OCZ have just introduced some new thermal goop for enthusiasts which they call "Freeze". They claim it is quite unique to others on the market; using a proprietary formula it is said to be capable of dropping temperatures by as much as ten percent compared to your typical high-end silver-based compounds.
Sunnyvale, CA-December 3, 2007-OCZ Technology Group, Inc. a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today released a unique thermal compound, Freeze, to their line of premium cooling products. Using the latest innovations in thermal management compounds, OCZ Freeze has higher heat conductivity potential than leading silver-based thermal pastes on the market today, offering an ultra-reliable solution for all computing environments.
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