Frostytech, has had the benefit of receiving the first Intel LGA1366 socket heatsinks, from an unnamed source, and has gone about sharing some information about the cooling requirements for LGA775's successor.
Firstly, it is ascertained that as Nehalem microarchitecure derived CPUs have different power specifications and, that the mounting holes on the motherboard are spaced further apart, obviously due to the larger socket, current LGA775 heatsinks will not complement LGA1366 solutions.
This however, isn't to say that providers may not be working on adapters for existing products to allow for their use with LGA1366 motherboards but, due to the IHS surface area of upcoming CPUs being larger than LGA775 CPUs, we may not assume that such adapters would automatically be feasible, or indeed, provide the best performance.
Intel's own reference LGA1366 cooling solutions, will continue using plastic push-pin mounting mechanisms, yet some more elaborate workings are in the pipeline from third party providers.
Anyhow, as we have previously expressed, Intel's Nehalem vision will certainly provide enthusiasts with a new set of rules and, possible challenges, to extract the best performance possible.
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