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AMD's Athlon and Sempron lines are back and now in APU form. This morning AMD announced the launch of its new quad-core and dual-core Kabini APUs, and the new Socket AM1 platform. Kabini brings back the legendary Athlon and Sempron brands and pairs them up with AMD's award-winning Graphics Core Next architecture and Jaguar CPU cores to form a flexible and powerful APU platform.
"AMD consistently builds on its industry leading technology by continuing to offer a diversified product stack which is proven today with the availability ofthe AM1 platform with "sockete" Sempron and Athlon APUs designed for the mainstream market," said Bernd Lienhard, corporate vice president and general manager, Client Business Unit, AMD. "With quad-core performance and AMD Radeon graphics the AM1 platform is an affordable solution that provides great flexibility due to an infrastructure built to deliver a multitude of options to our end users and system builders."
Qualcomm already power countless smart devices, but the competition is heating up with Intel, NVIDIA, Apple, Samsung and much more wanting to change the game with their own devices.
The company behind the Snapdragon range of system-on-chips (SoC) has already announced its 64-bit capable Snapdragon 810 and 808 processors, which are high performance hardware designed for the best of the best Android-powered devices. Both chips are baked on a 20nm process, meaning they will use less power, will be lighter and smaller, and deliver more performance.
The eight-core Snapdragon 810 is the star of the show, featuring four Cortex-A57 cores for power-hungry tasks, while four lower-power Cortex-A53 cores will be used for everything else. We will have LPDDR4 RAM show up for the party, as well as 4K display support. There'll also be voice activation and dual Image Signal Processors for better imaging.
Today, at the Electronics Engineering Live! Conference and Expo in San Jose, CA, Silicon Motion Technology Corporation (NasdaqGS: SIMO), manufacturer of NAND flash controllers for solid state storage devices, will announce new additions to its Ferri portfolio with single-package Ferri-eMMC™ and ultra-high performance SATA 6Gb/s FerriSSD embedded memory solutions.
The Ferri-eMMC is available in two flavors, the SM667 for applications that require up to 30K P/E cycles and the SM661 for applications that do not require such high reliability. The new controllers are designed for a wide range of embedded applications and provide for more flexible PCB design and low-cost manufacturing. They are available in configurations ranging from 2GB to 32GB.
The new SATA 6Gb/s Ferri-SSD embedded memory series also has two models, the SM659 and SM619. Embedded DRAM extends the SSD life and delivers best-in-class performance of up to 80K random IOPs. These solutions leverage Silicon Motion technologies including PowerShield, DataPhoenix, Intelligent Scan DataRefresh, SSDLifeGuard health-monitoring, and remote firmware updates. They are available in 8GB to 64GB configurations.
Reports have indicated that Intel confirmed its specifications for the upcoming 9-Series chipsets for LGA-1150 and LGA 2011-E HEDT platform- H97, Z97 and Intel X99 desktop chipsets. Intel Z97 and H97 chipsets are available for LGA 1150 package, whereas the Z97 will be paired with current generation 'Haswell Processors, followed by its refreshed versions and 'Devil's Canyon' processor families. Intel X99 will be paired with the upcoming 'Haswell-E' HEDT platform with LGA 2011-3 package.
Motherboards with Intel Z97 chipsets will have up to PCI-Express 3.0 slots wired to the CPU, and have configurations of x16/NC/NC, x8/x8/NC and x8/x4/x4 for GPU setups. What should be noted that unlike the previous generation, H97 will support overclocking, though it will not have the same PCIe configuration that Z97 allows. Along with this, both chips will have up to 8 PCI-e 2.0 lanes for series of onboard devices and 14 USB ports, out of which 6 are for USB 3.0.
Both the H and B version of 9 series chips will allow PCI-e M.2 storage drives that provides 66.6% more bandwidth compared to SATA 6Gb/s standard. This should accelerate manufacturer's plans to release a series of high-performance SSDs by 2014- 2015. These two chipsets also will allow RAID, AHCI and Rapid Storage Technology. Intel Z97 will have Dynamic Storage Accelerator (DST)whereas Intel H97 will have Small Business Advantage (SBA) feature.
GTC 2014 - NVIDIA has just unveiled its next-generation mobile system-on-a-chip (SoC), Erista. What makes Erista an important step, is the incredible power that NVIDIA have baked into the mobile chip.
Erista isn't coming until 2015, but it will be based on the company's Maxwell architecture, which is the technology powering its next-gen GPUs on the desktop. Right now, we have Tegra K1 right around the corner, which is based on the Kepler architecture, and has around 40 GFLOPS of performance, but Erista drives that up to around 65-70 GFLOPS. We should hopefully hear more on that as 2014 comes to a close.
Intel unveiled its plans for its entire lineup of desktop processors and All-in-One PC systems as the company believes that desktop PC is getting stronger. The company started by pointing some facts observed during 2013 and 2014, which some people may not (or may) find it surprising.
According to company's statements, Intel's desktop processor volume was up by 7$ on a Year-on-Year basis as per Q4 2013's results. The following month, Intel observed that they've made an All-time record for its Core i5 and Core i7 unit shipments, as Brian Krzanich in January 2014.
This should explain why Intel accelerated its plans to release its Haswell-E lineups and Intel X99 lineups well before than previously expected. Since the company sees a certain upward growth in the DIY PC and enthusiast market, it only makes sense to offer the best they have as quick as possible, provided its all ready for retail.
It looks like we could expect Intel to surprise the world by releasing its Haswell-E processors at Computex in Taipei, in just a few months time. The chipmaker is preparing its new Core i7 Extreme CPU, as well as its X99 chipset.
Intel's Haswell-E processor will be the company's first desktop processor to feature eight cores, for a total of 16 threads. We should also expect 20MB of L3 cache, quad-channel DDR4 memory support, Turbo Boost 2 technology, an 40 integrated PCI Express 3.0 lanes. The new Haswell-E CPUs will be made on Intel's 22nm process.
The new Haswell-E processors will arrive as the 5000-series, compatible only with the X99 chipset and LGA2011-3 socket. The platform is being targeted toward enthusiasts, so we should see some exotic motherboards unveiled at Computex by the usual players: ASUS, GIGABYTE, ASRock and so forth. The new X99 chipset should deliver some great new features and technologies, too.
It looks like AMD is forging through with plans to dominate the desktop in emerging markets, where the chipmaker has just announced its new AM1 chipset. The AM1 chipset is a system-on-chip (SoC) for the developing market.
The AM1 part is a sibling of the Kabini family of chips, something that AMD launched last year with both dual- and quad-core CPUs and GPUs on the same chipset. This is similar to what was baked into Sony's PlayStation 4, and Microsoft's Xbox One. Kabini was developed mostly for portables, but AMD wants to see the new AM1 take on the low-cost, expandable desktop market.
Where AMD has it in the bag is the price, which starts at just $60 for the chipset and motherboard combined. We should see AM1 limited to just 25W maximum power draw from the chipset, but a restriction of PCIe 2.0. AMD has taken some swings at Intel, comparing it to Intel's Bay Trail platform, which AMD says AM1 beats with higher memory speeds, 16GB memory support, an upgradeable socket, and Windows XP support. AMD declares: "Avoid a dead-end platform and choose AMD".
MWC 2104 - SoC's centered around smartphones were a big topic at this years Mobile World Congress with big hitters like Qualcomm and Broadcom announcing several new chips designed to carry mobile communications into the next-generation. Samsung was not to be left out of the party either and has announced two new additions to its Exynos line of mobile SoCs.
The Samsung Exynos 5 Octa 5422 is an updated version of the Exynos 5 Octa 5420. The SoC features four ARM Cortex-A15 cores and four ARM Cortex-A7 cores in what is known as a big.LITTLE configurations. Clock speeds are set to 2.1GHz and 1.5GHz respectively, and the SoC supports heterogeneous multi-processing just like its predecessor. This means that the computationally intensive task are handled by the ARM Cortex A-15 cores while the low-level duties are passed off to the lighter Cortex A-7 cores. Additionally a dual-channel 32-bit LPDDR3-1866 memory controller is featured as well as a Mali-T628 MP6 GPU. An integrated modem is not present in the SoC though, which means manufacturers will have to look to solutions such as Intel's recently-announced XMM 7160 chip for LTE connectivity.
Samsung also unveiled the new Exynos 5 Hexa 5260, a six-core SoC which also utilizes a big.LITTLE configuration. Two ARM Cortex-A15 cores are paired up with four ARM Cortex-A7 cores with clock speeds at 1.7GHz and 1.3GHz respectively. The 5260 also features a 32-bit LPDDR3-1600 memory controller and HMP support, making it a very tempting processor for applications where low-power draw is ideal. Word on the street is that the Exynos 5 Hexa 5260 will make its way into the Galaxy Note 3 Neo which is slated for a spring launch.
MWC 2014 - In the sea of Mobile World Congress 2014 news this week, Qualcomm unleashed two new system-on-chips, the new Snapdragon 600 and 615. Both of these new SoCs feature ARMv8 64-bit processing technology, 4G/LTE connectivity and refreshed Adreno graphics.
The new processors will see four (at up to 1.8GHz) and eight (four at 1GHz, four at 1.8GHz) ARM Cortex-A53 cores, respectively. Both SoCs will feature refreshed Adreno 405 graphics, which supports up-to-date graphics APIs such as DirectX 11.2, and OpenGL ES 3.0, full profile OpenCL 1.1 and hardware accelerated geometry shading and hardware tessellation.
We also have an LPDDR3 memory controller, new display controller which supports up to 2560x2048 displays, improved multimedia processors (with H.265 codec support, Wi-Fi 802.11ac controller, Bluetooth 4.1, GPS/GLONASS, Gobi 4G/LTE cat 4 modem which supports speeds of up to 150Mb/s. Murthy Renduchintala, executive vice president of Qualcomm Technologies said: "Qualcomm Technologies is redefining the user experience for high-end mobile devices by amassing the unparalleled trilogy of an industry-leading LTE modem, 64-bit multi-core processing, and superior multimedia".