shocks and movement - putting pressure on the mount point, bending the CPU. This can cause the pins on the motherboard to be damaged, which as you can imagine, is not good at all.
Intel talked with Tom's Hardware, confirming that their Skylake processors are thinner than previous designs, adding that they are looking into the issue as we speak. Cooler Master reached out to us today, saying: "Cooler Master has been at the forefront of Cooling Technology since its inception. With the Cooler Master designed heat-sink technology in your coolers, you are getting the best standards of thermal cooler in the world. Every cooler we ship meets Cooler Master's highest standards for providing incredible performance, regardless of the design or model".
Cooler Master added: "We would like to reaffirm our commitment to all our fans and supporters that you can rest assured, all air and liquid cooling products from Cooler Master are not affected by the mounting issue. For a complete list of Cooler Master compatible products for Intel socket LGA 1151 please click here".
There is quite a lot of excitement in the air over AMD's upcoming Zen architecture, but according to the latest rumors, AMD is preparing to launch it sooner than previous reported - as soon as March 2016.
The rumor is coming from Planet3DNow, which said AMD would launch the new flagship AM4 platform in March, much earlier than the previous release window of Q4 2016. The new Zen CPU would run on the AM4 platform, which will support both APUs and CPUs. Better yet, the new AM4 platform will reportedly last much longer than previous platforms, promising support for future AMD processors. The source of Planet3DNow said that "The internal timetable foresees a March 2016 launch".
Furthermore, the new AM4 platform will bring support for Bristol Ridge and Summit Ridge platforms, with the Summit Ridge range being the performance desktop processors under the FX branding on the Zen architecture. The Bristol Ridge range will be the mainstream/desktop mobility APU range, based on the Excavator architecture. Summit Ridge will be powered by the smaller, more power efficient 14nm process with up to 8 x CPU cores while the Bristol Ridge APUs will be made on the current 28nm process as quad-core processors. Both offerings will come in at 95W, while the APU will include GCN GPU cores, and the Summit Ridge offering featuring CPU cores only.
PCgameshardware.de has tested Intel's Skylake CPUs and found because of its thinner substrate versus its previous processors, coolers that apply a lot of pressure to the CPU and socket can damage both.
As of now, just Scythe -- who have confirmed damage to Skylake CPUs with their coolers is possible -- is the only company confirmed as affected by it as of yet. Arctic says it has verified no issues with its coolers, though it advises you don't travel with your cooler mounted; NZXT and EK Water Blocks both have stated their coolers do not experience the reported issues, with the exception of its older gen large tower coolers like the Havik 120/140 from NZXT and the older generation of compatible LGA-1151 water blocks with a "classic, undefined clamping force type mounting mechanism". These are compatible with Skylake CPUs, but both companies recommend erring on the side of caution and not using them with Skylake.
While Apple likes to downplay specifications and focus on real-world results, enthusiasts will be enthusiasts. Case in point: patent and technology partner company Chipworks has again broken down an Apple processor and spilled the juicy specifications. This time it's the A9X chip -- pictured below -- present on the iPad Pro.
The A9X features a 12-cluster GPU (likely a semi-custom Apple implementation of the Series 7XT) and two CPU cores. It doesn't feature the level-three cache memory found in the A9, which Fool attributes to the bigger and better chip technology, rendering the old memory unnecessary, or at least not worthwhile.
AMD has been teasing its Zen architecture for a little while now, but the new Zen-based APUs will be packing quite the performance punch when they drop in 2017.
It's said that we're looking at Xbox One and PS4 level performance, even when the Zen APU is found inside of notebooks - and personally, I think we might see it in VR headsets, too. Another exciting part of this news is that there's a rumor that AMD is working on a Zen APU that would feature High Bandwidth Memory, or HBM.
If AMD did this, it could really begin to make a dent in CPU sales for Intel, as people could choose a semi-powerful APU with HBM over a traditional CPU from Intel and DDR4 RAM.