OCZ have improved upon their existing "Reaper" HPC (Heat-pipe Conduit) cooler found across high-end Reaper series memory modules, introducing the new "ReaperX" series with an improved cooler design that allows for even better heat transfer with its dual heatpipe arrangement.
"ReaperX HPC (Heat Pipe Conduit) modules offload heat with extreme efficiency due to a new dual copper heat pipe design. Each memory chip is in direct contact with a thermo-conductive pipe that guides the performance robbing heat away from key memory components and quickly dissipates it through the aluminum fin array."
Coinciding with the launch of this new series from OCZ is the first ReaperX HPC memory kit to to show up, a DDR2-800 4GB kit specified to run with timings of 4-4-3-15 @ 2.1v.
For further information you can find OCZ's press release here.
"The new ReaperX series once again raises the memory bar for desktop computers by combining a high density configuration with Enhanced Bandwidth Technology and an innovative heat pipe design heat spreader," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "The result is the new OCZ ReaperX, representing the ongoing commitment at OCZ Technology to promote ultra low latency, high frequency modules featuring standard and EPP operation modes as part of our leading role in the industry."
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