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We aren't even half way through the year but we're hearing about what Intel will be releasing in the second half of 2016, according to a new leaked roadmap from the chipmaker.
Intel is expected to launch the Skylake architecture during Computex 2015 next month, something that will include the flagship Core i7-6700K processor. But what about 2016? Well, we are looking at Intel moving into their first 10nm processors with the new Cannonlake architecture, which should be an extremely low-power CPU, something that is going to really take flight in Ultrabooks. The mobile parts will come out in 10nm first, with desktop CPUs made on the 10nm arriving sometime in 2017.
Moving onto the HEDT side of things, Intel will release its next-gen High-End Desktop processor in Q3 2016 in the form of Skylake-E. Before that, we should expect Broadwell-E in Q1 2016, which will work on the current LGA 2011-3 socket. The new Skylake-E architecture will launch sometime in the second half of 2016.
Earlier this week, Samsung broke ground on its new semiconductor fabrication facility at the Godeok Industrial Complex in Pyeongtaek, Korea.
The electronics company is the No. 2 chip maker based on revenue, and it's unknown what will be specifically manufactured at the facility. Some Korean news sources say DRAM memory chips will be the focus of manufacturing, with space allowed for mobile processors depending on global demand.
The new industrial complex will have more than $14 billion invested by Samsung, which is the largest amount it has invested in a single facility.
As pointed out by TechPowerUp, "AMD is planning to play a neat branding game with Intel."
You may have noticed with the upcoming series of CPUs and APUs to be released in 2016 by AMD that there has been a branding focus switch towards naming them as the "6th Generation," just as you commonly see with Intel's new processor releases.
This change is said to be due to ease of consumer clarity and the reported fact that retail channels much prefer this method. Keeping track of which generation of processor you own, sell or build into a system is generally much easier then remembering how old your 'Piledriver' chip may be.
At an Investor Day presentation, AMD took the time to discuss its new 'Zen' CPU core architecture and made sure to mention a large performance increase on the horizon.
In these talks, AMD announced that this new chip will offer a 40 percent increase in instructions per clock (IPC) over its 'Excavator' CPU core architecture, making a massive increase in performance.
Alongside this, 'Zen' will offer simultaneous multi-threading which TechPowerUp claims "will leverage the 14 nm FinFET process." We will see these chips put to use in desktop applications at first, scheduled for a 2016 launch.
It has further been established that AMD is looking towards unifying the CPU and APU into one socket, labeling it as the AM4 and we should also expect a further release of the 7th generation of A-series APUs in the near future.
Intel has just launched its new line of Haswell-EX Xeon CPUs, which include up to 36 threads (with the 18-core model), with up to 45MB of L3 cache, depending on the model.
The flagship Xeon E7-8890 V4 processor has 18 cores (36 threads), 45MB of L3 cache (LLC) and clock speeds that float between 2.5GHz and 3.3GHz in AVX workloads, and between 2.1GHz and 3.3GHz normally. This Haswell-EX powered Xeon CPU has a massive 165W TDP, packing some 5.6 billion transistors. All of this results in a wallet-busting price of $7175 or so.
The new Haswell-EX powered Xeon platform can handle up to 24 DIMMs per socket of either DDR3 or DDR4, with a full 8S server rack capable of consuming up to 12TB of DDR4 RAM. These new systems can handle up to 32 sockets, with 8-socket systems capable of taking 12TB of RAM, too.
Intel's Haswell-EX Xeon E7 v3 processors might culminate with the $7175 version in the E7-8890 v3, but it all starts with the 'entry-level' E7-4809 v3 which features 8 cores/16 threads, 2GHz clock speed, and 20MB of LLC cache.
As we begin to learn more about Intel's upcoming Skylake microarchitecture, the new 14nm-based chips are becoming more clear. We're now hearing details on the rumored Core i5-6600K and Core i7-6700K.
Starting with the Core i5-6600K which will have a total of four cores and no HT support, 6MB cache, a 3.5GHz clock speed (3.9GHz with Boost), 1600/2133MHz DDR3/DDR4 RAM support, Intel HD Graphics 5000 and a 95W TDP. The Core i7-6700K will feature four cores with four Hyper-Threaded cores, 8MB of cache, a 4GHz clock speed (4.2GHz with Boost), 1600/2133MHz DDR3/DDR4 support, Intel HD Graphics 5000 and the same 95W TDP. Both processors will slot right into the new LGA 1151 socket.
The rumored specifications are just that: rumors, especially considering the TDP sitting at 95W. We should expect some decent headroom for overclocking, with 4.5GHz being very easy for the Core i7-6700K to hit. WCCFTech is reporting that they expect something "major" with Skylake, and that it won't just be "another Haswell". We should learn more about Skylake as we get closer to Computex in the first week of June.
The first few details of Intel's upcoming sixth generation Core processor have arrived, with Skylake shaping up nicely so far. Skylake is coming this year, but we haven't known many details on the new architecture until now.
WCCFTech has found some slides, with PC Perspective going over them and showing us that Intel's codename Skylake will arrive as the LGA 1151 socket. We will be greeted with three new chipsets, the Z170, H170 and H110, too. Intel has built Skylake on its 14nm process, which is the same node that Broadwell was made on, but it will feature a new microarchitecture for both the IA cores, and the graphics system.
Skylake will have support for both DDR3L and DDR4 RAM, with enthusiast systems pushing toward the latter. We should see an enthusiast focused 95W quad-core SKUs that will be capable of overclocking, as well as "enhanced" BCLK overclocking with Intel using the term "full range" which means we might not see a wall of 125MHz.
Intel has provided more details on its upcoming Xeon Phi line of processors, which will see up to 72 cores on a single processor, thanks to the Silvermont architecture. Not only that, but we can expect up to 384GB of DDR4, too.
Not only that, but the current prototype of the Xeon Phi coprocessor is capable of handling up to 32 cores, with each core capable of handling four threads for a total of 128 threads. Currently, we 8-core processors with 16 threads in total thanks to Hyper-Threading on the consumer side of the market. These new Xeon Phi processors would handle up to 36MB of shared L2 cache, and up to 16GB of the new stacked High Bandwidth Memory (HBM).
All in all, we can expect a six-channel DDR4 memory controller that can handle 2400MHz, and up to 384GB of DDR4 RAM. This is up from the quad-channel memory architecture we know and love with the X99 chipset from Intel, and the current flagship processor: the Core i7-5960X. It's interesting to note that we're seeing Intel move into HBM quickly.
The Silvermont architecture has Intel being able to promise 300% more single threaded performance over the previous generation of Xeon Phi co-processors, and up to 300% better power efficiency.
Samsung is already pushing out 14nm technology, using its own Galaxy S6 and Galaxy S6 edge smartphones to demonstrate its impressive new fabrication technology. But most don't know that the South Korean electronics giant has partnered with GlobalFoundries, with the latter now spinning up its production of 14nm technology.
Mubadala Development Co. is an Abu Dhabi-based investment and development company that owns GlobalFoundries, with the company releasing a statement in regards to its 14nm production. Mubadala said: "GlobalFoundries announced a strategic collaboration with Samsung to deliver capacity at 14nm, one of the industry's most advanced nodes, as Fab 8 in Malta, New York began ramping production for customers".
Samsung developed both the 14LPE (low-power early) and 14LPP (low-power plus) technologies, licensing them to GlobalFoundries. Both of the manufacturing processes use FinFET transistors, but they still fall back on back-end-of-line (BEOL) interconnects which are fabricated on the 20nm node. Both fabrication technologies don't radically reduce costs of the chips compared to the previous-gen node, but they do provide a nice 20% boost in performance at the same power usage, or reduce power consumption by up to 35% without a performance hit.
It looks like AMD has some interesting things coming in 2016, with the current rumor is that its next-gen APU would arrive as a 16-core processor based on its Zen architecture, as well as a "Greenland" GPU with HBM memory.
The new APU will replace the Godaveri platform which we were introduced to with the Carrizo APU, with the Carizzo-based notebooks arriving in the next couple of months, but most likely at Computex 2015 in June. The new Zen APU would feature quad-channel DDR4 support, up to 16 processor cores based on the Zen architecture, and the HBM-powered Greenland GPU.
We should expect Greenland to be based on the Fiji architecture, which will be powering AMD's upcoming flagship video card: the Radeon R9 390X. We don't know if AMD will be using HBM1 or HBM2 on the Zen APU, but with the R9 390X using HBM1, we should expect AMD to quickly shift to HBM2 sometime in 2016.